-
公开(公告)号：US10454240B2
公开(公告)日：2019-10-22
申请号：US15761585
申请日：2016-09-15
发明人： Christoph Walter , Roland Enzmann , Markus Horn , Jan Seidenfaden
摘要： A method of producing an optoelectronic component includes providing a carrier including a top side; creating at the top side of the carrier a region that is recessed with respect to a mounting region of the top side to form a step between the mounting region and the recessed region; arranging at the top side of the carrier a metallization extending over the mounting region and the recessed region; creating a separating track in the metallization, wherein the metallization is completely severed at least in sections in the mounting region and is at least not completely severed in the recessed region; and arranging an optoelectronic semiconductor chip above the mounting region of the top side, wherein the optoelectronic semiconductor chip is aligned at the separating track.
-
公开(公告)号：US20180062346A1
公开(公告)日：2018-03-01
申请号：US15794374
申请日：2017-10-26
CPC分类号： H01S5/02208 , H01L2924/19107 , H01S5/02216 , H01S5/02236 , H01S5/02248 , H01S5/02272 , H01S5/02276 , H01S5/02296 , H01S5/02469 , H01S5/02476 , H01S5/4018 , H01S5/4025 , H01S5/4031 , H01S5/405
摘要： A laser component includes a housing, the housing including a base surface and side walls which are perpendicular to the base surface, wherein a first carrier block and a second carrier block are arranged parallel to each other at the base surface, a first laser chip arranged on a longitudinal side of the first carrier block; and a further laser chip arranged on a longitudinal side of the second carrier block, wherein an emission direction of the first laser chip and the further laser chip is oriented perpendicular to the base surface.
-
公开(公告)号：US20150055667A1
公开(公告)日：2015-02-26
申请号：US14533292
申请日：2014-11-05
CPC分类号： H01S5/02208 , H01L2924/19107 , H01S5/02216 , H01S5/02236 , H01S5/02248 , H01S5/02272 , H01S5/02276 , H01S5/02296 , H01S5/02469 , H01S5/02476 , H01S5/4018 , H01S5/4025 , H01S5/4031 , H01S5/405
摘要： A laser component includes a housing in which a first carrier block is arranged. A first laser chip having an emission direction is arranged on a longitudinal side of the first carrier block. The first laser chip electrically conductively connects to a first contact region arranged on the first carrier block and a second contact region arranged on the first carrier block. There is a respective electrically conductive connection between the first contact region and a first contact pin of the housing and between the second contact region and a second contact pin of the housing.
摘要翻译： 激光部件包括其中布置有第一载体块的壳体。 具有发射方向的第一激光芯片布置在第一载体块的纵向侧上。 第一激光芯片导电地连接到布置在第一载体块上的第一接触区域和布置在第一载体块上的第二接触区域。 在第一接触区域和壳体的第一接触销之间以及在第二接触区域和壳体的第二接触销之间存在相应的导电连接。
-
公开(公告)号：US09831632B2
公开(公告)日：2017-11-28
申请号：US14533292
申请日：2014-11-05
CPC分类号： H01S5/02208 , H01L2924/19107 , H01S5/02216 , H01S5/02236 , H01S5/02248 , H01S5/02272 , H01S5/02276 , H01S5/02296 , H01S5/02469 , H01S5/02476 , H01S5/4018 , H01S5/4025 , H01S5/4031 , H01S5/405
摘要： A laser component includes a housing in which a first carrier block is arranged. A first laser chip having an emission direction is arranged on a longitudinal side of the first carrier block. The first laser chip electrically conductively connects to a first contact region arranged on the first carrier block and a second contact region arranged on the first carrier block. There is a respective electrically conductive connection between the first contact region and a first contact pin of the housing and between the second contact region and a second contact pin of the housing.
-
公开(公告)号：US20160204575A1
公开(公告)日：2016-07-14
申请号：US14910813
申请日：2014-08-14
发明人： Markus Horn , Bernhard Stojetz
CPC分类号： H01S5/02469 , H01S5/0222 , H01S5/02248 , H01S5/02272 , H01S5/024 , H01S5/02476 , H01S5/4018 , H01S5/4031
摘要： A laser component includes a laser chip having a top side, an underside, a first side surface and a second side surface, which are oriented parallel to a resonator of the laser chip, wherein an underside of the laser chip is arranged in a manner bearing on a carrier, a top side of the laser chip is arranged in a manner bearing on a further carrier, the laser chip is hermetically tightly encapsulated between the carrier and the further carrier, a second electrical contact pad of the laser chip, said second electrical contact pad being formed on the top side of the laser chip, electrically conductively connects to a second electrical mating contact pad formed on the further carrier, and the first side surface of the laser chip thermally conductively connects to a heat sink.
