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32 条记录 (耗时 0.038 秒)

    Dentifrice composition
    4.
    发明授权
    Dentifrice composition 失效
    牙粉组合物

    公开(公告)号：US4576816A

    公开(公告)日：1986-03-18

    申请号：US407901

    申请日：1982-08-13

    申请人： Nobuo Suganuma ,  Masafumi Anzai ,  Nobuyuki Takada ,  Hiromichi Ichikawa

    发明人： Nobuo Suganuma ,  Masafumi Anzai ,  Nobuyuki Takada ,  Hiromichi Ichikawa

    IPC分类号： A61K8/21 ,  A61K8/26 ,  A61K8/66 ,  A61Q11/00 ,  A61K7/18 ,  A61K7/20

    CPC分类号： A61K8/26 ,  A61K8/66 ,  A61Q11/00

    摘要： A dentifrice composition is disclosed which comprises 100-100,000 units per gram of the composition of dextranase and 20-90% by weight of the composition of an aluminum oxide compound having the formula:Al.sub.2 O.sub.3.nH.sub.2 Owherein n.gtoreq.0, with an average particle size of 1-50 microns as a main abrasive. Dextranase is maintained stable in the dentifrice composition and the composition itself is stable, subject to minimal aging discoloration.

    摘要翻译： 公开了一种洁齿剂组合物，其包含每克组合物为100-100,000单位的葡聚糖酶和20-90重量％组合物的具有下式的氧化铝化合物：Al 2 O 3·nH 2 O，其中n≥0，平均值 粒度为1-50微米的主要研磨剂。 糊精酶在洁牙剂组合物中保持稳定，并且组合物本身是稳定的，经历最小的老化变色。

    Substrate holding apparatus
    5.
    发明授权
    Substrate holding apparatus 有权
    基板保持装置

    公开(公告)号：US07850509B2

    公开(公告)日：2010-12-14

    申请号：US12285936

    申请日：2008-10-16

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B7/22

    CPC分类号： B24B37/30 ,  B24B41/061

    摘要： The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

    摘要翻译： 本发明涉及一种用于将基板保持并压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于接触基板的弹性垫和用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于接触弹性垫的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

    Carrier device in polishing apparatus and method for controlling carrier device
    7.
    发明授权
    Carrier device in polishing apparatus and method for controlling carrier device 有权
    抛光装置中的载体装置及载体装置的控制方法

    公开(公告)号：US06241578B1

    公开(公告)日：2001-06-05

    申请号：US09357843

    申请日：1999-07-21

    申请人： Tetsuji Togawa ,  Nobuyuki Takada

    发明人： Tetsuji Togawa ,  Nobuyuki Takada

    IPC分类号： B24B900

    CPC分类号： B24D15/02 ,  B24B37/013 ,  B24B41/061 ,  B24B49/16

    摘要： A carrier device is adapted for use in a polishing apparatus with a turntable having a polishing surface. The carrier device includes a carrier for carrying an article to be polished and a control device operatively associated with the carrier. The control device includes an actuator operable to cause the carrier to urge the article against the polishing surace of the turntable to polish the article, a sensor operatively associated with the actuator and operable to sense a pressure as applied to the article when the article is urged against the polishing surface of the turntable and a control unit operatively associated with the actuator and the sensor so as to monitor the pressure during a polishing operation. The control unit is operable to control operation of the actuator in response to the pressure as monitored so as to keep the pressure at a target level and halt the polishing operation when the pressure is deviated from a predetermined range over a predetermined period of time.

    摘要翻译： 载体装置适用于具有抛光表面的转台的抛光装置。 载体装置包括用于承载待抛光制品的载体和与载体可操作地相关联的控制装置。 所述控制装置包括致动器，所述致动器可操作以使所述载体将所述物品推向所述转盘的抛光轮廓以抛光所述物品，所述传感器与所述致动器可操作地相关联并且可操作以感测当所述物品被推动时施加到所述物品上的压力 抵靠转盘的抛光表面和与致动器和传感器可操作地相关联的控制单元，以便在抛光操作期间监测压力。 控制单元可操作以响应于所监视的压力来控制致动器的操作，以便当压力在预定时间段内偏离预定范围时将压力保持在目标水平并停止抛光操作。

    Polishing apparatus
    8.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US6042455A

    公开(公告)日：2000-03-28

    申请号：US208987

    申请日：1998-12-11

    申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Nobuyuki Takada

    发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Nobuyuki Takada

    IPC分类号： B24B37/34 ,  B24B53/007 ,  B24B53/017 ,  B24B55/06 ,  B24B55/12 ,  H01L21/00 ,  B24B49/00

    CPC分类号： H01L21/67219 ,  B24B37/345 ,  B24B53/017 ,  B24B55/06 ,  B24B55/12

    摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes an enclosing structure having an outer wall and at least one door, a polishing section enclosed by the enclosing structure for polishing a surface of a workpiece by holding the workpiece and pressing the workpiece against a polishing surface of a turntable, a sensor for detecting an opening or closing of the door, and an exhaust system for exhausting ambient air from an interior of the enclosing structure. The polishing apparatus further includes an adjusting mechanism for adjusting an amount of air which is exhausted from the interior of the enclosing structure. The amount of air exhausted from the interior of the enclosing structure is reduced by the adjusting mechanism when the door is closed, and the amount of air exhausted from the interior of the enclosing structure is increased by the adjusting mechanism when the door is opened.

    摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有外壁和至少一个门的封闭结构，由封闭结构封闭的抛光部分，用于通过保持工件并将工件压靠在转台的抛光表面上来抛光工件的表面，传感器 用于检测门的打开或关闭;以及用于从封闭结构的内部排出环境空气的排气系统。 抛光装置还包括调节机构，用于调节从封闭结构内部排出的空气量。 当门关闭时，通过调节机构减少从封闭结构内部排出的空气量，并且当门打开时通过调节机构从封闭结构的内部排出的空气量增加。

    Polishing apparatus
    10.
    发明授权
    Polishing apparatus 有权
    抛光设备

    公开(公告)号：US06447385B1

    公开(公告)日：2002-09-10

    申请号：US09605989

    申请日：2000-06-29

    申请人： Tetsuji Togawa ,  Nobuyuki Takada

    发明人： Tetsuji Togawa ,  Nobuyuki Takada

    IPC分类号： B24B500

    CPC分类号： B24B37/345

    摘要： A polishing apparatus applicable to a dry-in/dry-out polishing system is capable of increasing the capacity of processing substrates to be polished, e.g. semiconductor wafers, per unit of time and per unit area of installation. A polishing unit includes a turntable having a polishing surface, and at least two wafer carriers each adapted to hold a wafer and to press the wafer against the polishing surface. Each wafer carrier is supported by a pivot shaft and movable between a polishing position where the wafer is polished on the turntable and a transfer position for transferring the wafer. The at least two wafer carriers can be situated at the polishing position simultaneously and also alternately.

    摘要翻译： 适用于干式/干式抛光系统的抛光装置能够增加处理待抛光衬底的能力，例如， 半导体晶片，每单位时间和每单位安装面积。 抛光单元包括具有抛光表面的转盘和至少两个晶片载体，每个晶片载体适于保持晶片并将晶片压靠在抛光表面上。 每个晶片载体由枢转轴支撑，并且可在转盘上抛光晶片的抛光位置和用于转移晶片的转移位置之间移动。 至少两个晶片载体可以同时并且交替地位于抛光位置。