公开(公告)号：US20180301600A1

公开(公告)日：2018-10-18

申请号：US16007954

申请日：2018-06-13

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/56 ,  H01L33/50 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L33/62

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20250133878A1

公开(公告)日：2025-04-24

申请号：US19000967

申请日：2024-12-24

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H10H20/85 ,  B29C45/00 ,  B29C45/14 ,  H01L23/00 ,  H10H20/01 ,  H10H20/851 ,  H10H20/854 ,  H10H20/856 ,  H10H20/857 ,  H10H20/858

Abstract: A light emitting device includes: a resin package comprising a first lead, a second lead, and a resin part; and a light emitting element disposed on the first lead. The resin package has a rectangular shape in top view and comprises a first outer lateral surface, a second outer lateral surface on a side opposite the first outer lateral surface, a third outer lateral surface, and a fourth outer lateral surface on a side opposite the third outer lateral surface. At the first outer lateral surface, the first lead is exposed from the resin part, and the first lead and a portion of the resin part located at a lateral edge of the first lead are substantially coplanar with each other.

公开(公告)号：US20160049566A1

公开(公告)日：2016-02-18

申请号：US14928570

申请日：2015-10-30

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/64 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

Abstract translation: 一种制造具有树脂封装的发光器件的方法，所述树脂封装在热固化之后在350nm和800nm之间的波长处提供等于或大于70％的光学反射率，并且其中树脂部分和引线形成在 在外侧表面上具有大致相同的平面，包括通过上模和下模夹着设置有切口部的引线框架的步骤，将含有光反射材料的热固性树脂转印成型 模具夹在上模具和下模具之间以在引线框架中形成树脂模制体，以及沿切口部分切割树脂模制体和引线框架的步骤。

公开(公告)号：US20200287096A1

公开(公告)日：2020-09-10

申请号：US16883714

申请日：2020-05-26

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L23/00 ,  H01L33/00 ,  H01L33/62 ,  H01L33/64 ,  H01L33/50 ,  H01L33/56

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20170141273A1

公开(公告)日：2017-05-18

申请号：US15360316

申请日：2016-11-23

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/50 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20210336094A1

公开(公告)日：2021-10-28

申请号：US17371943

申请日：2021-07-09

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/64 ,  H01L33/60 ,  H01L33/62 ,  B29C45/00 ,  H01L33/50 ,  H01L23/00 ,  H01L33/56 ,  B29C45/14

Abstract: A light emitting device includes: a resin package including: a resin part, and a plurality of leads including a first lead and a second lead, wherein the resin package has a concave portion having a bottom face at which a part of an upper surface of the first lead and a part of an upper surface of the second lead are exposed from the resin part; a light emitting element mounted on the bottom face of the concave portion; and a sealing member covering the light emitting element in the concave portion. The plurality of leads comprise a plurality of notch parts including a first notch part on a first side corresponding to a first outer side surface of the resin package and a second notch part on a second side corresponding to a second outer side surface of the resin package.

公开(公告)号：US20170162765A1

公开(公告)日：2017-06-08

申请号：US15435710

申请日：2017-02-17

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Akiko YAMASAKI ,  Hirofumi ICHIKAWA ,  Yasunori SHIMIZU ,  Akihiro OTA

IPC: H01L33/56 ,  C09K11/02 ,  H01L33/50 ,  C09K11/77 ,  H01L33/62 ,  H01L33/54

CPC classification number: H01L33/56 ,  C09K11/025 ,  C09K11/7774 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/501 ,  H01L33/502 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a base substrate having a recessed portion at a flat upper surface thereof. The recessed portion has an inner wall. A sealing member is provided in the recessed portion. The sealing member contains surface-treated particles, or particles coexisting with a dispersing agent. The particles have a particle diameter of 1 nm or more and 100 μm or less. The particles are made of an organic material or an inorganic material. The organic material and the inorganic material are free of a phosphor. The at least a part of an edge portion of the sealing member is a region located in the vicinity of an edge of the recessed portion which is a boundary between a surface of the inner wall and the flat upper surface. The at least one of the particles and aggregates of particles are unevenly distributed in the region.

公开(公告)号：US20140084320A1

公开(公告)日：2014-03-27

申请号：US13969182

申请日：2013-08-16

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki Hayashi ,  Shimpei Sasaoka ,  Tomohide Miki

IPC: H01L33/62 ,  H01L33/60

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

Abstract translation: 一种制造具有树脂封装的发光器件的方法，所述树脂封装在热固化之后在350nm和800nm之间的波长处提供等于或大于70％的光学反射率，并且其中树脂部分和引线形成在 在外侧表面上具有大致相同的平面，包括通过上模和下模夹着设置有切口部的引线框架的步骤，将含有光反射材料的热固性树脂转印成型 模具夹在上模具和下模具之间以在引线框架中形成树脂模制体，以及沿切口部分切割树脂模制体和引线框架的步骤。

公开(公告)号：US20240021752A1

公开(公告)日：2024-01-18

申请号：US18352200

申请日：2023-07-13

Applicant: NICHIA CORPORATION

Inventor： Koichi AMARI ,  Yasunori SHIMIZU ,  Hirofumi ICHIKAWA ,  Hiroshi IWATA

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/40 ,  H01L33/56

CPC classification number: H01L33/0095 ,  H01L33/62 ,  H01L33/40 ,  H01L33/56

Abstract: A method for manufacturing a light-emitting device includes providing a light-emitting element having element electrodes including a positive element electrode and a negative element electrode, a wiring substrate having wiring layers, and conductive members each electrically connecting one of the element electrodes and a corresponding one of the wiring layers, with at least one member of the element electrodes, the wiring layers, or the conductive members containing Au; arranging, between a lower surface of the light-emitting element and the wiring substrate, a resin composition in a liquid state; oxidizing a component B in the resin composition in contact with the at least one member containing Au; and after the oxidizing of the component B, heating and curing the resin composition not in contact with the at least one member containing Au.

公开(公告)号：US20190088825A1

公开(公告)日：2019-03-21

申请号：US16150255

申请日：2018-10-02

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/56 ,  H01L33/50 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L23/00

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.