公开(公告)号：US5763853A

公开(公告)日：1998-06-09

申请号：US557102

申请日：1995-12-06

申请人： Yoshiaki Shimomura ,  Naoki Miyanagi ,  Nobuhiko Tada ,  Yoshinari Nagano ,  Shinya Okumura ,  Shigeyuki Sakurai

发明人： Yoshiaki Shimomura ,  Naoki Miyanagi ,  Nobuhiko Tada ,  Yoshinari Nagano ,  Shinya Okumura ,  Shigeyuki Sakurai

IPC分类号： B23K26/03 ,  B23K26/02

CPC分类号： B23K26/032 ,  B23K26/0648 ,  B23K26/0665

摘要： Detecting light from a detecting light source (122) is irradiated to a workpiece (1) and the reflected light is detected by a photosensor (126). At the same time, light resulting from emission of plume produced upon laser processing is also detected by the photosensor (126). A laser controller (26) binary-codes a detection signal from the photosensor (126) to provide a rectangular wave signal (TP) and, based on the rectangular wave signal (TP), generates a trigger signal (TP.sub.2) for oscillating a processing laser beam. At this time, the trigger signal (TP.sub.2) is fed back to generate a gate signal (GP) and, based on the gate signal (GP), the detection signal resulted from the emission of the plume is omitted in the gate circuit (245) to produce a trigger signal (TP.sub.G). This trigger signal (TP.sub.G) is given with a delay time (T.sub.D) to produce a trigger signal (TP.sub.1). The above trigger signal (TP.sub.2) is generated in synch with the trigger signal (TP.sub.1). As a result, the laser processing is prevented from being applied unnecessarily based on the light generated upon the laser processing.

摘要翻译： PCT No.PCT / JP95 / 00674 Sec。 371 1995年12月6日第 102（e）日期1995年12月6日PCT 1995年4月6日PCT PCT。 第WO95 / 29035号公报 1995年11月2日检测来自检测光源（122）的光被照射到工件（1），反射光由光电传感器（126）检测。 同时，由激光加工产生的羽流的发射产生的光也由光传感器（126）检测。 激光控制器（26）对来自光电传感器（126）的检测信号进行二进制编码以提供矩形波信号（TP），并且基于矩形波信号（TP）产生用于振荡处理的触发信号（TP2） 激光束。 此时，触发信号（TP2）被反馈以产生栅极信号（GP），并且基于栅极信号（GP），在栅极电路（245）中省略了由羽流的发射引起的检测信号 ）以产生触发信号（TPG）。 该触发信号（TPG）具有延迟时间（TD）以产生触发信号（TP1）。 上述触发信号（TP2）与触发信号（TP1）同步产生。 结果，根据激光加工时产生的光，防止了不必要地施加激光加工。

公开(公告)号：US5548890A

公开(公告)日：1996-08-27

申请号：US553742

申请日：1995-10-23

申请人： Nobuhiko Tada ,  Naoki Miyanagi ,  Yoshiaki Shimomura ,  Shigeyuki Sakurai ,  Shinya Okumura ,  Yoshinari Nagano

发明人： Nobuhiko Tada ,  Naoki Miyanagi ,  Yoshiaki Shimomura ,  Shigeyuki Sakurai ,  Shinya Okumura ,  Yoshinari Nagano

IPC分类号： B23K26/36 ,  H01L21/48 ,  H01L23/495 ,  H01R43/02 ,  B23K26/00 ,  H01L21/60

CPC分类号： H01L21/4828 ,  B23K26/362 ,  H01L21/4821 ,  H01L23/49541 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1532 ,  H01L2924/181 ,  Y10T29/49121 ,  Y10T29/515

摘要： In a method for forming a lead frame (1) from a metallic plate, a metallic plate (11) is first etched to form outer leads (4) and outer portions (3b) of inner leads of the lead frame (1). Inner portions (3a) of the inner leads (3) are then laser-cut under the condition that a joint portion (7) is left so as to interconnect the inner leads (3) at their distal ends. Mechanical surface treatment and chemical surface treatment are then carried out to remove dross (10), spatters (9) and oxide films deposited during the laser cutting. Inner areas of the inner leads (3) connected to respective terminals of a semiconductor chip are then plated with gold to form plated terminal portions (3A). Subsequently, the region of the lead frame other than the outer leads (4) is coated with a protective film for solder plating and the outer leads (4) are plated with solder. The joint portion (7) left at the distal ends of the inner leads (3) is then cut off by laser cutting so that the inner leads (3) are separated from one another, thereby forming a final lead frame pattern. The protective film for solder plating is then removed, followed by washing and drying. The inner leads (3) are prevented from being curved due to thermal deformations with the laser cutting, resulting in highly accurate processing.

