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公开(公告)号：US20080047810A1
公开(公告)日：2008-02-28
申请号：US11859659
申请日：2007-09-21
IPC分类号： H01H36/00
CPC分类号： G11C13/025 , B82Y10/00 , B82Y30/00 , G11C2213/16
摘要： Some embodiments of the present invention include apparatuses and methods relating to nanotube switches that are mechanically actuated.
摘要翻译： 本发明的一些实施例包括与机械致动的纳米管开关相关的装置和方法。
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公开(公告)号：US20070238319A1
公开(公告)日：2007-10-11
申请号：US11217731
申请日：2005-08-31
IPC分类号： H01L21/31
CPC分类号： G11C13/025 , B82Y10/00 , B82Y30/00 , G11C2213/16
摘要： Some embodiments of the present invention include apparatuses and methods relating to nanotube switches that are mechanically actuated.
摘要翻译： 本发明的一些实施例包括与机械致动的纳米管开关相关的装置和方法。
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3.发明申请公开(公告)号：US20050277310A1
公开(公告)日：2005-12-15
申请号：US11197034
申请日：2005-08-04
申请人： Joseph Dibene , David Hartke , Carl Hoge , Edward Derian
发明人： Joseph Dibene , David Hartke , Carl Hoge , Edward Derian
IPC分类号： G06F1/18 , G06F1/20 , H01L23/427 , H01L23/433 , H01R12/00 , H01R12/04 , H01R13/24 , H05K1/02 , H05K1/14 , H05K3/30 , H05K3/36 , H05K7/10 , H05K7/20
CPC分类号： H05K7/1092 , G06F1/18 , G06F1/182 , G06F1/189 , G06F1/20 , H01L23/427 , H01L23/433 , H01L2224/16225 , H01L2224/73253 , H01L2924/15192 , H01L2924/15312 , H01L2924/19105 , H01L2924/3011 , H01R12/52 , H01R12/57 , H01R13/24 , H05K1/0206 , H05K1/0262 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K1/182 , H05K3/301 , H05K3/368 , H05K2201/10189 , H05K2201/10318 , H05K2201/10325 , H05K2201/10598 , H05K2201/10689 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , Y10T29/49124
摘要： A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.
摘要翻译： 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并允许大量的电流从静电或动态从一个衬底传递到下一个衬底。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于在提供低阻抗的同时承受两个基板之间的机械公差。 互连。
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4.发明申请公开(公告)号：US20070004240A1
公开(公告)日：2007-01-04
申请号：US11502682
申请日：2006-08-11
申请人： Joseph Dibene , David Hartke , Carl Hoge , Edward Derian
发明人： Joseph Dibene , David Hartke , Carl Hoge , Edward Derian
IPC分类号： H01R12/00
CPC分类号： H05K7/1092 , G06F1/18 , G06F1/182 , G06F1/189 , G06F1/20 , H01L23/427 , H01L23/433 , H01L2224/16225 , H01L2224/73253 , H01L2924/15192 , H01L2924/15312 , H01L2924/19105 , H01L2924/3011 , H01R12/52 , H01R12/57 , H01R13/24 , H05K1/0206 , H05K1/0262 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K1/182 , H05K3/301 , H05K3/368 , H05K2201/10189 , H05K2201/10318 , H05K2201/10325 , H05K2201/10598 , H05K2201/10689 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , Y10T29/49124
摘要： A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.
摘要翻译： 公开了一种电力互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并允许大量的电流从静电或动态从一个衬底传递到下一个衬底。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。
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