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公开(公告)号：US20170170371A1
公开(公告)日：2017-06-15
申请号：US15374234
申请日：2016-12-09
Applicant: NICHIA CORPORATION
Inventor： Hiroshi IWATA , Shoji HOSOKAWA
CPC classification number: H01L33/504 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
Abstract: A light emitting device manufacturing method includes bonding an electrode of a light emitting element to a conductive member of a base. First wavelength conversion particles, second wavelength conversion particles and filling particles are electrodeposited on a surface of the light emitting element to form a wavelength conversion layer in which the filling particles are disposed among the first wavelength conversion particles and the second wavelength conversion particles. The first wavelength conversion particles contain aluminum. The second wavelength conversion particles have surfaces covered with covering material which contains aluminum. The filling particles contain aluminum. The filling particles have particle size smaller than particle sizes of both the first wavelength conversion particles and the second wavelength conversion particles. The filling particles have aspect ratio smaller than aspect ratios of both the first wavelength conversion particles and the second wavelength conversion particles.
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公开(公告)号：US20240021752A1
公开(公告)日：2024-01-18
申请号：US18352200
申请日：2023-07-13
Applicant: NICHIA CORPORATION
Inventor： Koichi AMARI , Yasunori SHIMIZU , Hirofumi ICHIKAWA , Hiroshi IWATA
CPC classification number: H01L33/0095 , H01L33/62 , H01L33/40 , H01L33/56
Abstract: A method for manufacturing a light-emitting device includes providing a light-emitting element having element electrodes including a positive element electrode and a negative element electrode, a wiring substrate having wiring layers, and conductive members each electrically connecting one of the element electrodes and a corresponding one of the wiring layers, with at least one member of the element electrodes, the wiring layers, or the conductive members containing Au; arranging, between a lower surface of the light-emitting element and the wiring substrate, a resin composition in a liquid state; oxidizing a component B in the resin composition in contact with the at least one member containing Au; and after the oxidizing of the component B, heating and curing the resin composition not in contact with the at least one member containing Au.
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公开(公告)号：US20180097153A1
公开(公告)日：2018-04-05
申请号：US15818740
申请日：2017-11-21
Applicant: NICHIA CORPORATION
Inventor： Hiroshi IWATA , Shoji HOSOKAWA
CPC classification number: H01L33/504 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
Abstract: A light emitting device includes a light emitting element and a wavelength conversion layer covering the light emitting element. The wavelength conversion layer includes first wavelength conversion particles, second wavelength conversion particles, and filling particles. The first wavelength conversion particles contains aluminum. The second wavelength conversion particles have outer surfaces covered with covering material which contains aluminum. The filling particles contain aluminum. The filling particles are provided among the first wavelength conversion particles and the second wavelength conversion particles. The filling particles have particle sizes smaller than particle sizes of the first wavelength conversion particles and particle sizes of the second wavelength conversion particles. The filling particles have aspect ratios smaller than aspect ratios of the first wavelength conversion particles and aspect ratios of the second wavelength conversion particles.
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