摘要:
In laser annealing using a solid state laser, a focus position of a minor axial direction of a rectangular beam is easily corrected depending on positional variation of a laser irradiated portion of a semiconductor film. By using a minor-axis condenser lens 29 condensing incident light in a minor axial direction and a projection lens 30 projecting light, which comes from the minor-axis condenser lens 29, onto a surface of a semiconductor film 3, laser beam 1 is condensed on the surface of the semiconductor film 3 in the minor axial direction of a rectangular beam. The positional variation of a vertical direction of the semiconductor film 3 in a laser irradiated portion of the semiconductor film 3 is detected by a positional variation detector 31, and the minor-axis condenser lens 29 is moved in an optical axis direction based on a value of the detection.
摘要:
In the case of a lens array type homogenizer optical system, the incident angle and intensity of a laser beam 1 entering a large-sized lens (long-axis condenser lens 22) of a long-axis condensing optical system, which is provided on the rear side, are changed for every shot by performing laser irradiation while long-axis lens arrays 20a and 20b are reciprocated in a direction corresponding to a long axial direction of a linear beam (X-direction). Therefore, vertical stripes are significantly reduced. Further, the incident angle and intensity of a laser beam 1 entering a large-sized lens (projection lens 30) of a short-axis condensing optical system, which is provided on the rear side, are changed for every shot by performing laser irradiation while short-axis lens arrays 26a and 26b are reciprocated in a direction corresponding to a short axial direction of a linear beam (Y-direction). Therefore, horizontal stripes are significantly reduced.
摘要:
A laser annealing method for executing laser annealing by irradiating a semiconductor film formed on a surface of a substrate with a laser beam, the method including the steps of, generating a linearly polarized rectangular laser beam whose cross section perpendicular to an advancing direction is a rectangle with an electric field directed toward a long-side direction of the rectangle or an elliptically polarized rectangular laser beam having a major axis directed toward a long-side direction, causing the rectangular laser beam to be introduced to the surface of the substrate, and setting a wavelength of the rectangular laser beam to a length which is about a desired size of a crystal grain in a standing wave direction.
摘要:
A laser annealing method for executing laser annealing by irradiating a semiconductor film formed on a surface of a substrate with a laser beam, the method including the steps of, generating a linearly polarized rectangular laser beam whose cross section perpendicular to an advancing direction is a rectangle with an electric field directed toward a long-side direction of the rectangle or an elliptically polarized rectangular laser beam having a major axis directed toward a long-side direction, causing the rectangular laser beam to be introduced to the surface of the substrate, and setting a wavelength of the rectangular laser beam to a length which is about a desired size of a crystal grain in a standing wave direction.
摘要:
The energy distribution in the short-side direction of a rectangular laser beam applied to an amorphous semiconductor film (amorphous silicon film) is uniformized. It is possible to the energy distribution in the short-side direction of the rectangular laser beam by the use of a cylindrical lens array 26 or a light guide 36 and concentrating optical systems 28 and 44 or by the use of an optical system including a diffracting optical element. Accordingly, since the effective energy range of a laser beam applied to the amorphous semiconductor film is widened and the transport speed of a substrate 3 can be enhanced as much, it is possible to improve the processing ability of the laser annealing.
摘要:
A secondary battery protection circuit for a secondary battery includes: a reference voltage circuit configured to generate a reference voltage by using a depletion-type transistor and a transistor unit of enhancement type connected in series with the depletion-type transistor; a voltage divider configured to output a detection voltage obtained by dividing a power source voltage of the secondary battery; a detection circuit configured to detect an abnormal state of the secondary battery based on the reference voltage and the detection voltage; a first adjustment circuit configured to adjust a size ratio of the depletion-type transistor to the transistor unit based on threshold voltages of the depletion-type transistor and the transistor unit; and a second adjustment circuit configured to adjust the detection voltage based on the reference voltage after adjusting the size ratio.
摘要:
There is provided a method of correcting an overcurrent detection voltage of a battery protection integrated circuit including a current path between a first terminal and a second terminal, one or more transistors for controlling current of a secondary battery, an overcurrent detection circuit and a control circuit. The method comprises the steps of: measuring a resistance value between the first terminal and the second terminal wherein the one or more transistors are turned on at a predetermined temperature; estimating resistance values between the first terminal and the second terminal at respective temperatures based on the measured resistance value; calculating adjusting data for canceling temperature dependency of charge or discharge current of the secondary battery based on the measured resistance value and the estimated resistance values, wherein a value of the charge or discharge current varies depending on temperature; correcting the overcurrent detection voltage based on the calculated adjusting data.
摘要:
A battery protection IC has detection circuits to detect faults of an overcharge, an over-discharge, and an overcurrent of a secondary battery; a control circuit to protect the secondary battery, by controlling (dis)charging the secondary battery upon the fault; and a delay circuit to generate delay after the fault before the controlling. The IC includes a memory unit to store data for setting and adjusting a circuit characteristic of the IC; and a setting circuit to set and adjust the circuit characteristic, based on the data from the memory unit. The memory unit includes a pair of non-volatile memory cells to complementarily store one bit, and a latch circuit directly cross-coupled with the memory cells, for each bit of the data. The latch circuit statically outputs the data from the memory cells to the setting circuit when the IC is turned on.
摘要:
A battery protection integrated circuit includes a switch unit; a control unit that controls on and off of the switch unit based on a monitored result; a package; a plurality of external connection terminals that are electrically connected to a plurality of terminal portions of the switch unit and the control unit, respectively, all of the external connection terminals that are to be connected to a first terminal of a circuit board being provided at a first short side of the terminal providing surface that faces one of board short sides of a circuit board, and all of the external connection terminals that are to be connected to a second terminal of the circuit board being provided at a second short side that is opposite to the first short side, when being mounted on the circuit board.
摘要:
A compound semiconductor is placed in a reaction vessel (12) of which the inner gas is subjected to replacement with a low-vapor-pressure gas (2) whose equilibrium vapor pressure at the melting point of the compound semiconductor is 1 atm or lower. The low-vapor-pressure gas is urged to flow along the surface of the compound semiconductor while keeping the internal pressure of the reaction vessel at a value not lower than that equilibrium vapor pressure. The surface of the compound semiconductor is irradiated with a pulsed-laser light (3) whose photon energy is higher than the band gap of the compound semiconductor. Thus, only that part of the compound semiconductor which is located at the pulsed-laser light irradiation position is instantly heated and melted while keeping the atmospheric temperature of the low-vapor-pressure gas at a room temperature or a temperature equal to or lower than the decomposition temperature.