公开(公告)号：US09245829B2

公开(公告)日：2016-01-26

申请号：US13949206

申请日：2013-07-23

Applicant: OMRON Corporation

Inventor： Shintaro Hara ,  Shoichi Konagata ,  Yuzo Iwasaki ,  Tomonori Shiraishi

IPC: H01L23/48 ,  H01L23/492 ,  H01L23/00 ,  H05K1/11 ,  H01L23/13 ,  H05K3/34

CPC classification number: H01L23/492 ,  H01L23/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/29007 ,  H01L2224/29036 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/40 ,  H01L2224/73221 ,  H01L2224/73271 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/13033 ,  H01L2924/15747 ,  H05K1/111 ,  H05K3/3431 ,  H05K2201/09745 ,  H05K2201/10053 ,  H05K2201/1031 ,  H05K2201/10318 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/37099

Abstract: This invention provides a substrate structure that can effectively prevent scattering of solder balls which are produced due to explosion attributable to evaporation of flux during reflow soldering, and spreading of molten solder to the surroundings. On a substrate, a semiconductor chip is mounted via solder paste. The substrate is provided with a groove portion which continuously or discontinuously surrounds the solder paste.

Abstract translation: 本发明提供一种能够有效地防止由于回流焊接期间焊剂蒸发引起的爆炸而产生的焊球的散射以及熔融焊料向周围扩散的基板结构。 在基板上，通过焊膏安装半导体芯片。 基板设置有连续或不连续地包围焊膏的槽部。

公开(公告)号：US20140077375A1

公开(公告)日：2014-03-20

申请号：US13949206

申请日：2013-07-23

Applicant: OMRON CORPORATION

Inventor： Shintaro Hara ,  Shoichi Konagata ,  Yuzo Iwasaki ,  Tomonori Shiraishi

IPC: H01L23/492 ,  H01L23/00

CPC classification number: H01L23/492 ,  H01L23/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/29007 ,  H01L2224/29036 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/40 ,  H01L2224/73221 ,  H01L2224/73271 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/13033 ,  H01L2924/15747 ,  H05K1/111 ,  H05K3/3431 ,  H05K2201/09745 ,  H05K2201/10053 ,  H05K2201/1031 ,  H05K2201/10318 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/37099

Abstract: This invention provides a substrate structure that can effectively prevent scattering of solder balls which are produced due to explosion attributable to evaporation of flux during reflow soldering, and spreading of molten solder to the surroundings. On a substrate, a semiconductor chip is mounted via solder paste. The substrate is provided with a groove portion which continuously or discontinuously surrounds the solder paste.

Abstract translation: 本发明提供一种能够有效地防止由于回流焊接期间焊剂蒸发引起的爆炸而产生的焊球的散射以及熔融焊料向周围扩散的基板结构。 在基板上，通过焊膏安装半导体芯片。 基板设置有连续或不连续地包围焊膏的槽部。