公开(公告)号：US5766434A

公开(公告)日：1998-06-16

申请号：US797652

申请日：1997-01-31

申请人： Namitsugu Fujii ,  Hiromi Sano ,  Yasumichi Hotta ,  Naoto Miwa ,  Motoaki Satou

发明人： Namitsugu Fujii ,  Hiromi Sano ,  Yasumichi Hotta ,  Naoto Miwa ,  Motoaki Satou

IPC分类号： G01N27/407 ,  G01N27/26

CPC分类号： G01N27/4075 ,  G01N27/4077

摘要： An oxygen concentration detecting device comprises a solid electrolyte body, inner and outer electrodes formed on the opposite sides of the solid electrolyte body, and a protective layer formed on the outer electrode and comprised of coarse particles and fine particles mutually bonded through an inorganic binder while substantially keeping the original forms of the both types of particles. A ratio of an average particle size, RB, of the coarse particles to an average particle size, RA, of the fine particles of 30:1 or above, and a content, WA, of the fine particles in the protective layer based on the total content, W, of the content, WA, of the fine particles and the content, WB, of the coarse particles on the weight basis is in the range of 15 to 80 %. A method for fabricating the detecting device having such a protective layer as set out above is also described.

摘要翻译： 氧浓度检测装置包括固体电解质体，形成在固体电解质体的相对侧的内部和外部电极，以及形成在外部电极上的保护层，其由通过无机粘合剂相互粘合的粗粒子和微粒组成， 基本保持两种类型颗粒的原始形式。 基于上述保护层中的微粒的粗粒子的平均粒径RB与微粒的平均粒径RA（30:1以上）和含量WA的比例 粗颗粒的含量W W，微粒的含量W和重量的含量WB在15〜80％的范围内。 还描述了制造具有上述保护层的检测装置的方法。

公开(公告)号：US06409899B1

公开(公告)日：2002-06-25

申请号：US09511079

申请日：2000-02-23

申请人： Motoaki Satou ,  Yasumichi Hotta ,  Namitsugu Fujii ,  Hiromi Sano

发明人： Motoaki Satou ,  Yasumichi Hotta ,  Namitsugu Fujii ,  Hiromi Sano

IPC分类号： G01N27407

CPC分类号： G01N27/4077

摘要： A sensor element has a solid electrolyte body holding a reference gas side electrode and a measurement gas side electrode on surfaces thereof. The measurement gas side electrode is covered with a porous protective layer including a component as a lead getter, which reacts with lead contained in measurement gas. Accordingly, lead is removed from measurement gas by the protective layer not to be attached to the measurement gas side electrode. As a result, the sensor element can be used in measurement gas containing lead, without deteriorating responsibility and output thereof.

摘要翻译： 传感器元件具有在其表面上保持参考气体侧电极和测量气体侧电极的固体电解质体。 测量气体侧电极被多孔保护层覆盖，该多孔保护层包括与测量气体中所含的铅反应的作为引线吸气剂的部件。 因此，通过不附接到测量气体侧电极的保护层将铅从测量气体中除去。 结果，传感器元件可以用于含铅的测量气体中，而不会降低其责任和输出。

公开(公告)号：US06632338B2

公开(公告)日：2003-10-14

申请号：US09877125

申请日：2001-06-11

申请人： Namitsugu Fujii ,  Motoaki Satou ,  Kiyomi Kobayashi ,  Yasumichi Hotta

发明人： Namitsugu Fujii ,  Motoaki Satou ,  Kiyomi Kobayashi ,  Yasumichi Hotta

IPC分类号： G01N2741

CPC分类号： G01N27/4077

摘要： A second protective layer is a ceramic porous protective layer comprising coarse particles and fine particles structurally arranged in such a manner that interparticle cavities formed between the coarse particles are filled with the fine particles. At least either of the coarse particles and the fine particles contain at least one selected from the group consisting of &ggr;-Al2O3, &thgr;-Al2O3, &dgr;-Al2O3 and solid solution having the same crystal structure as those of &ggr;-Al2O3, &thgr;-Al2O3, &dgr;-Al2O3.

