公开(公告)号：US20150345044A1

公开(公告)日：2015-12-03

申请号：US14289828

申请日：2014-05-29

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Chi-Haw CHIANG ,  Chih WANG ,  Yu-Ping WANG ,  Chun-Yu LEE ,  Ren-Ruey FANG ,  Yang-Kuo KUO

IPC: C25D5/16 ,  C25D5/10 ,  B23K1/00 ,  B23K31/02 ,  B23K1/20 ,  C25D7/06 ,  C25D5/18

CPC classification number: C25D5/16 ,  C25D3/48 ,  C25D3/562 ,  C25D3/62 ,  C25D5/06 ,  C25D5/10 ,  C25D5/18 ,  C25D7/0607 ,  H01L21/2885 ,  H01L21/76849 ,  H01L23/49866 ,  H01L2224/13111 ,  H01L2224/81444 ,  H05K3/244 ,  H05K2203/0723 ,  H01L2924/014

Abstract: A method of electroplating a cobalt alloy to a wiring surface includes providing a substrate having a metal wiring; electroplating a cobalt-based alloy to the metal wiring at a deposition rate of 15-30 μm/hr to form thereon a cobalt-based alloy electroplated layer 0.5 μm-5 μm thick, wherein the main constituent element of the cobalt-based alloy is cobalt; plating gold to the cobalt-based alloy electroplated layer to form thereon a gold plated layer 0.03 μm-0.3 μm thick. The surface of the cobalt-based alloy electroplated layer features a crystalline-phase structure full of micro-protuberances, and the thickness of the gold plated layer is reduced to 0.03 μm.

Abstract translation: 将钴合金电镀到布线表面的方法包括提供具有金属布线的基板; 以15-30μm/小时的沉积速率将钴基合金电镀到金属布线上，以形成0.5μm-5μm厚的钴基合金电镀层，其中钴基合金的主要构成元素为 钴; 在钴基合金电镀层上镀金，在其上形成0.03μm〜0.3μm厚的镀金层。 钴基合金电镀层的表面具有充满微突起的结晶相结构，镀金层的厚度减小到0.03μm。

公开(公告)号：US20150343567A1

公开(公告)日：2015-12-03

申请号：US14289777

申请日：2014-05-29

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Chih WANG ,  Chi-Haw CHIANG ,  Chih-Wei LUO ,  Sheng-Yang TSENG ,  Ya-Hsin TSENG ,  Hui-Hsin CHU

IPC: B23K26/40 ,  B23K26/06 ,  B23K26/38

CPC classification number: B23K26/0624 ,  B23K26/382 ,  B23K2103/50 ,  B23K2103/52

Abstract: A method and system for formation of vertical microvias in an opaque ceramic thin-plate by femtosecond laser pulses are introduced. The method includes (a) thin an opaque ceramic substrate and reduce its thickness to a range of 20-100 μm to provide the ceramic thin-plate; (b) place the ceramic thin-plate on a carrier; and (c) drill the ceramic thin-plate by the femtosecond laser pulses, wherein the femtosecond laser pulses have the following parameters, including a pulse width

Abstract translation: 介绍了通过飞秒激光脉冲在不透明陶瓷薄板中形成垂直微孔的方法和系统。 该方法包括（a）使不透明的陶瓷基板变薄，并将其厚度减小到20-100μm的范围以提供陶瓷薄板; （b）将陶瓷薄板放在载体上; 和（c）通过飞秒激光脉冲钻陶瓷薄板，其中飞秒激光脉冲具有以下参数，包括脉冲宽度<100fs，脉冲频率为1,000〜10,000Hz，中心波长为 800nm，速度为20-200μm/ s的可动台。 因此，可以在不透明陶瓷薄板中制造具有高纵横比的垂直微凹。