公开(公告)号：US5061744A

公开(公告)日：1991-10-29

申请号：US376284

申请日：1989-07-05

申请人： Osamu Ogitani ,  Takashi Shimizu ,  Ryuichi Fujii ,  Masao Kawashima ,  Tuyoshi Kobayashi ,  Ichiro Akutagawa

发明人： Osamu Ogitani ,  Takashi Shimizu ,  Ryuichi Fujii ,  Masao Kawashima ,  Tuyoshi Kobayashi ,  Ichiro Akutagawa

IPC分类号： H05K3/00 ,  H05K3/18

CPC分类号： H05K3/184 ,  H05K2201/0209 ,  H05K2203/1173 ,  H05K3/0076

摘要： A resist ink composition suitable for forming a masking pattern resistive against chemical attack by a chemical plating liquor is disclosed which comprises:a phenol novolak epoxy resin having an epoxy equivalent of 170-250;a phenol novolak resin having a softening point of 60.degree.-130.degree. C.;a montmorillonite organic complex such as bentonite ion-exchanged with an organic cation;a curing-accelerating catalyst; andan organic solvent.

摘要翻译： 公开了一种抗蚀剂油墨组合物，其适用于形成耐化学镀液的化学侵蚀的掩模图案，其包含：环氧当量为170-250的苯酚酚醛清漆环氧树脂; 软化点为60〜130℃的苯酚酚醛清漆树脂。 与有机阳离子离子交换的膨润土等蒙脱石有机配合物; 固化促进催化剂; 和有机溶剂。

公开(公告)号：US5276073A

公开(公告)日：1994-01-04

申请号：US925327

申请日：1992-08-06

申请人： Ichiro Akutagawa ,  Kunimitsu Matsuzaki ,  Toshio Matsuo ,  Ryuichi Fujii ,  Satoru Umeki ,  Yoshimichi Ono ,  Takeo Miyamoto ,  Koki Ueta ,  Naoki Kamada

发明人： Ichiro Akutagawa ,  Kunimitsu Matsuzaki ,  Toshio Matsuo ,  Ryuichi Fujii ,  Satoru Umeki ,  Yoshimichi Ono ,  Takeo Miyamoto ,  Koki Ueta ,  Naoki Kamada

IPC分类号： C08K7/10 ,  C08L63/00 ,  C08L79/08 ,  H01B3/30 ,  H01B3/40 ,  H01B7/29 ,  C08G59/40 ,  C08L63/04

CPC分类号： H01B7/292 ,  C08K7/10 ,  C08L63/00 ,  C08L79/085 ,  H01B3/306 ,  H01B3/40

摘要： A thermosetting resin composition useful for slot insulation purposes is disclosed, which includes:a liquid epoxy resin;a curing agent including an acid anhydride;a maleimide resin in an amount of 3-50 parts by weight per 100 parts by weight of the liquid epoxy resin; andfinely divided wollastonite in an amount of 50-400 parts by weight per 100 parts by weight of the liquid epoxy resin.

摘要翻译： 公开了一种用于槽绝缘目的的热固性树脂组合物，其包括：液体环氧树脂; 包含酸酐的固化剂; 相对于100重量份的液体环氧树脂为3〜50重量份的马来酰亚胺树脂; 和细分硅灰石，每100重量份液体环氧树脂为50-400重量份。

公开(公告)号：US5077325A

公开(公告)日：1991-12-31

申请号：US375625

申请日：1989-07-05

申请人： Ichiro Akutagawa ,  Tsutomu Yamaguchi ,  Kunimitsu Matsuzaki

发明人： Ichiro Akutagawa ,  Tsutomu Yamaguchi ,  Kunimitsu Matsuzaki

IPC分类号： C09J5/00 ,  C08G59/00 ,  C08G59/22 ,  C08G59/28 ,  C08G59/32 ,  C08G59/40 ,  C08G59/50 ,  C08G59/68 ,  C08L63/00 ,  C09J163/00 ,  H01B3/40 ,  H01F41/02 ,  H02K15/02 ,  H02K15/03

CPC分类号： H02K15/03 ,  C08G59/226 ,  C08G59/4014 ,  C08G59/5053 ,  C08G59/686 ,  H01B3/40

摘要： A penetrable, epoxy resin composition is disclosed which comprises: a liquid, epoxy resin mixture containing a glycidyl ether of bisphenol having an epoxy equivalent of 158-270 and a flexible epoxy resin which is a glycidyl ether of a bisphenol modified with a glycol or a urethane; a curing agent capable of reacting with the epoxy resin mixture when heated to a curing temperature; an inert organic solvent which does not react with the epoxy resin mixture, which is capable of dissolving the curing agent and which has a boiling point lower than the curing temperature; and an inorganic filler having an average particle size of 0.1-5 .mu.m.

公开(公告)号：US5008309A

公开(公告)日：1991-04-16

申请号：US340734

申请日：1989-04-20

申请人： Hiromitu Ibe ,  Ichiro Akutagawa ,  Kunimitsu Matsuzaki

发明人： Hiromitu Ibe ,  Ichiro Akutagawa ,  Kunimitsu Matsuzaki

IPC分类号： C04B14/46 ,  C04B26/14 ,  C08K3/08 ,  C08K3/30 ,  H02K7/04

CPC分类号： H02K7/04 ,  C04B14/46 ,  C04B26/14 ,  C08K3/08 ,  C08K3/30

摘要： A balancing putty for use in balancing rotation of a rotary part including:(a) an epoxy resin;(b) a curing agent capable of curing the epoxy resin when heated at a temperature of 60.degree. C. or more,(c) a first, finely divided inorganic filler having a specific gravity of 4.0 g/cm.sup.3 or more; and(d) a second, finely divided inorganic filler having a specific gravity of less than 4.0 g/cm.sup.3, the balancing putty having a density of at least 2.0 g/cm.sup.3 and a consistency of 1-12 mm in terms of penetration.

