公开(公告)号：US20180199431A1

公开(公告)日：2018-07-12

申请号：US15740378

申请日：2016-05-20

Applicant: OSRAM GmbH

Inventor： Michael Schoewel ,  Peter Helbig ,  Jozsef Szekely ,  Sven Seifritz

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/20 ,  H05K13/00 ,  F21S41/19

CPC classification number: H05K1/0296 ,  F21S41/19 ,  F21V21/00 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/202 ,  H05K3/4092 ,  H05K13/0069 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/10113 ,  H05K2201/10318 ,  H05K2203/166

Abstract: Various embodiments relate to a circuit support for an electronic circuit. The circuit support may include at least one conductor track, and an insulating matrix that is injection-molded over the at least one conductor path in such a way as to leave open at least a first region for connecting at least one electronic component of the electronic circuit. The circuit support may include at least one fastening aid that is formed from the material for the insulating matrix and/or from the material of the at least one conductor.

公开(公告)号：US09970622B2

公开(公告)日：2018-05-15

申请号：US15001307

申请日：2016-01-20

Applicant: OSRAM GmbH

Inventor： Philipp Helbig ,  Peter Frey ,  Peter Helbig ,  Thomas Feil

IPC: F21S41/19 ,  F21S41/141 ,  F21S45/47 ,  F21S8/10

CPC classification number: F21S45/47 ,  F21S43/14 ,  F21S43/195

Abstract: A lighting device may include a semiconductor light source arrangement, a heat sink for cooling the semiconductor light source arrangement, electrical connections for supplying power to the semiconductor light source arrangement, and a holding means. The holding means is in the form of a plastic part, at least the electrical connections and the heat sink each being embedded in the plastic material of said plastic part at least in sections.

公开(公告)号：US20180192507A1

公开(公告)日：2018-07-05

申请号：US15736802

申请日：2016-05-18

Applicant: OSRAM GmbH

Inventor： Michael Schöwel ,  Peter Helbig ,  Jozsef Szekely ,  Sven Seifritz

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/02 ,  H05K3/46 ,  H05K3/00 ,  F21S41/19

CPC classification number: H05K1/0204 ,  F21S41/192 ,  H05K1/0203 ,  H05K1/0373 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/0061 ,  H05K3/02 ,  H05K3/202 ,  H05K3/284 ,  H05K3/4644 ,  H05K2201/0104 ,  H05K2201/0224 ,  H05K2201/068 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/2036

Abstract: A circuit support for an electronic circuit may include at least one conductor track, a first insulation material with which the at least one conductor track is encapsulated by injection molding so as to form an insulating matrix and so as to leave open at least one first region for the connection of at least one electronic component of the electronic circuit, and a heat sink. The conductor track is encapsulated by injection molding with the first insulation material in such a way that the insulating matrix furthermore leaves open at least one second region which is arranged between the conductor track and the heat sink. The circuit support may further include a large number of spacers which are designed and arranged in order to set a height of the second region. The circuit support may further include a second insulation material with which the second region is filled.

公开(公告)号：US09716215B2

公开(公告)日：2017-07-25

申请号：US15002441

申请日：2016-01-21

Applicant: OSRAM GmbH

Inventor： Peter Helbig

IPC: F21V29/00 ,  H01L33/64 ,  H01L23/36 ,  H01L23/373 ,  F21V23/00 ,  F21V29/70 ,  F21V29/87 ,  F21V29/89 ,  F21K9/232 ,  F21Y115/10

CPC classification number: H01L33/641 ,  F21K9/232 ,  F21V23/001 ,  F21V29/70 ,  F21V29/87 ,  F21V29/89 ,  F21Y2115/10 ,  H01L23/36 ,  H01L23/3737 ,  H01L2933/0075

Abstract: A heat sink for an illumination device may include at least one heat sink portion which includes heat-conducting plastic. At least one metallic heat sink portion is at least partially embedded in the plastic material of the heat-conducting plastic.

公开(公告)号：US20160218265A1

公开(公告)日：2016-07-28

申请号：US15002441

申请日：2016-01-21

Applicant: OSRAM GmbH

Inventor： Peter Helbig

IPC: H01L33/64 ,  F28F21/06

CPC classification number: H01L33/641 ,  F21K9/232 ,  F21V23/001 ,  F21V29/70 ,  F21V29/87 ,  F21V29/89 ,  F21Y2115/10 ,  H01L23/36 ,  H01L23/3737 ,  H01L2933/0075

Abstract: A heat sink for an illumination device may include at least one heat sink portion which includes heat-conducting plastic. At least one metallic heat sink portion is at least partially embedded in the plastic material of the heat-conducting plastic.

