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公开(公告)号：US20180366616A1
公开(公告)日：2018-12-20
申请号：US16061358
申请日：2016-12-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Christoph Walter , Roland Enzmann , Markus Horn , Jan Seidenfaden
Abstract: A carrier for an optoelectronic component includes a main body, wherein the main body includes a first electrically conductive heating layer arrangement, a first solder layer for soldering an optoelectronic component to the main body is arranged on a first side of the main body, the first electrically conductive heating layer arrangement is electrically insulated from the first solder layer and thermally connected to the first solder layer, and the first heating layer arrangement has an exposed portion on which molten solder of the first solder layer can flow to reduce an electrical resistance of the first heating layer arrangement.
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公开(公告)号：US10991853B2
公开(公告)日：2021-04-27
申请号：US16061358
申请日：2016-12-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Christoph Walter , Roland Enzmann , Markus Horn , Jan Seidenfaden
Abstract: A carrier for an optoelectronic component includes a main body, wherein the main body includes a first electrically conductive heating layer arrangement, a first solder layer for soldering an optoelectronic component to the main body is arranged on a first side of the main body, the first electrically conductive heating layer arrangement is electrically insulated from the first solder layer and thermally connected to the first solder layer, and the first heating layer arrangement has an exposed portion on which molten solder of the first solder layer can flow to reduce an electrical resistance of the first heating layer arrangement.
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Patent Agency Ranking
公开(公告)号：US20180351324A1
公开(公告)日：2018-12-06
申请号：US15761585
申请日：2016-09-15
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Christoph Walter , Roland Enzmann , Markus Horn , Jan Seidenfaden
CPC classification number: H01S5/02272 , H01L33/0079 , H01L33/0095 , H01L33/62 , H01L33/641 , H01L33/642 , H01L2933/0066 , H01L2933/0075 , H01S5/02268 , H01S5/02461
Abstract: A method of producing an optoelectronic component includes providing a carrier including a top side; creating at the top side of the carrier a region that is recessed with respect to a mounting region of the top side to form a step between the mounting region and the recessed region; arranging at the top side of the carrier a metallization extending over the mounting region and the recessed region; creating a separating track in the metallization, wherein the metallization is completely severed at least in sections in the mounting region and is at least not completely severed in the recessed region; and arranging an optoelectronic semiconductor chip above the mounting region of the top side, wherein the optoelectronic semiconductor chip is aligned at the separating track.
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4.发明公开公开(公告)号：US20230238769A1
公开(公告)日：2023-07-27
申请号：US17999508
申请日：2021-05-27
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Tobias Gebuhr , Jan Seidenfaden
IPC: H01S5/02255 , H01S5/02234 , H01S5/02208 , H01S5/0232 , H01S5/068
CPC classification number: H01S5/02255 , H01S5/02234 , H01S5/02208 , H01S5/0232 , H01S5/06825
Abstract: In an embodiment an optoelectronic semiconductor component includes a lead frame having a first mounting surface, a semiconductor chip arranged on the first mounting surface and having an emission surface, an optical element and a molded body, wherein the optical element has an input-coupling surface oriented transverse to the first mounting surface, wherein the semiconductor chip is configured to emit electromagnetic radiation through the emission surface, a radiation axis of which is parallel to the first mounting surface, wherein the optical element is configured to deflect the electromagnetic radiation of the semiconductor chip coupled in via the input-coupling surface, wherein the molded body is attached to the lead frame and has an alignment surface transverse to the first mounting surface, and wherein the optical element and the alignment surface are in direct contact with each other.
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公开(公告)号：US20180026421A1
公开(公告)日：2018-01-25
申请号：US15654136
申请日：2017-07-19
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Jan Seidenfaden , Jan Marfeld , Hubert Schmid , Soenke Tautz , Roland Enzmann
Abstract: A laser component includes a housing, a laser chip arranged in the housing, and a conversion element for radiation conversion arranged in the housing wherein the conversion element is irradiatable with laser radiation of the laser chip. A method of producing such a laser component includes providing component parts of the laser component including a laser chip, a conversion element for radiation conversion and housing parts, and assembling the component parts of the laser component such that a housing is provided within which the laser chip and the conversion element are arranged, wherein the conversion element is irradiatable with laser radiation of the laser chip.
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公开(公告)号：US10454240B2
公开(公告)日：2019-10-22
申请号：US15761585
申请日：2016-09-15
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Christoph Walter , Roland Enzmann , Markus Horn , Jan Seidenfaden
Abstract: A method of producing an optoelectronic component includes providing a carrier including a top side; creating at the top side of the carrier a region that is recessed with respect to a mounting region of the top side to form a step between the mounting region and the recessed region; arranging at the top side of the carrier a metallization extending over the mounting region and the recessed region; creating a separating track in the metallization, wherein the metallization is completely severed at least in sections in the mounting region and is at least not completely severed in the recessed region; and arranging an optoelectronic semiconductor chip above the mounting region of the top side, wherein the optoelectronic semiconductor chip is aligned at the separating track.
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公开(公告)号：US10431954B2
公开(公告)日：2019-10-01
申请号：US15654136
申请日：2017-07-19
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Jan Seidenfaden , Jan Marfeld , Hubert Schmid , Soenke Tautz , Roland Enzmann
Abstract: A laser component includes a housing, a laser chip arranged in the housing, and a conversion element for radiation conversion arranged in the housing wherein the conversion element is irradiatable with laser radiation of the laser chip. A method of producing such a laser component includes providing component parts of the laser component including a laser chip, a conversion element for radiation conversion and housing parts, and assembling the component parts of the laser component such that a housing is provided within which the laser chip and the conversion element are arranged, wherein the conversion element is irradiatable with laser radiation of the laser chip.
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