公开(公告)号：US08249402B2

公开(公告)日：2012-08-21

申请号：US12697646

申请日：2010-02-01

申请人： Motoo Asai ,  Hiroaki Kodama ,  Kazuhito Yamada

发明人： Motoo Asai ,  Hiroaki Kodama ,  Kazuhito Yamada

IPC分类号： G02B6/12 ,  G02B6/10

CPC分类号： G02B6/43 ,  H01L2224/16225 ,  H05K1/0274 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/061

摘要： A multilayer printed circuit board according to the present invention is a multilayer printed circuit board where a plurality of insulating layers, a conductor circuit and an optical circuit are formed and layered and an optical element is mounted, wherein the above described optical circuit is formed between the above described insulating layers.

摘要翻译： 根据本发明的多层印刷电路板是多层印刷电路板，其中形成多个绝缘层，导体电路和光电路并层叠并安装光学元件，其中上述光电路形成在 上述绝缘层。

公开(公告)号：US07526152B2

公开(公告)日：2009-04-28

申请号：US11964761

申请日：2007-12-27

申请人： Motoo Asai ,  Hiroaki Kodama

发明人： Motoo Asai ,  Hiroaki Kodama

IPC分类号： G02B6/14

CPC分类号： G02B6/4204 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/43 ,  H01L31/0203 ,  H01L31/02327 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12041 ,  H05K1/0274 ,  H05K3/4602 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention aims to provide a substrate for mounting an IC chip, on which an optical signal passing region is formed and which can suppress a transmission loss in an optical signal and transmit an optical signal more positively with high reliability. The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, in which a conductor circuit and an insulating layer are laminated in alternate fashion and in repetition on both faces of a substrate and an optical element is mounted on the substrate. Herein, the substrate for mounting an IC chip includes an optical signal passing region, and a microlens arranged on an end portion of the optical signal passing region on the opposite side from the optical element.

摘要翻译： 本发明的目的在于提供一种用于安装IC芯片的基板，其上形成有光信号通过区域，并且可以抑制光信号中的传输损耗并且以高可靠性更积极地发送光信号。 根据本发明的用于安装IC芯片的基板是用于安装IC芯片的基板，其中导体电路和绝缘层在基板的两个表面上以交替的方式并且重复地层叠并且安装有光学元件 在基板上。 这里，用于安装IC芯片的基板包括光信号通过区域和布置在与光学元件相反侧的光信号通过区域的端部上的微透镜。

公开(公告)号：US20060012967A1

公开(公告)日：2006-01-19

申请号：US10509899

申请日：2003-03-28

申请人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

发明人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

IPC分类号： H05K1/18

CPC分类号： G02B6/43 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K1/0274 ,  H05K3/28 ,  H05K3/4602 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the optical component, which is excellent in electric signal transmission reliability and which can transmit optical signal through an optical path for transmitting optical signal. The substrate for mounting an IC chip of the present invention is a substrate for mounting an IC chip comprising: a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition; a solder resist layer formed as an outermost layer; and an optical element mounted thereto, wherein an optical path for transmitting optical signal, which penetrates the substrate for mounting an IC chip, is disposed.

摘要翻译： 本发明的目的是提供一种用于安装IC芯片的基板，IC芯片是用于光通信的部件，其具有一体地设置在其上的IC芯片和光学部件，其可以确保IC芯片和光学部件之间的短距离， 其电信号传输可靠性优异，可以通过用于发送光信号的光路传输光信号。 用于安装本发明的IC芯片的基板是用于安装IC芯片的基板，其包括：基板，并且在其两个表面上串联构成导体电路和层间绝缘层，并且重复; 形成为最外层的阻焊层; 以及安装在其上的光学元件，其中设置用于透射光信号的光路，其穿透用于安装IC芯片的基板。

公开(公告)号：US08238700B2

公开(公告)日：2012-08-07

申请号：US12757418

申请日：2010-04-09

申请人： Motoo Asai ,  Hiroaki Kodama ,  Kazuhito Yamada

发明人： Motoo Asai ,  Hiroaki Kodama ,  Kazuhito Yamada

IPC分类号： G02B6/12 ,  G02B6/10

CPC分类号： G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/09536

摘要： A multilayer printed circuit board including insulating layers, conductor circuits formed between the insulating layers, and optical circuits formed between the insulating layers and including a first optical circuit. The first optical circuit is positioned on a first outermost insulating layer of the insulating layers, and the insulating layers, conductor circuits and optical circuits are layered to form a multilayer structure having a first surface and a second surface on an opposite side of the first surface such that the multilayer structure is structured to mount optical elements on the first surface and second surface of the multilayer structure, respectively.

摘要翻译： 一种多层印刷电路板，包括绝缘层，形成在绝缘层之间的导体电路以及形成在绝缘层之间并包括第一光学电路的光电路。 第一光电路位于绝缘层的第一绝缘绝缘层上，绝缘层，导体电路和光电路被层叠形成具有第一表面和第二表面的第一表面的第二表面的多层结构 使得多层结构被分别安装在多层结构的第一表面和第二表面上的光学元件。

公开(公告)号：US08120040B2

公开(公告)日：2012-02-21

申请号：US12785786

申请日：2010-05-24

申请人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

发明人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

IPC分类号： H01L29/04

CPC分类号： G02B6/43 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K1/0274 ,  H05K3/28 ,  H05K3/4602 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.