Abstract translation: 用于照明装置的散热器可以包括至少一个包括导热塑料的散热部分。 至少一个金属散热器部分至少部分地嵌入在导热塑料的塑料材料中。

公开(公告)号：US20140104849A1

公开(公告)日：2014-04-17

申请号：US14050388

申请日：2013-10-10

Applicant: OSRAM GmbH

Inventor： Oliver Woisetschlaeger ,  Peter Helbig ,  Peter Niedermeier

IPC: F21K99/00

CPC classification number: F21K9/232 ,  F21K9/27 ,  F21K9/61

Abstract: In various embodiments, a lamp may include a lamp bulb composed of light-transmissive material; and at least one semiconductor light source arranged within the lamp bulb, and comprising a base, corresponding to a standardized incandescent lamp base; wherein the lamp has at least one optical waveguide which is connected to the lamp bulb and extends in the direction of the at least one semiconductor light source.

Abstract translation: 在各种实施例中，灯可以包括由透光材料组成的灯泡; 以及布置在灯泡内的至少一个半导体光源，并且包括对应于标准化白炽灯基座的基座; 其中所述灯具有至少一个光波导，所述光波导连接到所述灯泡并沿所述至少一个半导体光源的方向延伸。

公开(公告)号：US20170361758A1

公开(公告)日：2017-12-21

申请号：US15622167

申请日：2017-06-14

Applicant: OSRAM GmbH

Inventor： Thomas Feil ,  Christoph Henle ,  Martin Petzold ,  Peter Helbig

IPC: B60Q1/04 ,  F21K9/23 ,  F21S8/10 ,  B60Q1/26 ,  F21Y2115/10

CPC classification number: B60Q1/0433 ,  B60Q1/0483 ,  B60Q1/2623 ,  B60Q1/2696 ,  B60Q2900/10 ,  F21K9/23 ,  F21S41/141 ,  F21S41/162 ,  F21S41/19 ,  F21S41/192 ,  F21S45/47 ,  F21Y2115/10

Abstract: In various embodiments, a holding device for lamps in vehicle lights is provided. The holding device may include a plate-like section that is provided with at least one receptacle for a lamp, and socket contacts for the energy supply of the lamp arranged in the receptacle. The at least one receptacle is realized in such a way that it provides space for different types of lamps.

公开(公告)号：US20160215948A1

公开(公告)日：2016-07-28

申请号：US15001307

申请日：2016-01-20

Applicant: OSRAM GmbH

Inventor： Philipp Helbig ,  Peter Frey ,  Peter Helbig ,  Thomas Feil

IPC: F21S8/10

CPC classification number: F21S45/47 ,  F21S43/14 ,  F21S43/195

Abstract: A lighting device may include a semiconductor light source arrangement, a heat sink for cooling the semiconductor light source arrangement, electrical connections for supplying power to the semiconductor light source arrangement, and a holding means. The holding means is in the form of a plastic part, at least the electrical connections and the heat sink each being embedded in the plastic material of said plastic part at least in sections.

Abstract translation: 照明装置可以包括半导体光源装置，用于冷却半导体光源装置的散热器，用于向半导体光源装置供电的电连接以及保持装置。 保持装置是塑料部件的形式，至少每个至少部分地将电连接件和散热器嵌入塑料部件的塑料材料中。

公开(公告)号：US10322665B2

公开(公告)日：2019-06-18

申请号：US15622167

申请日：2017-06-14

Applicant: OSRAM GmbH

Inventor： Thomas Feil ,  Christoph Henle ,  Martin Petzold ,  Peter Helbig

IPC: B60Q1/04 ,  F21K9/23 ,  B60Q1/26 ,  F21S41/19 ,  F21Y115/10 ,  F21S41/141 ,  F21S41/162 ,  F21S45/47

Abstract: In various embodiments, a holding device for lamps in vehicle lights is provided. The holding device may include a plate-like section that is provided with at least one receptacle for a lamp, and socket contacts for the energy supply of the lamp arranged in the receptacle. The at least one receptacle is realized in such a way that it provides space for different types of lamps.