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公开(公告)号：US10834818B2
公开(公告)日：2020-11-10
申请号：US16585021
申请日：2019-09-27
发明人： Takakuni Nasu , Kengo Tanimori , Yousuke Kondo , Masahiro Kamegai , Kouta Kimata , Junya Matsura , Fumio Shiraki , Guangzhu Jin
摘要： A wiring board includes: an insulator layer composed mainly of ceramic; a conductor extending through the insulator layer in a thickness direction thereof; and an electrode pad disposed on a first surface of the insulator layer and connected electrically with the conductor, wherein: the electrode pad includes through holes extending through the electrode pad in a thickness direction thereof; and each of the through holes is positioned to avoid overlapping with the conductor in the thickness direction of the insulator layer.
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公开(公告)号：US10674614B2
公开(公告)日：2020-06-02
申请号：US16143698
申请日：2018-09-27
发明人： Takakuni Nasu , Masaomi Hattori
摘要： A wiring substrate for electronic component inspection apparatus includes a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface, and a plurality of studs joined to the back surface of the first laminate Each of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion which perpendicularly extends from a center portion of an outside surface of the flange portion. The flange portion has a truncated conical shape and the outside surface from which the bolt portion protrudes, such that the outside surface slopes from the proximal end side of the bolt portion toward the peripheral edge of the flange portion and gradually approaches the inside surface of the flange portion.
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公开(公告)号：US10433433B2
公开(公告)日：2019-10-01
申请号：US16143752
申请日：2018-09-27
发明人： Takakuni Nasu
摘要： A wiring substrate for electronic component inspection apparatus includes a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface, and a plurality of studs joined to the back surface of the first laminate, wherein each of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion which perpendicularly extends from a center portion of an outside surface of the flange portion; and in a vertical cross section along an axial direction of the bolt portion, the outside surface from which the bolt portion protrudes has a curved surface which is convex toward an inside surface of the flange portion facing the back surface of the first laminate.
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公开(公告)号：US09107334B2
公开(公告)日：2015-08-11
申请号：US13669913
申请日：2012-11-06
发明人： Kenji Suzuki , Yuma Otsuka , Takakuni Nasu
CPC分类号： H05K3/4638 , H05K3/4629 , H05K2201/09063
摘要： A ceramic substrate includes: a substrate body formed by laminating a plurality of ceramic layers and including a first and second opposing principal surfaces and a peripheral portion having a positioning portion; a first conductor pad formed on the first principal surface; a second conductor pad formed on the second principal surface and having a diameter smaller than that of the first conductor pad. The positioning portion includes first and second through holes that individually pass through respective ceramic layers and are connected to each other in an axial direction. The first through hole passes through the first principal surface. The second through hole passes through the second principal surface and has a cross-sectional area that is smaller than that of the first through hole. At least apart of a peripheral edge of a ceramic layer defining the second through hole is visible through the first through hole.
摘要翻译： 陶瓷基板包括：通过层叠多个陶瓷层并且包括第一和第二相对的主表面和具有定位部分的周边部分形成的基板主体; 形成在第一主表面上的第一导体焊盘; 第二导体焊盘，形成在所述第二主表面上并且具有小于所述第一导体焊盘的直径的直径。 定位部分包括分别穿过相应的陶瓷层并沿轴向彼此连接的第一和第二通孔。 第一通孔穿过第一主表面。 第二通孔穿过第二主表面并具有小于第一通孔的横截面面积。 限定第二通孔的陶瓷层的外围边缘的至少一部分通过第一通孔是可见的。
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公开(公告)号：US10834812B2
公开(公告)日：2020-11-10
申请号：US16523476
申请日：2019-07-26
发明人： Takakuni Nasu , Yousuke Kondou , Masaomi Hattori , Kouta Kimata , Atsushi Kaga , Guangzhu Jin
摘要： A wiring board includes: a ceramic board including a ceramic insulator layer composed mainly of ceramic, and a wiring disposed at the ceramic insulator layer; a first resin board and a second resin board each of which includes a resin insulator layer composed mainly of resin, and a wiring disposed at the resin insulator layer; and a metal member mounted to the second resin board. The first resin board is superposed to a first surface of the ceramic board. The second resin board is superposed to a second surface of the ceramic board opposite to the first surface of the ceramic board. The second resin board includes a joint pad at its first surface opposite to its second surface facing the ceramic board, the joint pad made of metal. The metal member is joined to the joint pad by brazing or soldering.