摘要翻译： 在从金属板形成引线框架（1）的方法中，首先蚀刻金属板（11）以形成引线框架（1）的内引线的外引线（4）和外部部分（3b）。 然后在留下接头部分（7）的条件下激光切割内部引线（3）的内部（3a），以使内部引线（3）在其远端相互连接。 然后进行机械表面处理和化学表面处理，以消除在激光切割期间沉积的浮渣（10），飞溅物（9）和氧化膜。 连接到半导体芯片的各个端子的内部引线（3）的内部区域然后用金镀以形成电镀端子部分（3A）。 随后，除了外引线（4）之外的引线框架的区域涂覆有用于焊接电镀的保护膜，并且外引线（4）镀有焊料。 然后通过激光切割将留在内引线（3）的远端的接合部（7）切断，使得内引线（3）彼此分离，从而形成最终引线框图案。 然后除去用于焊接电镀的保护膜，然后洗涤和干燥。 由于激光切割引起的热变形，内部引线（3）被防止弯曲，导致高精度的加工。

公开(公告)号：US5662822A

公开(公告)日：1997-09-02

申请号：US648026

申请日：1996-05-14

申请人： Nobuhiko Tada ,  Kojiro Ogata ,  Naoki Miyanagi ,  Yoshiaki Shimomura ,  Shigeyuki Sakurai ,  Yoshinari Nagano ,  Shinya Okumura ,  Yasushi Minomoto

发明人： Nobuhiko Tada ,  Kojiro Ogata ,  Naoki Miyanagi ,  Yoshiaki Shimomura ,  Shigeyuki Sakurai ,  Yoshinari Nagano ,  Shinya Okumura ,  Yasushi Minomoto

IPC分类号： B23K26/073 ,  B23K26/08 ,  B23K26/38 ,  H01L21/48 ,  H05K13/00 ,  B23K26/04 ,  B23K26/06

CPC分类号： B23K26/0736 ,  B23K26/083 ,  B23K26/38 ,  H01L21/4842 ,  H05K13/0092 ,  H01L2224/45144 ,  H01L2224/48091

摘要： The array condition of leads (3) is detected by a photoelectric detector (41), the detection signal is subjected to signal processing to determine the timing to oscillate a pulsed laser beam, and a laser beam axis (13C) is relatively moved at a speed (v.sub.0) with a work table (21) while oscillating a pulsed laser beam (13A), thereby cutting a dam bar (5). At this time, the longitudinal size of a spot (13B) of the pulsed laser beam (13A) is adjusted to be twice or more the width of the dam bar (5) by a longitudinal beam transformer (11a), the transverse size of the spot 13B is adjusted to be not less than 1/2 but not more than 4/5 of the length of the dam bar (5) by a transverse beam transformer (11b), and a beam rotator (11c) is appropriately operated to make the longitudinal direction of the spot (13B) substantially aligned with the longitudinal direction of the lead (3) so that the spot (13B) lies across the width (W.sub.1) of the dam bar (5). As a result, the configuration after cutting the dam bar (5) becomes highly accurate and satisfactory.

摘要翻译： PCT No.PCT / JP95 / 02064 Sec。 371日期：1996年5月14日 102（e）日期1996年5月14日PCT提交1995年10月9日PCT公布。 公开号WO96 / 12300 PCT 日期：1996年04月25日光电检测器（41）检测引线（3）的阵列条件，检测信号进行信号处理，确定振荡脉冲激光束的时序，激光束轴（13C） 在振荡脉冲激光束（13A）的同时用工作台（21）以速度（v0）相对移动，从而切割堤坝（5）。 此时，通过纵向光束变换器（11a）将脉冲激光束（13A）的光点（13B）的纵向尺寸调整为阻挡条（5）的宽度的两倍或更多，横向尺寸 通过横梁变压器（11b）将点13B调节为不小于+ E，fra 1/2 + EE但不大于+ E，挡块（5）的长度的4/5 + EE。 ，并且适当地操作光束旋转器（11c），使得光斑（13B）的纵向方向基本上与引线（3）的纵向方向对齐，使得光斑（13B）横跨宽度（W1） 坝坝（5）。 结果，切断坝条（5）后的结构变得高精度和令人满意。

