摘要:
In an arc welding method and apparatus, a plasma (13) is generated at a welding intended position on a base material (2) by a laser (16) irradiated to the base material (2). When a discharge electrode (12) is at a minus potential, an arc discharge (4) takes place in the direction of the plasma (13) and is induced at a position irradiated with the laser (16). When the electrode (12) is at a plus potential, arc electrons are generated from a laser irradiated point and discharged to the electrode (12). When a voltage applied between the electrode (12) and the base material (2) is alternating, the polarities of the electrode (12) and the base material (2) alternately change so that the foregoing phenomena alternately occur. When the base material (2) is at a minus potential, an arc discharge (4) takes place from a laser spot. Also, in regard to the arc discharge (4), since the plasma (13) is generated by the laser (16), a stable arc discharge (4) can be generated irrespective of the state of the base material (2) or the state of the electrode (12).
摘要:
A welding method is disclosed for butt welding a first base material 1 and a second base material 2 with each other. To also permit stable and efficient formation of a bead in the form of a fillet weld on a back side of a groove by conducting arc welding from the side of the groove without arranging a bead beforehand on the back side of the groove, the first member 1, on which a root face 1a and a single groove face 1b have been formed, is brought at its root face 1a into contact with a flat surface 2a of the second base material 2. A welding wire 6 is arranged facing on the groove formed by the contact between the first base material 1 and the second base material 2. The first base material 1 and the second material 2 are caused to fuse at an area of contact between them by an arc from the welding wire 6. A melt, which has been formed by the fusion at the area of contact and the like, is forced out to the back side of the groove to form a bead B4 in the form of a fillet weld on the back side of the groove.
摘要:
Detecting light from a detecting light source (122) is irradiated to a workpiece (1) and the reflected light is detected by a photosensor (126). At the same time, light resulting from emission of plume produced upon laser processing is also detected by the photosensor (126). A laser controller (26) binary-codes a detection signal from the photosensor (126) to provide a rectangular wave signal (TP) and, based on the rectangular wave signal (TP), generates a trigger signal (TP.sub.2) for oscillating a processing laser beam. At this time, the trigger signal (TP.sub.2) is fed back to generate a gate signal (GP) and, based on the gate signal (GP), the detection signal resulted from the emission of the plume is omitted in the gate circuit (245) to produce a trigger signal (TP.sub.G). This trigger signal (TP.sub.G) is given with a delay time (T.sub.D) to produce a trigger signal (TP.sub.1). The above trigger signal (TP.sub.2) is generated in synch with the trigger signal (TP.sub.1). As a result, the laser processing is prevented from being applied unnecessarily based on the light generated upon the laser processing.
摘要:
In a method for forming a lead frame (1) from a metallic plate, a metallic plate (11) is first etched to form outer leads (4) and outer portions (3b) of inner leads of the lead frame (1). Inner portions (3a) of the inner leads (3) are then laser-cut under the condition that a joint portion (7) is left so as to interconnect the inner leads (3) at their distal ends. Mechanical surface treatment and chemical surface treatment are then carried out to remove dross (10), spatters (9) and oxide films deposited during the laser cutting. Inner areas of the inner leads (3) connected to respective terminals of a semiconductor chip are then plated with gold to form plated terminal portions (3A). Subsequently, the region of the lead frame other than the outer leads (4) is coated with a protective film for solder plating and the outer leads (4) are plated with solder. The joint portion (7) left at the distal ends of the inner leads (3) is then cut off by laser cutting so that the inner leads (3) are separated from one another, thereby forming a final lead frame pattern. The protective film for solder plating is then removed, followed by washing and drying. The inner leads (3) are prevented from being curved due to thermal deformations with the laser cutting, resulting in highly accurate processing.
摘要:
The array condition of leads (3) is detected by a photoelectric detector (41), the detection signal is subjected to signal processing to determine the timing to oscillate a pulsed laser beam, and a laser beam axis (13C) is relatively moved at a speed (v.sub.0) with a work table (21) while oscillating a pulsed laser beam (13A), thereby cutting a dam bar (5). At this time, the longitudinal size of a spot (13B) of the pulsed laser beam (13A) is adjusted to be twice or more the width of the dam bar (5) by a longitudinal beam transformer (11a), the transverse size of the spot 13B is adjusted to be not less than 1/2 but not more than 4/5 of the length of the dam bar (5) by a transverse beam transformer (11b), and a beam rotator (11c) is appropriately operated to make the longitudinal direction of the spot (13B) substantially aligned with the longitudinal direction of the lead (3) so that the spot (13B) lies across the width (W.sub.1) of the dam bar (5). As a result, the configuration after cutting the dam bar (5) becomes highly accurate and satisfactory.
