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1.发明授权Structure and method to improve channel mobility by gate electrode stress modification 有权通过栅电极应力改变来提高沟道迁移率的结构和方法公开(公告)号：US06977194B2
公开(公告)日：2005-12-20
申请号：US10695752
申请日：2003-10-30
申请人： Michael P. Belyansky , Dureseti Chidambarrao , Omer H. Dokumaci , Bruce B. Doris , Oleg Gluschenkov
发明人： Michael P. Belyansky , Dureseti Chidambarrao , Omer H. Dokumaci , Bruce B. Doris , Oleg Gluschenkov
IPC分类号： H01L21/20 , H01L21/28 , H01L21/302 , H01L21/336 , H01L21/44 , H01L21/461 , H01L21/4763 , H01L21/8238 , H01L27/092 , H01L29/49 , H01L29/72 , H01L29/78 , H01L29/786 , H01L31/062
CPC分类号： H01L29/7845 , H01L21/823807 , H01L21/823835 , H01L21/823842 , H01L29/4908 , H01L29/66795 , H01L29/785
摘要： In producing complementary sets of metal-oxide-semiconductor (CMOS) field effect transistors, including nFET and pFET), carrier mobility is enhanced or otherwise regulated through the reacting the material of the gate electrode with a metal to produce a stressed alloy (preferably CoSi2, NiSi, or PdSi) within a transistor gate. In the case of both the nFET and pFET, the inherent stress of the respective alloy results in an opposite stress on the channel of respective transistor. By maintaining opposite stresses in the nFET and pFET alloys or silicides, both types of transistors on a single chip or substrate can achieve an enhanced carrier mobility, thereby improving the performance of CMOS devices and integrated circuits.
摘要翻译： 在制造包括nFET和pFET的互补金属氧化物半导体（CMOS）场效应晶体管的情况下，通过使栅电极的材料与金属反应来增强或调节载流子迁移率，以产生应力合金（优选CoSi 2Si，NiSi或PdSi）。 在nFET和pFET两者的情况下，各合金的固有应力对相应晶体管的沟道产生相反的应力。 通过在nFET和pFET合金或硅化物中保持相反的应力，单个芯片或衬底上的两种类型的晶体管可以实现增强的载流子迁移率，从而提高CMOS器件和集成电路的性能。
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2.发明授权Method for differential oxidation rate reduction for n-type and p-type materials 失效n型和p型材料差示氧化速率降低的方法公开(公告)号：US06667197B1
公开(公告)日：2003-12-23
申请号：US10314499
申请日：2002-12-06
IPC分类号： H01L2100
CPC分类号： H01L21/823842 , H01L21/823864
摘要： A method of forming a substantially uniform oxide film over surfaces with different level of doping and/or different dopant type is disclosed. In one aspect, a method for forming a uniform oxide spacer on the sidewalls of heavily doped n- and p-type gates is disclosed. The method includes providing a semiconductor substrate having at least two regions with dissimilar dopant characteristics, optionally heating the substrate; and forming a uniform oxide layer over the at least two regions by exposing the substrate to a gaseous mixture including atomic oxygen.
摘要翻译： 公开了在具有不同掺杂水平和/或不同掺杂剂类型的表面上形成基本上均匀的氧化膜的方法。 一方面，公开了在重掺杂的n型和p型栅极的侧壁上形成均匀的氧化物间隔物的方法。 该方法包括提供具有至少两个具有不同掺杂特性的区域的半导体衬底，可选地加热衬底; 以及通过将所述衬底暴露于包括原子氧的气体混合物，在所述至少两个区域上形成均匀的氧化物层。
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公开(公告)号：US06806534B2
公开(公告)日：2004-10-19
申请号：US10342423
申请日：2003-01-14
IPC分类号： H01L2976
CPC分类号： H01L29/66583 , H01L21/26586 , H01L21/28114 , H01L29/665 , H01L29/66553
摘要： A MOSFET fabrication methodology and device structure, exhibiting improved gate activation characteristics. The gate doping that may be introduced while the source drain regions are protected by a damascene mandrel to allow for a very high doping in the gate conductors, without excessively forming deep source/drain diffusions. The high gate conductor doping minimizes the effects of electrical depletion of carriers in the gate conductor. The MOSFET fabrication methodology and device structure further results in a device having a lower gate conductor width less than the minimum lithographic minimum image, and a wider upper gate conductor portion width which may be greater than the minimum lithographic image. Since the effective channel length of the MOSFET is defined by the length of the lower gate portion, and the line resistance is determined by the width of the upper gate portion, both short channel performance and low gate resistance are satisfied simultaneously.
