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    Process for producing quick-curing phenolic resin
    1.
    发明授权
    Process for producing quick-curing phenolic resin 失效
    快速固化酚醛树脂生产工艺

    公开(公告)号：US4299947A

    公开(公告)日：1981-11-10

    申请号：US158559

    申请日：1980-06-11

    申请人： Motoyuki Nanjo ,  Tsutomu Watanabe ,  Shigeru Koshibe ,  Keiji Azuma

    发明人： Motoyuki Nanjo ,  Tsutomu Watanabe ,  Shigeru Koshibe ,  Keiji Azuma

    IPC分类号： C08G8/04 ,  C08G8/10

    CPC分类号： C08G8/04

    摘要： A high-ortho phenolic novolac resin having excellent curability, heat stability and flowability can be produced safely at low cost by a process which comprises reacting a phenol and an aldehyde at a temperature of more than 100.degree. C. with (A) a catalyst effective for the addition reaction selected from the salts of divalent metals in combination with (B) a catalyst effective for the condensation reaction, or comprises reacting a phenol and an aldehyde under reflux in the presence of the catalyst (A), adding an acid to adjust the pH to 1-5, removing water under reduced pressure and then subjecting the product to reaction at a temperature of more than 100.degree. C. This process enables the addition reaction and the condensation reaction to proceed with a good balance, can solve problems arising in the prior process such as gelation, low yield and the like, and can produce a high-ortho type phenolic novolac resin safely at low cost. Accordingly, this process is quite advantageous in industry.

    摘要翻译： 可以通过包括使苯酚和醛在大于100℃的温度下反应的方法以低成本安全地制备具有优异固化性，热稳定性和流动性的高邻苯酚酚醛清漆树脂（A）催化剂有效 对于选自二价金属的盐的加成反应与（B）对于缩合反应有效的催化剂组合，或者包括在催化剂（A）的存在下，在回流下使苯酚和醛反应，加入酸来调节 pH至1-5，减压除水，然后在大于100℃的温度下使产物反应。该方法使加成反应和缩合反应进行良好的平衡，可以解决产生的问题 在以前的方法如凝胶化，低产率等中，可以以低成本安全地生产高邻苯酚酚醛清漆树脂。 因此，这个过程在工业上是相当有利的。

    Method of producing copper-clad laminated board
    2.
    发明授权
    Method of producing copper-clad laminated board 失效
    生产覆铜层压板的方法

    公开(公告)号：US5286330A

    公开(公告)日：1994-02-15

    申请号：US877833

    申请日：1992-05-01

    申请人： Keiji Azuma ,  Kimikazu Katoh ,  Ryoichi Oguro

    发明人： Keiji Azuma ,  Kimikazu Katoh ,  Ryoichi Oguro

    IPC分类号： B29C43/18 ,  B29C33/68 ,  B29C43/20 ,  B29C43/32 ,  B29K105/08 ,  B29L9/00 ,  B29L31/34 ,  B32B15/08 ,  H05K1/03 ,  H05K3/02 ,  B65C9/25

    CPC分类号： B29C33/68 ,  B32B37/26 ,  H05K3/022 ,  B29L2031/3425 ,  H05K1/0366 ,  H05K2203/068 ,  Y10T29/49124

    摘要： A method for preparing a copper-clad laminated board for a printed circuit board which comprises: (a) preparing a prepreg by permeating a thermosetting resin into a fabric and then drying the resulting material to a half-hardened state, (b) laminating a both-side roughened copper foil on both sides or one side of the prepreg or a plurality of prepregs bonded together, (c) placing the resulting laminate from step (b) between both press plates of a press machine, (d) placing a polyamide film having a melting point equal to or higher than 170.degree. C. between the exposed side of the both-side roughened copper foil of the laminate and a press plate, (e) pressing the laminate with the press plates of the press machine at a temperature of 170.degree. C. or higher, a pressure of 10 kgf/cm.sup.2 or higher for a time of 60 minutes or longer, (f) separating the laminate from the press machine and (g) peeling the polyamide film from the laminate to obtain the copper-clad laminated board. The copper-clad laminated board can be used for a printed circuit board.

    摘要翻译： 一种制备用于印刷电路板的覆铜层压板的方法，包括：（a）通过将热固性树脂渗透到织物中然后将所得材料干燥至半硬化状态来制备预浸料，（b）将 （c）将来自步骤（b）的所得层压体放置在压制机的两个压板之间，（d）放置聚酰胺（b），将聚酰胺 在层叠体的两面粗糙化铜箔的露出侧和压板之间具有等于或高于170℃的熔点的膜，（e）在压机的压板上压制层压体 温度为170℃以上，压力为10kgf / cm 2以上，时间为60分钟以上，（f）从压制机中分离层压体，（g）从层叠体剥离聚酰胺膜，得到 覆铜层压板。 覆铜层压板可用于印刷电路板。