摘要翻译： 一种用于光通信的装置，包括用于安装IC芯片的基板和多层印刷电路板。 在用于安装IC芯片的基板中形成有用于透射用于安装IC芯片的基板的用于透射光信号的光路。

公开(公告)号：US20060263003A1

公开(公告)日：2006-11-23

申请号：US11402084

申请日：2006-04-12

申请人： Motoo Asai ,  Hiroaki Kodama

发明人： Motoo Asai ,  Hiroaki Kodama

IPC分类号： G02B6/12

CPC分类号： G02B6/4204 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/43 ,  H01L31/0203 ,  H01L31/02327 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12041 ,  H05K1/0274 ,  H05K3/4602 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention aims to provide a substrate for mounting an IC chip, on which an optical signal passing region is formed and which can suppress a transmission loss in an optical signal and transmit an optical signal more positively with high reliability. The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, in which a conductor circuit and an insulating layer are laminated in alternate fashion and in repetition on both faces of a substrate and an optical element is mounted on the substrate. Herein, the substrate for mounting an IC chip includes an optical signal passing region, and a microlens arranged on an end portion of the optical signal passing region on the opposite side from the optical element.

公开(公告)号：US20100232744A1

公开(公告)日：2010-09-16

申请号：US12785786

申请日：2010-05-24

申请人： Motoo ASAI ,  Hiroaki Kodama ,  Toyoaki Tanaka

发明人： Motoo ASAI ,  Hiroaki Kodama ,  Toyoaki Tanaka

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K1/0274 ,  H05K3/28 ,  H05K3/4602 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.

摘要翻译： 一种用于光通信的装置，包括用于安装IC芯片的基板和多层印刷电路板。 在用于安装IC芯片的基板中形成有用于透射用于安装IC芯片的基板的用于透射光信号的光路。

公开(公告)号：US07437030B2

公开(公告)日：2008-10-14

申请号：US11402084

申请日：2006-04-12

申请人： Motoo Asai ,  Hiroaki Kodama

发明人： Motoo Asai ,  Hiroaki Kodama

IPC分类号： G02B6/00

CPC分类号： G02B6/4204 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/43 ,  H01L31/0203 ,  H01L31/02327 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12041 ,  H05K1/0274 ,  H05K3/4602 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention aims to provide a substrate for mounting an IC chip, on which an optical signal passing region is formed and which can suppress a transmission loss in an optical signal and transmit an optical signal more positively with high reliability. The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, in which a conductor circuit and an insulating layer are laminated in alternate fashion and in repetition on both faces of a substrate and an optical element is mounted on the substrate. Herein, the substrate for mounting an IC chip includes an optical signal passing region, and a microlens arranged on an end portion of the optical signal passing region on the opposite side from the optical element.

摘要翻译： 本发明的目的在于提供一种用于安装IC芯片的基板，其上形成有光信号通过区域，并且可以抑制光信号中的传输损耗并且以高可靠性更积极地发送光信号。 根据本发明的用于安装IC芯片的基板是用于安装IC芯片的基板，其中导体电路和绝缘层在基板的两个表面上以交替的方式并且重复地层叠并且安装有光学元件 在基板上。 这里，用于安装IC芯片的基板包括光信号通过区域和布置在与光学元件相反侧的光信号通过区域的端部上的微透镜。

公开(公告)号：US20080170819A1

公开(公告)日：2008-07-17

申请号：US11623923

申请日：2007-01-17

申请人： Hiroaki Kodama ,  Motoo Asai

发明人： Hiroaki Kodama ,  Motoo Asai

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  G02B6/138 ,  G02B6/4204 ,  G02B6/4246 ,  H01L27/14618 ,  H01L27/14627 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An optical element of the present invention comprises: one or a plurality of unit elements having a plurality of external electrodes formed on one main surface thereof, wherein upon taking the one main surface of the unit elements in a plan view, the plurality of external electrodes are locally formed in a first region of two regions of a planar shape of the main surface, the two region formed by equally dividing the planar shape with a center line.

摘要翻译： 本发明的光学元件包括：一个或多个单元元件，其具有形成在其一个主表面上的多个外部电极，其中，在将单元元件的一个主表面放置在平面图中时，多个外部电极 局部地形成在主表面的平面形状的两个区域的第一区域中，该两个区域通过将平面形状等分成中心线而形成。

公开(公告)号：US07995880B2

公开(公告)日：2011-08-09

申请号：US12855207

申请日：2010-08-12

申请人： Hiroaki Kodama ,  Motoo Asai ,  Kazuhito Yamada

发明人： Hiroaki Kodama ,  Motoo Asai ,  Kazuhito Yamada

IPC分类号： G02B6/12 ,  G02B6/42

CPC分类号： G02B6/4214 ,  G02B6/42 ,  G02B6/43 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/00014 ,  H05K1/0274 ,  H05K3/4602 ,  H01L2224/05599

摘要： A device for optical communication including a conductor circuit and an insulating layer formed and laminated, an optical circuit and an optical path for transmitting an optical signal, and an optical element or a package substrate on which an optical element is mounted. An optical path converting member is disposed at the optical path for transmitting an optical signal so as to transmit an optical signal between the optical element and the optical circuit. The optical path converting member comprises a lens and an optical path conversion mirror having an entrance surface, an exit surface and a reflection surface. The lens is provided at either the entrance surface or the exit surface on the side facing the optical circuit.

摘要翻译： 一种用于光通信的装置，包括形成和层叠的导体电路和绝缘层，用于发送光信号的光路和光路，以及安装有光学元件的光学元件或封装基板。 光路转换构件设置在用于发送光信号的光路上，以在光学元件和光电路之间传输光信号。 光路转换部件包括具有入射面，出射面和反射面的透镜和光路转换镜。 透镜设置在面向光电路的一侧的入射面或出射面上。