公开(公告)号：US5632083A

公开(公告)日：1997-05-27

申请号：US411839

申请日：1995-04-03

申请人： Nobuhiko Tada ,  Naoki Miyanagi ,  Yoshiaki Shimomura ,  Shigeyuki Sakurai ,  Yoshinari Nagano

发明人： Nobuhiko Tada ,  Naoki Miyanagi ,  Yoshiaki Shimomura ,  Shigeyuki Sakurai ,  Yoshinari Nagano

IPC分类号： B23K26/06 ,  B23K26/073 ,  B23K26/38 ,  H01K43/00 ,  B23K26/00

CPC分类号： B23K26/0736 ,  B23K26/032 ,  B23K26/06 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0652 ,  B23K26/0665 ,  B23K26/123 ,  B23K26/38 ,  B23K2201/40 ,  H01S3/005 ,  Y10S29/016 ,  Y10T29/49121

摘要： A lead frame fabricating method and a lead frame fabricating apparatus are provided which can easily fabricate lead frames of fine pattern at a high speed, can improve dimensional accuracy and quality of the lead frames after the fabrication, and can realize mass-production at a lower cost. To this end, when cutting a metal plate 1101 by irradiation of a laser beam, a laser beam 1011 emitted in the form of pulses and having a circular section is converted by a beam section transformer 1020 into a laser beam 1012 having an elongate elliptic section. The section of the laser beam 1012 is rotated on its optical axis by a beam rotating device 1030 so that the lengthwise direction of the section of the laser beam 1012 is coincident with the lengthwise direction of each of inner leads 1013. An optical axis of a laser beam 1015 is revolved along each of concentric paths 161 to 174 around the original optical axis given when the laser beam 1011 is emitted. Alternatively, a laser beam 3011 emitted in the form of pulses and having a circular section is converted by a beam section transformer 3020 into a laser beam 3012 having an elongate elliptic section. The section of the laser beam 3012 is rotated on its optical axis by a beam rotating device 3030 so that the lengthwise direction of the section of the laser beam 3012 is coincident with the lengthwise direction of each of the inner leads 1013.

摘要翻译： PCT No.PCT / JP94 / 01292 Sec。 371日期：1995年4月3日 102（e）日期1995年4月3日PCT 1994年8月4日提交了一种引线框架制造方法和引线框架制造装置，其可以容易地以高速制造精细图案的引线框架，可以提高尺寸精度和质量 制造后的引线框架，可以以较低的成本实现批量生产。 为此，当通过激光束的照射来切割金属板1101时，以脉冲形式发射并具有圆形截面的激光束1011由光束截面变换器1020转换成具有细长椭圆形截面的激光束1012 。 激光束1012的部分通过光束旋转装置1030在其光轴上旋转，使得激光束1012的截面的长度方向与内引线1013的纵向方向一致。 激光束1015沿着沿着发射激光束1011时给出的原始光轴的每个同心路径161至174旋转。 或者，以脉冲形式发射并具有圆形截面的激光束3011由光束截面变换器3020转换成具有细长椭圆形截面的激光束3012。 激光束3012的部分通过光束旋转装置3030在其光轴上旋转，使得激光束3012的截面的长度方向与每个内引线1013的长度方向一致。

公开(公告)号：US5580466A

公开(公告)日：1996-12-03

申请号：US343446

申请日：1994-11-23

申请人： Nobuhiko Tada ,  Naoki Miyanagi ,  Yoshiaki Shimomura ,  Shigeyuki Sakurai ,  Yoshinari Nagano

发明人： Nobuhiko Tada ,  Naoki Miyanagi ,  Yoshiaki Shimomura ,  Shigeyuki Sakurai ,  Yoshinari Nagano

IPC分类号： B23K26/067 ,  B23K26/18 ,  B23K26/38 ,  B23K26/40 ,  H01L21/48 ,  H05K3/02 ,  H05K3/06 ,  H05K3/20 ,  H01L21/00 ,  B44C1/22 ,  C23F1/00

CPC分类号： B23K26/384 ,  B23K26/0619 ,  B23K26/067 ,  B23K26/18 ,  B23K26/382 ,  B23K26/40 ,  H01L21/4821 ,  H01L21/4828 ,  B23K2201/35 ,  B23K2203/50 ,  H01L2924/0002 ,  H05K3/027 ,  H05K3/061 ,  H05K3/202 ,  Y10T29/49121