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公开(公告)号：US10887991B2
公开(公告)日：2021-01-05
申请号：US16270832
申请日：2019-02-08
发明人： Takakuni Nasu
摘要： A wiring substrate for inspection apparatus includes a base substrate and a plurality of tile substrates. The tile substrate is composed of a ceramic substrate section and a first resin substrate section. Each ceramic substrate section is composed of a plurality of ceramic layers and has a plurality of upper-surface connection terminals provided on an upper surface thereof, a plurality of lower-surface connection terminals provided on a lower surface thereof, and a plurality of through conductors for conducting electricity between the upper-surface connection terminals and the lower-surface connection terminals. The first resin substrate section is laminated on the upper surface and includes a laminate of a plurality of resin layers, a plurality of probe pads formed on a resin front-surface thereof, a plurality of inner wiring layers formed between the resin layers, and a plurality of electrically conductive paths for conducting electricity between the probe pads and the upper-surface connection terminals.
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公开(公告)号：US10729006B2
公开(公告)日：2020-07-28
申请号：US16125906
申请日：2018-09-10
发明人： Takakuni Nasu , Yousuke Kondo , Kouta Kimata , Guangzhu Jin
IPC分类号： H01L23/48 , H05K1/02 , G01R31/28 , H01L25/04 , H01L21/02 , H05K13/08 , G01R3/00 , H05K3/46 , G01R1/073
摘要： [Objective] To provide a wiring substrate for electronic component inspection apparatus which includes a first laminate of resin layers with a plurality of pads for probe provided on its front surface and a second laminate of ceramic layers disposed on the back side of the first laminate and which, despite joining by brazing of a plurality of studs to the back surface of the second laminate, is free from deformation of resin of the first laminate caused by softening or the like and from accidental formation of a short circuit between brazing material layers used for the brazing and external connection terminals formed on the back surface of the second laminate.[Means for Solution] A wiring substrate for electronic component inspection apparatus 1 which includes a first laminate 3 composed of a plurality of stacked resin layers j1 to j3 and having a plurality of pads for probe 9 on its front surface 5, a second laminate 4 disposed on a back surface 6 side of the first laminate 3 and composed of a plurality of stacked ceramic layers c1 to c3, and a plurality of studs 20a joined to a back surface 8 of the second laminate 4 and in which the resin layers j1 to j3 of the first laminate 3 are formed of a resin having a thermal deformation temperature of 300° C. or higher, and the studs 20a are joined to surfaces of metal layers 16 formed on the back surface 8 of the second laminate 4 via brazing material layers 28, respectively.
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公开(公告)号：US09903887B2
公开(公告)日：2018-02-27
申请号：US15340279
申请日：2016-11-01
发明人： Takakuni Nasu , Kengo Tanimori , Kouta Kimata , Guangzhu Jin
CPC分类号： G01R1/07314 , G01R1/0491 , G01R1/07378 , G01R31/2831 , G01R31/2889 , H01L23/49822 , H05K1/0268 , H05K1/0306 , H05K1/111
摘要： Disclosed is a wiring board for simultaneously testing of multiple semiconductor devices. The wiring board includes a multilayer ceramic substrate, an organic wiring structure arranged on the multilayer ceramic substrate, a plurality of capacitor connection pads formed on the organic wiring structure and a plurality of test pads formed on the organic wiring structure. The organic wiring structure has a plurality of inner conductor layers including first and second plane layers. Each of the first plane layers is divided in a plurality of regions. Each of the second plane layer(s) is placed in a different layer from the first plane layers and made larger in area than the first plane layers. At least a part of the test pads of each test pad group is electrically connected to at least a part of the connection pads via an outermost one of the first plane layers.
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