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公开(公告)号:US11217613B2
公开(公告)日:2022-01-04
申请号:US16687660
申请日:2019-11-18
Applicant: OmniVision Technologies, Inc.
Inventor: Bill Phan , Yuanliang Liu , Duli Mao , Seong Yeol Mun , Alireza Bonakdar
IPC: H01L27/146 , H04N5/378
Abstract: An image sensor includes a substrate material. The substrate material includes a plurality of photodiodes disposed therein. The plurality of photodiodes includes a plurality of small photodiodes (SPDs) and a plurality of large photodiodes (LPDs) larger than the SPDs. An array of color filters is disposed over the substrate material. A buffer layer is disposed between the substrate material and the array of color filters. A metal pattern is disposed between the color filters in the array of color filters, and between the array of color filters and the buffer layer. An attenuation layer is disposed between the substrate material and the array of color filters. The attenuation layer is above and aligned with the plurality of SPDs and a portion of each of the plurality of LPDs. An edge of the attenuation layer is over one of the plurality of LPDs.
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公开(公告)号:US11557625B2
公开(公告)日:2023-01-17
申请号:US16853684
申请日:2020-04-20
Applicant: OmniVision Technologies, Inc.
Inventor: Chia-Ying Liu , Wu-Zang Yang , Chia-Jung Liu , Ming Zhang , Yin Qian , Alireza Bonakdar
IPC: H01L27/146 , H01L31/0216 , H01L31/14 , H01L31/0352
Abstract: An image sensor with embedded wells for accommodating light emitters includes a semiconductor substrate including an array of doped sensing regions respectively corresponding to an array of photosensitive pixels of the image sensor. The semiconductor substrate forms an array of wells. Each well is aligned with a respective doped sensing region to facilitate detection, by the photosensitive pixel that includes said respective doped sensing region, of light emitted to the photosensitive pixel by a light emitter disposed in the well. The image sensor further includes, between adjacent doped sensing regions, a light-blocking barrier to reduce propagation of light to the doped sensing-region of each photosensitive pixel from wells not aligned therewith.
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公开(公告)号:US20210202546A1
公开(公告)日:2021-07-01
申请号:US16729176
申请日:2019-12-27
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Yuanliang Liu , Bill Phan , Duli Mao , Alireza Bonakdar
IPC: H01L27/146
Abstract: Image sensors include a substrate material having a plurality of small photodiodes (SPDs) and a plurality of large photodiodes (LPDs) disposed therein. A plurality of pixel isolators is formed in the substrate material, each pixel isolator being disposed between one of the SPDs and one of the LPDs. A passivation layer is disposed on the substrate material and a buffer layer is disposed on the passivation layer. A plurality of first metal elements is disposed in the buffer layer, each first metal element being disposed over one of the pixel isolators, and a plurality of second metal elements is disposed over the plurality of first metal elements.
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公开(公告)号:US20210175378A1
公开(公告)日:2021-06-10
申请号:US16703542
申请日:2019-12-04
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Alireza Bonakdar , Shinn-Jhy Lian
IPC: H01L31/0232 , H01L31/0216 , H01L31/02 , G02B5/30 , H01L27/146
Abstract: A light sensor includes a photodiode, interlayer dielectric layer and plurality of metal layers. A polarizer is disposed in the plurality of metal layers. The photodiode is coupled to generate charge in response to incident light directed through a first side of the semiconductor layer. The polarizer includes a first metal grid formed with a first metal layer and a second metal grid formed with a third metal layer. The second metal grid is stacked with the first metal grid such that the first and second metal grids are disposed above and aligned with the photodiode. The photodiode is optically coupled to receive incident light through the first and second metal grids of the polarizer and through the first side of the semiconductor layer.
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公开(公告)号:US20210074751A1
公开(公告)日:2021-03-11
申请号:US16563052
申请日:2019-09-06
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Alireza Bonakdar , Zhiqiang Lin
IPC: H01L27/146
Abstract: An image sensor includes a substrate material, an array of the color filters, an array of waveguides and spacers. The substrate material includes a plurality of photodiodes disposed therein. The array of color filters are disposed over the substrate material. The array of waveguides are disposed over the substrate material. The buffer layer is disposed between the substrate material and the arrays of color filters and waveguides. The spacers are disposed between the color filters in the array of color filters. The spacers are disposed between the waveguides in the array of waveguides. Incident light is adapted to be confined between the spacers. The incident light is adapted to be directed through one of the waveguides and through one of the color filters prior to being directed through the buffer layer into one of the photodiodes in the substrate material.