摘要： An object of the present invention is to, in methods of processing metal plates and lead frames, enable workpieces to be finely processed into a satisfactory configuration with high dimensional accuracy without suffering the effect of heat produced under irradiation of a laser beam. According to the present invention, resist films (1) are first coated on both surfaces of a metal plate (1), and a laser beam (202) is then irradiated to the metal plate (101) from surfaces of the resist films (1) to form a multiplicity of discontinuous through holes (3) in line, while leaving joints (6) as not-processed portions between the adjacent through holes (3). Openings (2) formed in each resist film (1) by the laser cutting are joined with each other to serve as an etching pattern. Next, etching is carried out to etch side walls (6) defining the through holes and also to remove the joints (6), thereby interconnecting the through holes (3) formed in line to form a gap (303a) of a desired shape. Instead of forming the through holes (3) and the joints (6) in the metal plate (101) by irradiating the laser beam (202), non-penetrating cut grooves (51) may be formed in the metal plate (101) with a joint (52) left as a non-processed portion at the bottoms of the cut grooves, followed by removing the joint by etching.

摘要翻译： PCT No.PCT / JP94 / 00550 371日期1994年11月23日 102（e）1994年11月23日PCT PCT 1994年4月4日PCT公布。 出版物WO94 / 24705 日期为1994年10月27日本发明的目的在于，在金属板和引线框架的加工方法中，能够将工件精细加工成具有高尺寸精度的令人满意的结构，而不会受到激光照射下产生的热的影响 光束。 根据本发明，首先在金属板（1）的两个表面上涂覆抗蚀剂膜（1），然后从抗蚀膜（1）的表面向金属板（101）照射激光束 ）以在相邻的通孔（3）之间留下作为未处理部分的接头（6）的同时形成多个不连续的通孔（3）。 通过激光切割在每个抗蚀剂膜（1）中形成的开口（2）彼此接合以用作蚀刻图案。 接下来，进行蚀刻以蚀刻限定通孔的侧壁（6）并且还去除接头（6），从而将形成在一起的通孔（3）互相连接，形成所需形状的间隙（303a）。 代替通过照射激光束（202）在金属板（101）中形成通孔（3）和接头（6），可以在金属板（101）中形成非穿透切割槽（51） 在切割槽的底部留下作为未加工部分的接头（52），然后通过蚀刻去除接头。

公开(公告)号：US06596969B1

公开(公告)日：2003-07-22

申请号：US09700408

申请日：2000-11-15

申请人： Shigeyuki Sakurai ,  Yutaka Takano ,  Naoki Miyanagi ,  Yoshiaki Shimomura ,  Hikaru Yamamoto ,  Toru Takatani

发明人： Shigeyuki Sakurai ,  Yutaka Takano ,  Naoki Miyanagi ,  Yoshiaki Shimomura ,  Hikaru Yamamoto ,  Toru Takatani

IPC分类号： B23K909

CPC分类号： B23K28/02 ,  B23K9/0675 ,  B23K9/073 ,  B23K26/348

摘要： In an arc welding method and apparatus, a plasma (13) is generated at a welding intended position on a base material (2) by a laser (16) irradiated to the base material (2). When a discharge electrode (12) is at a minus potential, an arc discharge (4) takes place in the direction of the plasma (13) and is induced at a position irradiated with the laser (16). When the electrode (12) is at a plus potential, arc electrons are generated from a laser irradiated point and discharged to the electrode (12). When a voltage applied between the electrode (12) and the base material (2) is alternating, the polarities of the electrode (12) and the base material (2) alternately change so that the foregoing phenomena alternately occur. When the base material (2) is at a minus potential, an arc discharge (4) takes place from a laser spot. Also, in regard to the arc discharge (4), since the plasma (13) is generated by the laser (16), a stable arc discharge (4) can be generated irrespective of the state of the base material (2) or the state of the electrode (12).

摘要翻译： 在电弧焊接方法和装置中，通过照射到基材（2）的激光（16）在基材（2）上的焊接目标位置处产生等离子体（13）。 当放电电极（12）处于负电位时，在等离子体（13）的方向上发生电弧放电（4），并且在被激光器（16）照射的位置处被感应。 当电极（12）处于正电位时，从激光照射点产生电弧电子并将其放电到电极（12）。 当施加在电极（12）和基材（2）之间的电压交替时，电极（12）和基材（2）的极性交替变化，从而交替发生上述现象。 当基材（2）处于负电位时，从激光点发生电弧放电（4）。 此外，关于电弧放电（4），由于等离子体（13）由激光器（16）产生，所以可以产生稳定的电弧放电（4），而不管基材（2）的状态如何 电极（12）的状态。

