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    Cable connection structure, imaging module, and endoscope
    4.
    发明授权
    Cable connection structure, imaging module, and endoscope 有权

    公开(公告)号：US10912448B2

    公开(公告)日：2021-02-09

    申请号：US15968824

    申请日：2018-05-02

    申请人： OLYMPUS CORPORATION

    发明人： Masato Mikami

    IPC分类号： A61B1/00 ,  A61B1/05 ,  A61B1/04 ,  H01R4/02 ,  H01R12/62 ,  H01B11/00 ,  H01B11/18 ,  H01B11/20

    摘要： A cable connection structure includes: a substrate including a first core wire connection electrode, a second core wire connection electrode, and a shield connection electrode; a single-wire cable including a first core wire, and an insulant; at least two coaxial cables each including a second core wire, an inner insulant, a shield, and an outer insulant, wherein the second core wire, the inner insulant, and the shield are exposed in a step-by-step manner at a distal end portion, and the second core wire and the shield are respectively connected to the second core wire connection electrode and the shield connection electrode; and a conductive member connecting exposed portions of the shields. The conductive member is disposed directly on an upper surface of the insulant, and connects the shields on the shield connection electrode and/or a position closer to a proximal end side than the shield connection electrode.

    Multi-chip semiconductor device
    5.
    发明授权
    Multi-chip semiconductor device 有权

    公开(公告)号：US09905534B2

    公开(公告)日：2018-02-27

    申请号：US15007402

    申请日：2016-01-27

    申请人： OLYMPUS CORPORATION

    发明人： Masato Mikami ,  Takanori Sekido

    IPC分类号： H01L23/48 ,  H01L29/40 ,  H01L25/065 ,  H01L25/00 ,  H01L23/31

    CPC分类号： H01L25/065 ,  H01L23/3178 ,  H01L25/00 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/11 ,  H01L2224/1302 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A multi-chip semiconductor device includes a plate-shaped first semiconductor chip having a first connection portion in which a first semiconductor chip electrode is formed on a first main surface of the first semiconductor chip or on a first side surface vertical to the first main surface, and a plate-shaped second semiconductor chip having a second connection portion in which a second semiconductor chip electrode is formed on a second side surface vertical to a second main surface of the second semiconductor chip. Each of the first and second connection portions includes at least an inclined surface that is inclined with respect to each of the first and second main surfaces. The first connection portion and the second connection portion are connected to each other such that the first main surface of the first semiconductor chip and the second main surface of the second semiconductor chip are vertical to each other.

    Multi-chip semiconductor device
    6.
    发明授权
    Multi-chip semiconductor device 有权
    多芯片半导体器件

    公开(公告)号：US09281294B2

    公开(公告)日：2016-03-08

    申请号：US14031218

    申请日：2013-09-19

    申请人： OLYMPUS CORPORATION

    发明人： Masato Mikami ,  Takanori Sekido

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L25/00 ,  H01L25/065

    CPC分类号： H01L25/065 ,  H01L23/3178 ,  H01L25/00 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/11 ,  H01L2224/1302 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A multi-chip semiconductor device includes a plate-shaped first semiconductor chip having a first connection portion in which a first semiconductor chip electrode is formed on a first main surface of the first semiconductor chip or on a first side surface vertical to the first main surface, and a plate-shaped second semiconductor chip having a second connection portion in which a second semiconductor chip electrode is formed on a second side surface vertical to a second main surface of the second semiconductor chip. Each of the first and second connection portions includes at least an inclined surface that is inclined with respect to each of the first and second main surfaces. The first connection portion and the second connection portion are connected to each other such that the first main surface of the first semiconductor chip and the second main surface of the second semiconductor chip are vertical to each other.

    摘要翻译： 一种多芯片半导体器件，包括具有第一连接部的板状的第一半导体芯片，第一半导体芯片电极形成在第一半导体芯片的第一主面上或者与第一主面垂直的第一侧面 以及具有第二连接部的板状的第二半导体芯片，其中第二半导体芯片电极形成在与第二半导体芯片的第二主表面垂直的第二侧表面上。 第一和第二连接部分中的每一个至少包括相对于第一和第二主表面中的每一个倾斜的倾斜表面。 第一连接部分和第二连接部分彼此连接，使得第一半导体芯片的第一主表面和第二半导体芯片的第二主表面彼此垂直。

    Cable connection substrate, imaging apparatus, endoscope, and method of manufacturing imaging apparatus
    7.
    发明授权
    Cable connection substrate, imaging apparatus, endoscope, and method of manufacturing imaging apparatus 有权

    公开(公告)号：US11259693B2

    公开(公告)日：2022-03-01

    申请号：US16174879

    申请日：2018-10-30

    申请人： OLYMPUS CORPORATION

    发明人： Masato Mikami ,  Takanori Sekido

    IPC分类号： A61B1/05 ,  A61B1/04 ,  A61B1/00

    摘要： A cable connection substrate includes: a first substrate that is provided with, on a front surface of the first substrate, a first connection electrode to be connected to a sensor electrode of an imaging element, and provided with a second connection electrode on a back surface side of the first substrate; and a second substrate that is provided with, on a front surface of the second substrate, a third connection electrode to be connected to the second connection electrode, and provided with, on a top surface side of the second substrate, the top surface being a side surface perpendicular to the front surface of the second substrate, a plurality of cable connection electrodes to be connected to a plurality of cables. A sum of effective conductor areas of the plurality of cable connection electrodes is greater than a sum of effective conductor areas of the third connection electrode.

    Cable structure, mount module, and endoscope
    8.
    发明授权
    Cable structure, mount module, and endoscope 有权

    公开(公告)号：US10770811B2

    公开(公告)日：2020-09-08

    申请号：US16438650

    申请日：2019-06-12

    申请人： OLYMPUS CORPORATION

    发明人： Masato Mikami

    IPC分类号： H01R12/53 ,  A61B1/00 ,  H01R4/02 ,  H01R43/28 ,  H02G15/02 ,  H02G15/06 ,  H04N5/225 ,  A61B1/04 ,  H01R9/24

    摘要： A cable structure includes: a plurality of cables each including a conductor part and an electrically-insulative covering part, each conductor part being exposed in a part where the covering part at one end thereof is removed; and a cable fixing part formed by resin molding and configured to hold the plurality of cables while the ends of the plurality of cables exposing the conductor parts are aligned, wherein the cable fixing part includes a bottom face opening formed on a bottom face side facing a member to which the cables are connected and a top face opening formed on a top face side opposing the bottom face, the bottom face side and the top face side exposing the conductor parts.

    Cable connection structure and endoscope apparatus
    9.
    发明授权
    Cable connection structure and endoscope apparatus 有权

    公开(公告)号：US10517465B2

    公开(公告)日：2019-12-31

    申请号：US15358330

    申请日：2016-11-22

    申请人： OLYMPUS CORPORATION

    发明人： Masato Mikami

    IPC分类号： A61B1/00 ,  H05K1/11

    摘要： A cable connection structure includes: a cable having a core and a jacket made of an insulating material to cover the core; and a substrate connected with the cable. The substrate includes: a base material made of an insulating material; an external connection electrode formed on a surface of the base material and connected with the core; and a via provided in the base material and having an end exposed from a mounting surface of the substrate on which the cable is mounted, the via being connected with the external connection electrode. The via is provided at least at one of both ends of a surface of the external connection electrode perpendicular to an axial direction of the cable, on a proximal end side of the cable.