摘要:
A lead frame fabricating method and a lead frame fabricating apparatus are provided which can easily fabricate lead frames of fine pattern at a high speed, can improve dimensional accuracy and quality of the lead frames after the fabrication, and can realize mass-production at a lower cost. To this end, when cutting a metal plate 1101 by irradiation of a laser beam, a laser beam 1011 emitted in the form of pulses and having a circular section is converted by a beam section transformer 1020 into a laser beam 1012 having an elongate elliptic section. The section of the laser beam 1012 is rotated on its optical axis by a beam rotating device 1030 so that the lengthwise direction of the section of the laser beam 1012 is coincident with the lengthwise direction of each of inner leads 1013. An optical axis of a laser beam 1015 is revolved along each of concentric paths 161 to 174 around the original optical axis given when the laser beam 1011 is emitted. Alternatively, a laser beam 3011 emitted in the form of pulses and having a circular section is converted by a beam section transformer 3020 into a laser beam 3012 having an elongate elliptic section. The section of the laser beam 3012 is rotated on its optical axis by a beam rotating device 3030 so that the lengthwise direction of the section of the laser beam 3012 is coincident with the lengthwise direction of each of the inner leads 1013.
摘要:
An object of the present invention is to, in methods of processing metal plates and lead frames, enable workpieces to be finely processed into a satisfactory configuration with high dimensional accuracy without suffering the effect of heat produced under irradiation of a laser beam. According to the present invention, resist films (1) are first coated on both surfaces of a metal plate (1), and a laser beam (202) is then irradiated to the metal plate (101) from surfaces of the resist films (1) to form a multiplicity of discontinuous through holes (3) in line, while leaving joints (6) as not-processed portions between the adjacent through holes (3). Openings (2) formed in each resist film (1) by the laser cutting are joined with each other to serve as an etching pattern. Next, etching is carried out to etch side walls (6) defining the through holes and also to remove the joints (6), thereby interconnecting the through holes (3) formed in line to form a gap (303a) of a desired shape. Instead of forming the through holes (3) and the joints (6) in the metal plate (101) by irradiating the laser beam (202), non-penetrating cut grooves (51) may be formed in the metal plate (101) with a joint (52) left as a non-processed portion at the bottoms of the cut grooves, followed by removing the joint by etching.
摘要:
A bearing apparatus has a porous bush (9) impregnated with lubricant and a shaft (10) supported by the bush (9). The shaft (10) has a quench hardened section (10a) formed in the form of a projection, and an indentation (10b) which is formed between portions of the quench hardened section (10a) and traps lubricant flowing out of the bush (9).
摘要:
Provided are a novel sliding bearing and a construction machine provided with same, the sliding bearing being capable of maintaining an excellent sliding performance over a long period of time and exhibiting an excellent strength. A sliding bearing (100) includes at least a brush (10) and a shaft part (20), the shaft part (20) being provided with a grease feeding pathway (70) for feeding grease (G) from the exterior to the sliding surfaces of the shaft part (20) and the bush (10), the bush (10) being formed from a porous sintered metal, and a decomposition catalyst (S) being adhered to the sliding surface of the bush (10).
摘要:
In this grease composition, a grease produced by mixing at least one base oil selected from a mineral oil-type lubricant base oil, a synthetic lubricant base oil, and a biodegradable lubricant base oil with a thickener is compounded with a wax and water, and an additive such as a surfactant and a defoamer is optionally compounded therewith. A soap containing a calcium sulfonate complex is used as the thickener. A carnauba wax is preferably used as the wax. Since this grease composition is mainly composed of a grease and a wax, the grease composition extremely facilities its removal operation after application, is environmentally friendly, and has extremely excellent anti-corrosion performance. When the grease composition is used by being applied to a base material of an object to be welded, an effect of preventing the adhesion of welding spatters can be obtained.