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    Light emitting device
    2.
    发明授权
    Light emitting device 有权

    公开(公告)号：US12113332B2

    公开(公告)日：2024-10-08

    申请号：US18358019

    申请日：2023-07-24

    Applicant: NICHIA CORPORATION

    Inventor： Masatoshi Nakagaki ,  Soichiro Miura

    IPC: H01S5/02355 ,  H01S5/022 ,  H01S5/0233 ,  H01S5/0239 ,  H01S5/40 ,  H01S5/02345

    CPC classification number: H01S5/0239 ,  H01S5/022 ,  H01S5/0233 ,  H01S5/02355 ,  H01S5/40 ,  H01S5/4031 ,  H01S5/02345

    Abstract: A light emitting device includes first and second semiconductor laser elements, first and second light-reflective members, and a basal part. The light emitted from the first semiconductor laser element irradiates a first light-reflective surface of the first light-reflective member at a first position. The light emitted from the second semiconductor laser element irradiates a second light-reflective surface of the second light-reflective member at a second position. A height of the first position is different from a height of the second position. With respect to a virtual axis extending along the prescribed direction, the first position and the second position have the same coordinates. A mounting position of the first light-reflective member and a mounting position of the second light-reflective member are different with respect to the prescribed direction.

    Light-emitting device
    3.
    发明授权
    Light-emitting device 有权

    公开(公告)号：US11984437B2

    公开(公告)日：2024-05-14

    申请号：US17489676

    申请日：2021-09-29

    Applicant: NICHIA CORPORATION

    Inventor： Takeshi Imai ,  Masatoshi Nakagaki

    IPC: H01L25/16 ,  H01L23/00 ,  H01L33/62

    CPC classification number: H01L25/167 ,  H01L25/162 ,  H01L33/62 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48155 ,  H01L2224/49175 ,  H01L2924/10253 ,  H01L2924/12035 ,  H01L2924/12041

    Abstract: A light-emitting device includes first and second light-emitting elements, first and second support members bonded to the first and second light-emitting elements, respectively, first and second protective elements, and a plurality of wirings including: a first wiring with one end being bonded to the first light-emitting element or the first support member; a second wiring with one end being bonded to the first light-emitting element or the first support member and the other end being bonded to the second light-emitting element or the second support member; a third wiring with one end being bonded to the first protective element or a support member equipped with the first protective element; and a fourth wiring with one end being bonded to the second protective element or a support member equipped with the second protective element.

    Method for manufacturing semiconductor device with submount including groove on surface of submount having heat dissipation portion
    4.
    发明授权
    Method for manufacturing semiconductor device with submount including groove on surface of submount having heat dissipation portion 有权

    公开(公告)号：US12243796B2

    公开(公告)日：2025-03-04

    申请号：US18441658

    申请日：2024-02-14

    Applicant: NICHIA CORPORATION

    Inventor： Tadaaki Miyata ,  Yoshihiro Kimura ,  Masatoshi Nakagaki

    IPC: H01L23/367 ,  H01L23/373 ,  H01L23/498

    Abstract: A method for manufacturing a semiconductor device include: providing a submount that has a first surface, a second surface located on a side opposite the first surface, and at least one lateral surface located between the first surface and the second surface, the submount including: a groove located at the second surface, a heat dissipation portion located at the second surface, at least one end face through channel located at the at least one lateral surface, and an electrode pattern on the first surface; physically joining the heat dissipation portion to a package substrate by a first joint material; and after the step of physically joining the heat dissipation portion to the package substrate, disposing a second joint material inside the at least one end face through channel to electrically connect the electrode pattern and the package substrate.

    Mount member and light emitting device
    8.
    发明授权
    Mount member and light emitting device 有权

    公开(公告)号：US11309681B2

    公开(公告)日：2022-04-19

    申请号：US16774516

    申请日：2020-01-28

    Applicant: NICHIA CORPORATION

    Inventor： Masatoshi Nakagaki ,  Soichiro Miura

    IPC: H01S5/02355 ,  H01S5/40 ,  H01S5/0233 ,  H01S5/02345

    Abstract: A mount member includes first and second conduction parts. In the first conduction part, as seen in a top view, a length in a first direction parallel to an emission end surface of a first semiconductor laser element is smaller than a length in a second direction perpendicular to the emission end surface, and, in relation to the second direction, a first wiring region extends from a first mounting region in a direction from the light emission end surface to an opposite end surface. In relation to the second direction, a second conduction part extends further than the first conduction part in a direction from an emission end surface to an opposite end surface of a second semiconductor laser element, and from a region where the second conduction part extends further than the first conduction part, the second conduction part extends toward the first conduction part in the first direction.

    Semiconductor device and method for manufacturing semiconductor device
    10.
    发明授权
    Semiconductor device and method for manufacturing semiconductor device 有权

    公开(公告)号：US11935806B2

    公开(公告)日：2024-03-19

    申请号：US17368608

    申请日：2021-07-06

    Applicant: NICHIA CORPORATION

    Inventor： Tadaaki Miyata ,  Yoshihiro Kimura ,  Masatoshi Nakagaki

    IPC: H01L23/367 ,  H01L23/373 ,  H01L23/498

    CPC classification number: H01L23/367 ,  H01L23/3736 ,  H01L23/49811 ,  H01L23/49838

    Abstract: A semiconductor device includes: a semiconductor element; a submount on which the semiconductor element is mounted, wherein the submount has a first surface on which the semiconductor element is mounted, a second surface located on a side opposite the first surface, and a lateral surface located between the first surface and the second surface, and wherein the submount comprises: a groove located at the second surface, a heat dissipation portion located at the second surface, and an electrode pattern located at the first surface; a package substrate on which the submount is mounted; a first joint member that physically joins the heat dissipation portion to the package substrate; and a connection portion located on the side surface, wherein the connection portion electrically connects the electrode pattern and the package substrate, and the connection portion comprises a second joint member.

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