公开(公告)号：US06480289B1

公开(公告)日：2002-11-12

申请号：US09331865

申请日：1999-10-13

申请人： Yoshiaki Shimomura ,  Naoki Miyanagi ,  Takashi Moro

发明人： Yoshiaki Shimomura ,  Naoki Miyanagi ,  Takashi Moro

IPC分类号： G01B1114

CPC分类号： G01B11/16 ,  E21D9/004 ,  G01C15/00

摘要： An optical deflection angle measuring apparatus which, upon optically measuring a deflection angle, does not require an operation for directing a light onto a position detecting element and makes it possible to obtain measurement results without being affected by external force such as vibrations. A detector 410 is constructed with a common lens 411 for converging diffuse lights from light sources 41,42. Position detecting elements 412-2,412-1 receive the thus-converged lights from the light sources 41,42 and detect received positions of the converged lights. Reflecting prisms 413-1,413-2 allow the diffuse lights from the light sources 41,42 to be transmitted and guided so that the diffuse lights from the light sources 42,41, are converged, by the lens 411, onto the position detecting elements 412-1,412-2. The respective position detecting elements are arranged so as not to interfere with the convergence of the lights by the lens 411. The deflection angle &PHgr; can then be measured by computation.

摘要翻译： 一种光学偏转角测量装置，其在光学测量偏转角度时，不需要将光引导到位置检测元件上的操作，并且可以获得测量结果而不受诸如振动的外力的影响。 检测器410构造有用于会聚来自光源41,42的漫射光的公共透镜411。 位置检测元件412-2,412-1从光源41,42接收由此聚光的光并检测会聚光的接收位置。 反射棱镜413-1,413-2允许来自光源41,42的漫射光被透射和引导，使得来自光源42,41的漫射光被透镜411会聚到位置检测元件412上 -1,412-2。 各个位置检测元件被布置成不会与透镜411的光的会聚干涉。然后可以通过计算来测量偏转角度PHI。

公开(公告)号：US20070203405A1

公开(公告)日：2007-08-30

申请号：US11734122

申请日：2007-04-11

申请人： Yoshiaki Shimomura

发明人： Yoshiaki Shimomura

IPC分类号： A61B5/00

CPC分类号： A61B5/1455 ,  A61B5/14532 ,  A61B2562/0238

摘要： A small and portable instrument for measuring blood sugar level of a human body noninvasively with no error comprising a light source control section for irradiating the measurement part of a finger with irradiation lights in two different near-infrared wavelength regions, photodetectors for receiving lights and of the irradiation lights quantities of transmitted lights. A relative transmittance, i.e. the ratio of the quantities of transmitted lights of the same wavelength detected at the two positions, is calculated for each wavelength and the blood sugar level is determined using the relative transmittance of each wavelength.

摘要翻译： 一种用于无波纹地测量人体血糖水平的小型便携式仪器，包括用于用两个不同的近红外波长区域中的照射光照射手指的测量部分的光源控制部分，用于接收光的光电检测器和 照射灯数量的透光灯。 对于每个波长计算相对透射率，即在两个位置处检测到的相同波长的透射光的量的比率，并且使用每个波长的相对透射率来确定血糖水平。

公开(公告)号：US07613487B2

公开(公告)日：2009-11-03

申请号：US11734122

申请日：2007-04-11

申请人： Yoshiaki Shimomura

发明人： Yoshiaki Shimomura

IPC分类号： A61B5/1455

CPC分类号： A61B5/1455 ,  A61B5/14532 ,  A61B2562/0238

摘要： A small and portable instrument for measuring blood sugar level of a human body noninvasively with no error comprising a light source control section for irradiating the measurement part of a finger with irradiation lights in two different near-infrared wavelength regions, photodetectors for receiving lights and of the irradiation lights quantities of transmitted lights. A relative transmittance, i.e. the ratio of the quantities of transmitted lights of the same wavelength detected at the two positions, is calculated for each wavelength and the blood sugar level is determined using the relative transmittance of each wavelength.

摘要翻译： 一种用于无波纹地测量人体血糖水平的小型便携式仪器，包括用于用两个不同的近红外波长区域中的照射光照射手指的测量部分的光源控制部分，用于接收光的光电检测器和 照射灯数量的透光灯。 对于每个波长计算相对透射率，即在两个位置处检测到的相同波长的透射光的量的比率，并且使用每个波长的相对透射率来确定血糖水平。