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公开(公告)号:US10811453B1
公开(公告)日:2020-10-20
申请号:US16671608
申请日:2019-11-01
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Seong Yeol Mun , Bill Phan , Alireza Bonakdar
IPC: H01L27/146
Abstract: An image sensor includes a plurality of photodiodes arranged in rows and columns of a pixel array that is disposed in a semiconductor substrate. Individual photodiodes of the pixel array are configured to receive incoming light through a backside of the semiconductor substrate. A front side of the semiconductor substrate is opposite from the backside. A plurality of deep trench isolation (DTI) structures are formed laterally with respect to the photodiodes on the backside of the semiconductor substrate. The plurality of DTI structures are arranged between adjacent photodiodes. A plurality of pillar structures extend from a metal grid proximate to the backside and is formed proximate to the backside and aligned with the DTI structures.
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公开(公告)号:US11871132B2
公开(公告)日:2024-01-09
申请号:US16870687
申请日:2020-05-08
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Badrinath Padmanabhan , Boyd Fowler , Alireza Bonakdar , Richard Mann
IPC: H04N25/705 , H01L27/146 , H04N25/75 , H04N25/778
CPC classification number: H04N25/705 , H01L27/14609 , H01L27/14643 , H04N25/75 , H04N25/778
Abstract: In some embodiments, an imaging system is provided. The imaging system comprises an image sensor, a light source, control circuitry, and function logic. The image sensor comprises a pixel array that includes a plurality of polarization pixel cells and a plurality of time-of-flight pixel cells. The light source is configured to emit light pulses to an object. The control circuitry is coupled to the light source and the pixel array, and is configured to synchronize a timing of the emission of the light pulses with sensing of photons reflected from the object by the plurality of time-of-flight pixel cells to generate depth information. The function logic is configured to determine a set of ambiguous surface normals using signals generated by the plurality of polarization pixel cells, and to disambiguate the set of ambiguous surface normals using the depth information to generate a three-dimensional shape image.
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公开(公告)号:US11862651B2
公开(公告)日:2024-01-02
申请号:US16777060
申请日:2020-01-30
Applicant: OmniVision Technologies, Inc.
Inventor: Alireza Bonakdar , Zhiqiang Lin , Lindsay Grant
IPC: H01L27/146 , G02B3/00 , G02B5/20
CPC classification number: H01L27/14629 , G02B3/0037 , G02B5/201 , G02B5/208 , H01L27/1463 , H01L27/1464 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/14645 , H01L27/14685
Abstract: A light-trapping image sensor includes a pixel array and a lens array. The pixel array is formed in and on a semiconductor substrate and including photosensitive pixels each including a reflective material forming a cavity around a portion of semiconductor material to at least partly trap light that has entered the cavity. The cavity has a ceiling at a light-receiving surface of the semiconductor substrate, and the ceiling forms an aperture for receiving the light into the cavity. The lens array is disposed on the pixel array. Each lens of the lens array is aligned to the aperture of a respective cavity to focus the light into the cavity through the aperture.
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公开(公告)号:US11810928B2
公开(公告)日:2023-11-07
申请号:US17322536
申请日:2021-05-17
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor: Duli Mao , Bill Phan , Seong Yeol Mun , Yuanliang Liu , Alireza Bonakdar , Chengming Liu , Zhiqiang Lin
IPC: H01L27/146
CPC classification number: H01L27/14605 , H01L27/1465 , H01L27/14621 , H01L27/14623 , H01L27/14625 , H01L27/14627 , H01L27/14685
Abstract: CMOS image sensor with LED flickering reduction and low color cross-talk are disclosed. In one embodiment, an image sensor includes a plurality of pixels arranged in rows and columns of a pixel array that is disposed in a semiconductor substrate. Each pixel includes a plurality of large subpixels (LPDs) and at least one small subpixel (SPD). A plurality of color filters are disposed over individual subpixels. Each individual SPD is laterally adjacent to at least one other SPD.
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公开(公告)号:US11469264B2
公开(公告)日:2022-10-11
申请号:US16777027
申请日:2020-01-30
Applicant: OmniVision Technologies, Inc.
Inventor: Alireza Bonakdar , Shinn-Jhy Lian , Badrinath Padmanabhan
IPC: H01L27/146
Abstract: A flare-blocking image sensor includes large pixels and small pixels, a microlens, and an opaque element. The large pixels and small pixels form a first and second pixel array respectively, each having a pixel pitch Px and Py. The second pixel array is offset from the first pixel array by ½Px and ½Py. A first large pixel of the large pixels is between and collinear with a first and a second small pixel separated by √{square root over (Px2+Py2 )} in a first direction and each having a width W less than both pixel pitch Px and Py. The microlens is aligned with the first large pixel. The opaque element is between the first large pixel and the microlens and extends, in the first direction, less than ½(√{square root over (Px2+Py2)}−W) from the first small pixel toward the second small pixel. The opaque element has a width perpendicular to the first direction not exceeding width W.
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