SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE

    公开(公告)号:US20240348943A1

    公开(公告)日:2024-10-17

    申请号:US18630604

    申请日:2024-04-09

    摘要: Solid-state imaging elements are disclosed. In one example, an upstream circuit block generates a predetermined reset level and a plurality of signal levels each corresponding to an exposure amount, and causes capacitive elements, different from each other, to hold them. A selection circuit sequentially performs control to connect the capacitive element in which the reset level is held to a predetermined downstream node, control to disconnect capacitive elements from the downstream node, and control to connect the capacitive element in which any of the plurality of signal levels is held to the downstream node. A downstream reset transistor initializes a level of the downstream node when the capacitive elements are disconnected from the downstream node. A downstream circuit sequentially reads the reset level and the plurality of signal levels via the downstream node.

    SOLID-STATE IMAGING ELEMENT
    2.
    发明公开

    公开(公告)号:US20240284075A1

    公开(公告)日:2024-08-22

    申请号:US18292726

    申请日:2022-01-31

    摘要: To improve the image quality in a solid-state imaging element that performs differential amplification. Each of a plurality of reference pixels is provided with a reference-side amplifier transistor that supplies a reference current according to a predetermined reference potential. Each of a plurality of readout pixel circuits is provided with a readout-side amplifier transistor that supplies from a drain to a source a signal current according to a difference between a potential of a gate and the reference potential. Further, in a potential difference generation unit, a plurality of source follower transistors are arranged for each of columns of the readout pixel circuits, each source follower transistor controlling a potential difference between the gate and the drain to a predetermined value when the potential of the gate and the reference potential are initialized.

    QUASI-GLOBAL SHUTTER FOR IMAGE SENSORS
    3.
    发明公开

    公开(公告)号:US20240205555A1

    公开(公告)日:2024-06-20

    申请号:US18068638

    申请日:2022-12-20

    申请人: CAELESTE CVBA

    发明人: Bart DIERICKX

    摘要: A solid-state image sensor with quasi-global shutter function and a method of operating the same. A row control unit of the image sensor is configured to determine exceptional pixel rows for which a pre-scheduled global exposure control pulse would fully or partially coincide with a sequentially applied readout control pulse that is selecting a number of pixel rows of the pixel array to be read out. The pre-scheduled global exposure control pulse is applied simultaneously to all but the exceptional pixel rows and delayed and/or advanced versions of the exposure control pulse are applied to the exceptional pixel rows.

    SOLID-STATE IMAGING ELEMENT
    4.
    发明公开

    公开(公告)号:US20240187752A1

    公开(公告)日:2024-06-06

    申请号:US18550180

    申请日:2022-01-13

    发明人: LuongHung Asakura

    摘要: To improve image quality in a solid-state imaging element that simultaneously performs exposure in all pixels.
    The solid-state imaging element includes a predetermined number of capacitive elements, a pre-stage circuit, a selection circuit, a post-stage circuit, and a vertical scanning circuit. The pre-stage circuit generates a predetermined reset level and a signal level corresponding to an exposure amount, and causes each of the capacitive elements to hold a corresponding one of the reset level and the signal level. In the selection circuit, a selection transistor that opens and closes a path between one end of each capacitive element and a predetermined node is arranged. The post-stage circuit sequentially reads the reset level and the signal level via the node. The vertical scanning circuit performs control to lower the potential of the one end when the reset level and the signal level are held.

    Solid-state imaging device and imaging apparatus

    公开(公告)号:US11950005B2

    公开(公告)日:2024-04-02

    申请号:US17868349

    申请日:2022-07-19

    摘要: A solid-state imaging device includes: a photoelectric conversion element that is disposed on a semiconductor substrate and generates signal charges by photoelectric conversion; a first diffusion layer that holds signal charges transferred from the photoelectric conversion element; a capacitive element that holds signal charges overflowing from the photoelectric conversion element; an amplifier transistor that outputs a signal according to the signal charges in the first diffusion layer; a first contact that is connected to the first diffusion layer; a second contact that is connected to a gate of the amplifier transistor; and a first wire that connects the first contact and the second contact. A shortest distance between the semiconductor substrate and the first wire is less than a shortest distance between the semiconductor substrate and the capacitive element.

    PHOTOELECTRIC CONVERSION DEVICE, ELECTRONIC DEVICE, AND SUBSTRATE

    公开(公告)号:US20240064439A1

    公开(公告)日:2024-02-22

    申请号:US18499545

    申请日:2023-11-01

    发明人: Hideo Kobayashi

    IPC分类号: H04N25/772 H04N25/616

    CPC分类号: H04N25/772 H04N25/616

    摘要: A photoelectric conversion device comprising a pixel portion in which pixels each including a photoelectric converter are arranged, a sample/hold unit configured to sample a signal generated in the photoelectric converter via a vertical signal line and hold the signal, and a converter configured to perform an analog/digital conversion is provided. In the sample/hold unit, a first sample/hold circuit that samples a signal for when the photoelectric converter is reset and a second sample/hold circuit that samples a signal for when a photoelectric conversion operation is performed are connected to one vertical signal line. The pixel portion is arranged on a first substrate, a part of a group configured by the sample/hold unit and the converter is arranged on a second substrate, and another part of the group is arranged on a third substrate.