摘要翻译： MOSFET制造方法和器件结构，表现出改进的栅极激活特性。 当源极漏极区域被镶嵌心轴保护以允许栅极导体中的非常高的掺杂而不会过度地形成深的源极/漏极扩散时，可以引入栅极掺杂。 高栅极导体掺杂最大限度地减小了栅极导体中载流子的电耗损的影响。 MOSFET制造方法和器件结构进一步导致具有小于最小光刻最小图像的较低栅极导体宽度的器件，以及可能大于最小光刻图像的较宽上部栅极导体部分宽度。 由于MOSFET的有效沟道长度由下栅极部分的长度限定，并且线路电阻由上部栅极部分的宽度决定，所以同时满足短沟道性能和低栅极电阻。
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4.发明授权Structure and method to improve channel mobility by gate electrode stress modification 失效通过栅电极应力改变来提高沟道迁移率的结构和方法公开(公告)号：US07750410B2
公开(公告)日：2010-07-06
申请号：US11175223
申请日：2005-07-07
申请人： Michael P. Belyansky , Dureseti Chidambarrao , Omer H. Dokumaci , Bruce B. Doris , Oleg Gluschenkov
发明人： Michael P. Belyansky , Dureseti Chidambarrao , Omer H. Dokumaci , Bruce B. Doris , Oleg Gluschenkov
IPC分类号： H01L29/72
CPC分类号： H01L29/7845 , H01L21/823807 , H01L21/823835 , H01L21/823842 , H01L29/4908 , H01L29/66795 , H01L29/785
摘要： In producing complementary sets of metal-oxide-semiconductor (CMOS) field effect transistors, including nFET and pFET), carrier mobility is enhanced or otherwise regulated through the reacting the material of the gate electrode with a metal to produce a stressed alloy (preferably CoSi2, NiSi, or PdSi) within a transistor gate. In the case of both the nFET and pFET, the inherent stress of the respective alloy results in an opposite stress on the channel of respective transistor. By maintaining opposite stresses in the nFET and pFET alloys or silicides, both types of transistors on a single chip or substrate can achieve an enhanced carrier mobility, thereby improving the performance of CMOS devices and integrated circuits.
摘要翻译： 在制造包括nFET和pFET的互补金属氧化物半导体（CMOS）场效应晶体管的情况下，通过使栅电极的材料与金属反应来增强或调节载流子迁移率，以产生应力合金（优选CoSi 2 ，NiSi或PdSi）。 在nFET和pFET两者的情况下，各合金的固有应力对相应晶体管的沟道产生相反的应力。 通过在nFET和pFET合金或硅化物中保持相反的应力，单个芯片或衬底上的两种类型的晶体管可实现增强的载流子迁移率，从而提高CMOS器件和集成电路的性能。
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公开(公告)号：US07262087B2
公开(公告)日：2007-08-28
申请号：US10905062
申请日：2004-12-14
IPC分类号： H01L21/84
CPC分类号： H01L21/84 , H01L27/1203 , H01L29/7843 , Y10S438/938
摘要： The present invention provides a strained-Si structure, in which the nFET regions of the structure are strained in tension and the pFET regions of the structure are strained in compression. Broadly the strained-Si structure comprises a substrate; a first layered stack atop the substrate, the first layered stack comprising a compressive dielectric layer atop the substrate and a first semiconducting layer atop the compressive dielectric layer, wherein the compressive dielectric layer transfers tensile stresses to the first semiconducting layer; and a second layered stack atop the substrate, the second layered stack comprising an tensile dielectric layer atop the substrate and a second semiconducting layer atop the tensile dielectric layer, wherein the tensile dielectric layer transfers compressive stresses to the second semiconducting layer. The tensile dielectric layer and the compressive dielectric layer preferably comprise nitride, such as Si3N4.
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公开(公告)号：US06878582B2
公开(公告)日：2005-04-12
申请号：US10876873
申请日：2004-06-25
IPC分类号： H01L21/265 , H01L21/28 , H01L21/336 , H01L29/49 , H01L29/78 , H01L21/8238
CPC分类号： H01L29/4983 , H01L21/26586 , H01L21/28105 , H01L29/66484 , H01L29/665 , H01L29/6656 , H01L29/6659 , H01L29/7831 , H01L29/7836 , Y10S257/90
摘要： A low-GIDL current MOSFET device structure and a method of fabrication thereof which provides a low-GIDL current. The MOSFET device structure contains a central gate conductor whose edges may slightly overlap the source/drain diffusions, and left and right side wing gate conductors which are separated from the central gate conductor by a thin insulating and diffusion barrier layer.
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公开(公告)号：US06764883B1
公开(公告)日：2004-07-20
申请号：US10338071
申请日：2003-01-07
IPC分类号： H01L2100
CPC分类号： B82Y30/00 , B82Y10/00 , B82Y20/00 , H01L21/02381 , H01L21/0245 , H01L21/02488 , H01L21/02529 , H01L21/02532 , H01L21/0262 , H01L21/0332 , H01L21/0337 , H01L31/0352
摘要： A method for forming a uniform layered structure comprising an ultra-thin layer of amorphous silicon and its thermal oxide is disclosed. In one aspect, a method for forming a nanolaminate of silicon oxide on a substrate is disclosed. In another aspect, a method for forming a patterned hard mask on a substrate is disclosed. The patterned hard mask includes a nanolaminate of silicon and silicon oxide. The methods are characterized by the oxidation of an amorphous silicon layer using atomic oxygen.
