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8 条记录 (耗时 0.013 秒)

    Image pickup apparatus for endoscope, and endoscope
    2.
    发明授权
    Image pickup apparatus for endoscope, and endoscope 有权

    公开(公告)号：US11895381B2

    公开(公告)日：2024-02-06

    申请号：US17396081

    申请日：2021-08-06

    申请人： OLYMPUS CORPORATION

    发明人： Jumpei Yoneyama

    IPC分类号： H04N23/54 ,  H04N23/55 ,  H04N23/50

    CPC分类号： H04N23/54 ,  H04N23/55 ,  H04N23/555

    摘要： An image pickup apparatus for endoscope includes: an image pickup member provided with a plurality of image pickup side faces; a first optical member provided with first side faces; a first bonding layer bonding together the image pickup member and the first optical member; a second optical member provided with second side faces; and a second bonding layer bonding together the second optical member and the first optical member, in which a plurality of first side faces include first near side faces closer to an optical axis than are the second side faces and the image pickup side faces, and the image pickup apparatus for endoscope further includes a sealing resin covering the first near side faces, at least part of the first bonding layer, and the second bonding layer.

    Image pickup apparatus for endoscope
    3.
    发明授权
    Image pickup apparatus for endoscope 有权

    公开(公告)号：US10484581B2

    公开(公告)日：2019-11-19

    申请号：US15817941

    申请日：2017-11-20

    申请人： OLYMPUS CORPORATION

    发明人： Jumpei Yoneyama

    IPC分类号： A01B1/04 ,  H04N5/225 ,  A61B1/04 ,  A61B1/00 ,  G02B23/24 ,  A61B1/05

    摘要： An image pickup apparatus for an endoscope includes: an image pickup device including a row of external electrodes provided on an end portion of a light receiving surface; and a wiring board including end portion electrodes ultrasonically bonded to the external electrodes, in which a plurality of grooves are formed in a back face of the image pickup device, and the plurality of grooves are inclined relative to a vibration direction of ultrasonic vibration during the ultrasonic bonding.

    Method of manufacturing wiring board and wiring board
    4.
    发明授权
    Method of manufacturing wiring board and wiring board 有权

    公开(公告)号：US10321582B2

    公开(公告)日：2019-06-11

    申请号：US15652337

    申请日：2017-07-18

    申请人： OLYMPUS CORPORATION

    发明人： Jumpei Yoneyama

    IPC分类号： H05K3/46 ,  H05K3/40 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36

    摘要： A method of manufacturing a wiring board includes a stacking process in which N (N is an integer equal to or greater than 2) wiring layers, end portions of which include linear conductor patterns, are stacked, with the end portions superimposed, via substrates (insulating layers) provided among the wiring layers and a laminated plate is manufactured and a removing process in which the insulating layers around the end portions of the conductor patterns of the laminated plate are removed to machine the end portions into N flying leads projecting from an end face.

    Image pickup apparatus, endoscope and image pickup apparatus manufacturing method
    5.
    发明授权
    Image pickup apparatus, endoscope and image pickup apparatus manufacturing method 有权

    公开(公告)号：US10600831B2

    公开(公告)日：2020-03-24

    申请号：US16122974

    申请日：2018-09-06

    申请人： OLYMPUS CORPORATION

    发明人： Jumpei Yoneyama

    IPC分类号： H01L27/146 ,  H04N5/369

    摘要： An image pickup apparatus includes: an image pickup device with a light receiving portion being formed on a light receiving face; cover glass bonded to the light receiving face; and a wiring board bonded to a back face of the image pickup device; wherein an alignment mark is present on each of two orthogonal side faces, the alignment mark being at a predetermined relative position relative to the light receiving portion.

    Method for manufacturing endoscope image pickup module, endoscope image pickup module and endoscope
    6.
    发明授权
    Method for manufacturing endoscope image pickup module, endoscope image pickup module and endoscope 有权

    公开(公告)号：US10326919B2

    公开(公告)日：2019-06-18

    申请号：US15785580

    申请日：2017-10-17

    申请人： OLYMPUS CORPORATION

    发明人： Jumpei Yoneyama

    IPC分类号： H01L31/0232 ,  H04N5/225 ,  H01L27/146 ,  G02B23/24 ,  H01L23/00

    摘要： A method for manufacturing an endoscope image pickup module includes a process of creating a transparent plate with support plates in which the support plates are disposed on side faces of cover glass, a first resin disposing process of disposing uncured first resin in a light receiving section of an image pickup device, a process of fixing a jig to the support plates, a positioning process of arranging the transparent plate with support plates on the image pickup device so that the cover glass covers the light receiving section but does not cover connection electrodes, a process of radiating UV light from above a first principal surface of the cover glass and curing the first resin and a process of separating the support plates from the transparent plate with support plates.