摘要翻译： 激光组件包括具有平行于激光芯片的谐振器的顶侧，下侧，第一侧表面和第二侧表面的激光芯片，其中激光芯片的下侧以轴承方式布置 在载体上，激光芯片的顶侧以与另一个载体相关的方式布置，激光芯片气密地封装在载体和另外的载体之间，激光芯片的第二电接触焊盘，所述第二电极 接触垫形成在激光芯片的顶侧上，导电地连接到形成在另一个载体上的第二电配合接触焊盘，并且激光芯片的第一侧表面热传导地连接到散热器。
-
公开(公告)号：US20160204573A1
公开(公告)日：2016-07-14
申请号：US14912210
申请日：2014-08-14
发明人： Jens Mueller , Markus Horn
摘要： A laser component includes an edge-emitting first laser chip with an upper side, a lower side, an end side and a side surface, wherein an emission region is arranged on the end side, the side surface is oriented perpendicularly to the upper side and to the end side, a first metallization is arranged on the upper side, a step by which a part adjacent to the upper side of the side surface is set back, is formed on the side surface, a passivation layer is arranged in the set-back part of the side surface, the laser chip is arranged on a carrier, the side surface faces toward a surface of the carrier, and a first solder contact arranged on the surface of the carrier electrically conductively connects to the first metallization.
摘要翻译： 激光组件包括具有上侧，下侧，端侧和侧表面的边缘发射第一激光器芯片，其中发射区域设置在端侧，侧表面垂直于上侧定向， 在侧面上形成第一金属化层，在侧面上形成有与侧面上侧相邻的部分被退回的台阶，钝化层配置在上侧， 侧面的背面部分，激光芯片布置在载体上，侧表面朝向载体的表面，并且布置在载体表面上的第一焊料接触电导体连接到第一金属化。
-
公开(公告)号：US10991853B2
公开(公告)日：2021-04-27
申请号：US16061358
申请日：2016-12-14
发明人： Christoph Walter , Roland Enzmann , Markus Horn , Jan Seidenfaden
摘要： A carrier for an optoelectronic component includes a main body, wherein the main body includes a first electrically conductive heating layer arrangement, a first solder layer for soldering an optoelectronic component to the main body is arranged on a first side of the main body, the first electrically conductive heating layer arrangement is electrically insulated from the first solder layer and thermally connected to the first solder layer, and the first heating layer arrangement has an exposed portion on which molten solder of the first solder layer can flow to reduce an electrical resistance of the first heating layer arrangement.
-
公开(公告)号：US20180351324A1
公开(公告)日：2018-12-06
申请号：US15761585
申请日：2016-09-15
发明人： Christoph Walter , Roland Enzmann , Markus Horn , Jan Seidenfaden
CPC分类号： H01S5/02272 , H01L33/0079 , H01L33/0095 , H01L33/62 , H01L33/641 , H01L33/642 , H01L2933/0066 , H01L2933/0075 , H01S5/02268 , H01S5/02461
摘要： A method of producing an optoelectronic component includes providing a carrier including a top side; creating at the top side of the carrier a region that is recessed with respect to a mounting region of the top side to form a step between the mounting region and the recessed region; arranging at the top side of the carrier a metallization extending over the mounting region and the recessed region; creating a separating track in the metallization, wherein the metallization is completely severed at least in sections in the mounting region and is at least not completely severed in the recessed region; and arranging an optoelectronic semiconductor chip above the mounting region of the top side, wherein the optoelectronic semiconductor chip is aligned at the separating track.
-
公开(公告)号：US20160126704A1
公开(公告)日：2016-05-05
申请号：US14892242
申请日：2014-05-27
发明人： Markus Horn , Karsten Auen
摘要： An optoelectronic component includes a carrier with at least two radiation sources that generate electromagnetic radiation, including a housing consisting of a material non-transmissive to the electromagnetic radiation from the radiation sources, wherein at least two openings are provided in the housing, each opening is closed with a plate, the plate consists of a material transmissive to the electromagnetic radiation from the respective radiation source, and a radiation source is respectively assigned to an opening.
摘要翻译： 光电子部件包括具有产生电磁辐射的至少两个辐射源的载体，包括由与辐射源的电磁辐射不透射的材料组成的壳体，其中至少两个开口设置在壳体中，每个开口是 用板封闭，该板由对各个辐射源的电磁辐射透射的材料组成，辐射源分别分配给一个开口。
-
公开(公告)号：US10686295B2
公开(公告)日：2020-06-16
申请号：US14912210
申请日：2014-08-14
发明人： Jens Mueller , Markus Horn
摘要： A laser component includes an edge-emitting first laser chip with an upper side, a lower side, an end side and a side surface, wherein an emission region is arranged on the end side, the side surface is oriented perpendicularly to the upper side and to the end side, a first metallization is arranged on the upper side, a step by which a part adjacent to the upper side of the side surface is set back, is formed on the side surface, a passivation layer is arranged in the set-back part of the side surface, the laser chip is arranged on a carrier, the side surface faces toward a surface of the carrier, and a first solder contact arranged on the surface of the carrier electrically conductively connects to the first metallization.
-
-
-
-
-
-
-
-
-
搜索结果
17 条记录 (耗时 0.017 秒)