摘要翻译： 第二保护层是包括粗颗粒和细颗粒的陶瓷多孔保护层，其结构地布置成使得在粗颗粒之间形成的颗粒间隙被细颗粒填充。 粗颗粒和细颗粒中的至少任一种含有选自γ-Al 2 O 3，θ-Al 2 O 3，δ-Al 2 O 3和与γ-Al 2 O 3，θ-Al 2 O 3具有相同晶体结构的固溶体中的至少一种 ，Δ-Al2O3

公开(公告)号：US07211222B2

公开(公告)日：2007-05-01

申请号：US10201302

申请日：2002-07-24

申请人： Motoaki Satou ,  Kiyomi Kobayashi ,  Masanobu Yamauchi ,  Namitsugu Fujii

发明人： Motoaki Satou ,  Kiyomi Kobayashi ,  Masanobu Yamauchi ,  Namitsugu Fujii

IPC分类号： B32B5/02 ,  B32B27/04 ,  B32B27/12 ,  G01N7/00 ,  G01N21/00

CPC分类号： G01N27/4077 ,  Y10T436/20 ,  Y10T436/208339 ,  Y10T436/21 ,  Y10T436/218

摘要： A powder filler is stuffed in a filler space defined between a housing and a gas sensing element so as to airtightly seal a clearance between the housing and the gas sensing element. The powder filler contains grains whose diameter is in a range from 80 μm to 5,000 μm when measured before being stuffed into the filler space. A weight percentage of the grains having the diameter of 80 μm to 5,000 μm is equal to or larger than 80% with respect to an overall weight of the powder filler.

摘要翻译： 粉末填料填充在壳体和气体感测元件之间的填充空间中，以密封地密封壳体和气体感测元件之间的间隙。 粉末填充剂在填充到填料空间内时，测量直径在80μm至5,000μm之间的颗粒。 相对于粉末填料的总重量，直径为80μm〜5000μm的粒子的重量百分比为80％以上。

公开(公告)号：US20060068095A1

公开(公告)日：2006-03-30

申请号：US11273090

申请日：2005-11-15

申请人： Tsuyoshi Nishi ,  Tomoaki Tsujimoto ,  Akio Harada ,  Kiyomi Kobayashi ,  Motoaki Satou ,  Namitsugu Fujii

发明人： Tsuyoshi Nishi ,  Tomoaki Tsujimoto ,  Akio Harada ,  Kiyomi Kobayashi ,  Motoaki Satou ,  Namitsugu Fujii

IPC分类号： B05D3/12

CPC分类号： B05C1/02 ,  B05C7/06

摘要： An active liquid applicator is provided which is designed to coat a surface of an electronic parts such as an oxygen sensor with an active liquid for forming an electrode. The liquid applicator includes a nozzle head and a nozzle tube. The nozzle tube has disposed therein a pearmable member which produces capillary attraction of an active liquid thereinto and feed it to the nozzle head, thereby enabling formation of a thin active film on the electronic part which has the thickness controllable with high accuracy.

公开(公告)号：US20120018304A1

公开(公告)日：2012-01-26

申请号：US13188009

申请日：2011-07-21

申请人： Takao MIKAMI ,  Motoaki Satou

发明人： Takao MIKAMI ,  Motoaki Satou

IPC分类号： G01N27/409

CPC分类号： G01N27/4076

摘要： An oxygen sensor element 1 includes: a cup-shaped solid electrolyte body 10, inside of which a reference gas chamber 13 is provided; a measuring electrode 11 that comes into contact with measured gas; and a reference electrode 12. A heater 2 is disposed inside the reference gas chamber 13. The measuring electrode 11 is formed surrounding the outer surface 101 in a tip end section 100 of the solid electrolyte body 10. The reference electrode 12 is formed in a measuring-electrode-opposing-region 102a that is a region on the inner surface 102 of the solid electrolyte body 10 opposing the measuring electrode 11 with the solid electrolyte body 10 therebetween. The area S1 of the measuring electrode 11 and the area S2 of the reference electrode 12 satisfy a relationship 0.010≦S2/S1

摘要翻译： 氧传感器元件1包括：杯形固体电解质体10，其内部设置有参考气体室13; 与测量气体接触的测量电极11; 和参考电极12.加热器2设置在参考气体室13的内部。测量电极11形成为围绕固体电解质体10的前端部分100中的外表面101。参考电极12形成为 测量电极对置区域102a是固体电解质体10的内表面102上与固体电解质体10相对的测量电极11的区域。 测量电极11的面积S1和参考电极12的面积S2满足关系0.010＆lt; nlE; S2 / S1 <0.723。

公开(公告)号：US07365416B2

公开(公告)日：2008-04-29

申请号：US11242904

申请日：2005-10-05

申请人： Takeshi Kawabata ,  Motoaki Satou ,  Toshiyuki Fukuda ,  Toshio Tsuda ,  Kazuhiro Nobori ,  Seiichi Nakatani

发明人： Takeshi Kawabata ,  Motoaki Satou ,  Toshiyuki Fukuda ,  Toshio Tsuda ,  Kazuhiro Nobori ,  Seiichi Nakatani

IPC分类号： H01L23/02

CPC分类号： H01L23/49816 ,  H01L21/486 ,  H01L21/563 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/01078 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor module is formed by alternately stacking resin boards 3 on which semiconductor chips 2 are mounted and sheet members having openings larger than the semiconductor chips 2 and bonded to the resin boards 3. The resin board 4 located at the bottom out of the resin boards 3 is thicker than the other resin boards 3.

