公开(公告)号：US20180226518A1

公开(公告)日：2018-08-09

申请号：US15749656

申请日：2016-08-02

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Reinhard Streitel ,  I-Hsin Lin-Lefebvre ,  Chee Eng Ooi ,  Ivan Galesic

IPC: H01L31/0232 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/46 ,  H01L31/14 ,  H01L33/62 ,  H01L31/02 ,  H01L31/0216 ,  H01L33/60 ,  H01L33/54

CPC classification number: H01L31/0232 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02161 ,  H01L31/143 ,  H01L33/405 ,  H01L33/46 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2933/0016 ,  H01L2933/005 ,  H01L2924/00014

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier; arranging an ink on an upper side of the carrier; arranging an adhesive on the ink; and arranging the optoelectronic semiconductor chip on the adhesive. An optoelectronic component includes a carrier, an ink arranged on an upper side of the carrier, an adhesive arranged on the ink, and an optoelectronic semiconductor chip arranged on the adhesive.