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8.发明授权Method of improving gate activation by employing atomic oxygen enhanced oxidation 失效通过采用原子氧增强氧化改善浇口活化的方法公开(公告)号：US06566210B2
公开(公告)日：2003-05-20
申请号：US09905233
申请日：2001-07-13
IPC分类号： H01L21336
CPC分类号： H01L21/28035 , H01L21/32105 , H01L29/4916
摘要： The present invention provides a method of preparing a Si-based metal-insulator-semiconductor (MIS) transistor which prevents the polycrystalline grains of the gate conductor from getting significantly larger by reducing the thermal budget of the sidewall oxidation process. The thermal budget of the inventive sidewall oxidation process is reduced one or two orders of magnitude over conventional prior art sidewall oxidation processes by utilizing atomic oxygen as the oxidizing ambient. The present invention also provides Si-based MIS transistors having a gate conductor having grain sizes of about 0.1, preferably 0.05, &mgr;m or less.
摘要翻译： 本发明提供一种制备Si基金属 - 绝缘体半导体（MIS）晶体管的方法，其通过降低侧壁氧化工艺的热量预算来防止栅极导体的多晶晶粒变得明显更大。 通过利用原子氧作为氧化环境，本发明的侧壁氧化过程的热预算比常规现有技术的侧壁氧化过程减少一到两个数量级。 本发明还提供具有晶体尺寸为约0.1μm，优选0.05μm或更小的栅极导体的Si基MIS晶体管。
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9.发明授权Method for forming high performance CMOS devices with elevated sidewall spacers 有权用于形成具有升高的侧壁间隔物的高性能CMOS器件的方法公开(公告)号：US06509221B1
公开(公告)日：2003-01-21
申请号：US10000695
申请日：2001-11-15
IPC分类号： H01L218238
CPC分类号： H01L29/6659 , H01L21/26586 , H01L21/823864 , H01L29/7833
摘要： A method is described for making elevated sidewall spacers on the gate structure of a semiconductor device. A first insulating layer is deposited on the substrate, so that an upper portion of each of the sidewalls extends above the layer. A second insulating layer is deposited on the first layer and on the gate structure. Portions of the second layer disposed on the first layer and on the top surface of the gate structure are removed, so that a remaining portion of the second layer is disposed on the upper portion of each of the sidewalls. The first layer is then removed, so that the remaining portion of the second layer on each of the sidewalls projects laterally therefrom and is elevated with respect to the substrate. This structure is used to implant PFET and NFET extension regions without dose loss.
摘要翻译： 描述了一种用于在半导体器件的栅极结构上制造升高的侧壁间隔物的方法。 第一绝缘层沉积在衬底上，使得每个侧壁的上部在层上延伸。 第二绝缘层沉积在第一层和栅极结构上。 去除设置在栅极结构的第一层和顶表面上的第二层的部分，使得第二层的剩余部分设置在每个侧壁的上部。 然后去除第一层，使得每个侧壁上的第二层的剩余部分从其侧向突出并且相对于衬底升高。 该结构用于注入PFET和NFET延伸区而没有剂量损失。
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公开(公告)号：US07312134B2
公开(公告)日：2007-12-25
申请号：US11741441
申请日：2007-04-27
IPC分类号： H01L21/84
CPC分类号： H01L21/84 , H01L27/1203 , H01L29/7843 , Y10S438/938
摘要： The present invention provides a strained-Si structure, in which the nFET regions of the structure are strained in tension and the pFET regions of the structure are strained in compression. Broadly the strained-Si structure comprises a substrate; a first layered stack atop the substrate, the first layered stack comprising a compressive dielectric layer atop the substrate and a first semiconducting layer atop the compressive dielectric layer, wherein the compressive dielectric layer transfers tensile stresses to the first semiconducting layer; and a second layered stack atop the substrate, the second layered stack comprising an tensile dielectric layer atop the substrate and a second semiconducting layer atop the tensile dielectric layer, wherein the tensile dielectric layer transfers compressive stresses to the second semiconducting layer. The tensile dielectric layer and the compressive dielectric layer preferably comprise nitride, such as Si3N4.
摘要翻译： 本发明提供一种应变Si结构，其中该结构的nFET区域被拉紧并且该结构的pFET区域被压缩而变形。 广义上，应变Si结构包括基底; 所述第一层叠堆叠包括位于所述衬底顶部的压缩介电层和位于所述压缩介电层顶部的第一半导体层，其中所述压缩介电层将拉伸应力传递到所述第一半导体层; 以及在所述衬底顶部的第二层叠堆叠，所述第二层叠堆叠包括位于所述衬底顶部的拉伸介电层和位于所述拉伸介电层顶部的第二半导体层，其中所述拉伸介电层将压缩应力传递到所述第二半导体层。 拉伸介电层和压电介电层优选包括氮化物，例如Si 3 N 4 N 4。
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