摘要翻译： 半导体模块通过交替堆叠安装有半导体芯片2的树脂板3和具有比半导体芯片2大的开口的片状部件并且结合到树脂板3而形成。 位于树脂基板3的底部的树脂基板4比其他树脂基板3厚。

公开(公告)号：US20060202318A1

公开(公告)日：2006-09-14

申请号：US11369818

申请日：2006-03-08

申请人： Motoaki Satou ,  Takeshi Kawabata ,  Masatoshi Shinagawa ,  Toshiyuki Fukuda

发明人： Motoaki Satou ,  Takeshi Kawabata ,  Masatoshi Shinagawa ,  Toshiyuki Fukuda

IPC分类号： H01L23/02

CPC分类号： H01L27/14634 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/1469 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H04N5/2257 ,  H05K1/182 ,  H01L2224/0401

摘要： An imaging module is formed by stacking: a first resin board; a second resin board having a first opening; a first electrically-conductive member electrically connecting the first resin board and the second resin board to each other; a printed circuit board having a second opening; a second electrically-conductive member electrically connecting the second resin board and the printed circuit board to each other; an imaging semiconductor chip mounted on the lower surface of the second resin board to cover the first opening and provided with an imaging sensor, an optical member placed on the upper surface of the second resin board to cover the first opening; a first semiconductor control chip provided with a control device for controlling operation of the imaging sensor and mounted on the lower surface of the first resin board.

摘要翻译： 成像模块通过堆叠形成：第一树脂板; 具有第一开口的第二树脂板; 将第一树脂板和第二树脂板彼此电连接的第一导电构件; 具有第二开口的印刷电路板; 将第二树脂板和印刷电路板电连接的第二导电构件; 成像半导体芯片，其安装在所述第二树脂板的下表面上以覆盖所述第一开口并设置有成像传感器;光学构件，设置在所述第二树脂板的上表面上以覆盖所述第一开口; 第一半导体控制芯片，设置有用于控制成像传感器的操作并安装在第一树脂板的下表面上的控制装置。

公开(公告)号：US20050224348A1

公开(公告)日：2005-10-13

申请号：US11104522

申请日：2005-04-13

申请人： Motoaki Satou ,  Kiyomi Kobayashi ,  Yasufumi Suzuki

发明人： Motoaki Satou ,  Kiyomi Kobayashi ,  Yasufumi Suzuki

IPC分类号： G01N27/409 ,  G01N27/26 ,  G01N27/407

CPC分类号： G01N27/4077

摘要： An improved structure of a gas sensor is provided which is designed to establish a desired degree of gas/liquid tight sealing between a sensor element and a housing. The gas sensor includes a powder seal fitted in a chamber defined between the sensor element and the housing. The dimensions of the powder seal and the chamber are selected to enhance gas/liquid tight properties of the powder seal.

摘要翻译： 提供了一种气体传感器的改进的结构，其被设计成在传感器元件和壳体之间建立所需程度的气/液密封。 气体传感器包括装配在限定在传感器元件和壳体之间的腔室中的粉末密封件。 选择粉末密封件和腔室的尺寸以增强粉末密封件的气/液密封性能。

公开(公告)号：US07327021B2

公开(公告)日：2008-02-05

申请号：US11594760

申请日：2006-11-09

申请人： Motoaki Satou ,  Takeshi Kawabata ,  Toshiyuki Fukuda

发明人： Motoaki Satou ,  Takeshi Kawabata ,  Toshiyuki Fukuda

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor module is formed by alternately stacking resin boards on which semiconductor chips are mounted and sheet members having openings larger than the semiconductor chips and bonded to the resin boards. One of the resin boards located at the bottom has a thickness larger than that of each of the other resin boards. First buried conductors formed in each of first resin boards are arranged to form a plurality of lines surrounding a region on which a semiconductor chip is to be mounted. The spacing between the first buried conductors increases in succession toward the outermost line. Second buried conductors formed in each of sheet members are arranged to form a plurality of lines surrounding an opening. The spacing between the second buried conductors increases in succession toward the outermost line.

摘要翻译： 半导体模块通过交替堆叠安装有半导体芯片的树脂板和具有比半导体芯片大的开口的片状构件并结合到树脂板上而形成。 位于底部的树脂板之一的厚度大于其它树脂板的厚度。 形成在每个第一树脂板中的第一掩埋导体被布置成围绕要安装半导体芯片的区域的多条线。 第一掩埋导体之间的间隔相对于最外面的线连续地增加。 形成在每个片状构件中的第二掩埋导体被布置成形成围绕开口的多条线。 第二掩埋导体之间的间距连续地朝向最外面的线增加。