摘要翻译： 一种平衡油灰，用于平衡旋转部件的旋转，包括：（a）环氧树脂; （b）当在60℃或更高的温度下加热时能够固化环氧树脂的固化剂，（c）比重为4.0g / cm 3或更高的第一种细碎无机填料; 和（d）比重小于4.0g / cm 3的第二细碎无机填料，平均油灰的密度为至少2.0g / cm 3，稠度为1-12mm。

公开(公告)号：US5084525A

公开(公告)日：1992-01-28

申请号：US473477

申请日：1990-02-01

申请人： Ichiro Akutagawa ,  Tutomu Yamaguchi ,  Kunimitsu Matsuzaki

发明人： Ichiro Akutagawa ,  Tutomu Yamaguchi ,  Kunimitsu Matsuzaki

IPC分类号： C08G59/00 ,  C08G59/22 ,  C08L63/00 ,  C08L77/00 ,  C09J163/00

CPC分类号： C08L63/00 ,  C08G59/226 ,  C08L77/00

摘要： An epoxy resin bonding composition containing two different epoxy resin as a liquid admixture, a curing agent and a polyamide powder is disclosed. The bonding composition may be used, for example, to bond a ferrite magnetic to a motor yoke. One of the epoxy resins is an unmodified glycidyl ether of bisphenol A, bisphenol F or bisphenol AD. The other epoxy resin is an urethane-modified or glycol-modified glycidyl ether of bisphenol A, bisphenol F or bisphenol AD. The polyamide powder has an average particle size of 150 .mu.m or less and a melting of at least 170.degree. C. and is present in an amount 1-50 parts by weight per 100 parts by weight of liquid epoxy resin admixture.

摘要翻译： 公开了含有两种不同的环氧树脂作为液体混合物的环氧树脂粘合组合物，固化剂和聚酰胺粉末。 例如，可以使用粘合组合物将铁氧体磁性结合到电动机轭。 环氧树脂之一是双酚A，双酚F或双酚AD的未改性缩水甘油醚。 另一种环氧树脂是双酚A，双酚F或双酚AD的氨基甲酸酯改性或二醇改性的缩水甘油醚。 聚酰胺粉末的平均粒径为150μm以下，熔点至少为170℃，相对于100重量份液体环氧树脂混合物，其含量为1-50重量份。

公开(公告)号：US5189081A

公开(公告)日：1993-02-23

申请号：US724776

申请日：1991-07-02

申请人： Ichiro Akutagawa ,  Tsutomu Yamaguchi ,  Kunimitsu Matsuzaki

发明人： Ichiro Akutagawa ,  Tsutomu Yamaguchi ,  Kunimitsu Matsuzaki

IPC分类号： C08G59/22 ,  C08G59/40 ,  C08G59/50 ,  C08G59/68 ,  H01B3/40 ,  H02K15/03

CPC分类号： C08G59/5053 ,  C08G59/226 ,  C08G59/4014 ,  C08G59/686 ,  H01B3/40 ,  H02K15/03

摘要： A penetrable, epoxy resin composition is disclosed which comprises: a liquid, epoxy resin mixture containing a glycidyl ether of bisphenol having an epoxy equivalent of 158-270 and a flexible epoxy resin; a curing agent capable of reacting with the epoxy resin mixture when heated to a curing temperature; an inert organic solvent which does not react with the epoxy resin mixture, which is capable of dissolving the curing agent and which has a boiling point lower than the curing temperature; and an inorganic filler having an average particle size of 0.1-5 .mu.m.

摘要翻译： 公开了一种可渗透的环氧树脂组合物，其包含：含有环氧当量为158-270的双酚的缩水甘油醚和柔性环氧树脂的液体环氧树脂混合物; 当加热至固化温度时能够与环氧树脂混合物反应的固化剂; 惰性有机溶剂，其不与环氧树脂混合物反应，其能够溶解固化剂并且沸点低于固化温度; 和平均粒径为0.1-5μm的无机填料。

公开(公告)号：US5053476A

公开(公告)日：1991-10-01

申请号：US370305

申请日：1989-06-23

申请人： Ichiro Akutagawa ,  Kunimitsu Matsuzaki ,  Toshio Matsuo ,  Toru Shirose

发明人： Ichiro Akutagawa ,  Kunimitsu Matsuzaki ,  Toshio Matsuo ,  Toru Shirose

IPC分类号： C08G59/00 ,  C08G59/40 ,  C08G59/42 ,  C08G59/50 ,  C08G59/68 ,  C08L63/00 ,  H01B3/40 ,  H01F27/32 ,  H01F38/12

CPC分类号： H01B3/40 ,  C08G59/42 ,  C08G59/686 ,  C08L63/00

摘要： An epoxy resin composition suitable for use as a casting resin for the potting of an ignition coil is disclosed which comprises:(A) a mixture containing(a.sub.1) a liquid, Bisphenol-type epoxy resin, and(a.sub.2) an inorganic filler,(a.sub.3) a polyether polyol; and(B) a liquid curing agent including(b.sub.1) an acid anhydride, and(b.sub.2) an imidazole compound.

公开(公告)号：US4966928A

公开(公告)日：1990-10-30

申请号：US232989

申请日：1988-08-17

申请人： Katugi Kitagawa ,  Ichiro Akutagawa ,  Kazuya Ono

发明人： Katugi Kitagawa ,  Ichiro Akutagawa ,  Kazuya Ono

IPC分类号： C09D5/03 ,  C08G59/42 ,  C09D163/00

CPC分类号： C08G59/4215 ,  C09D163/00

摘要： An epoxy resin based powder coating composition is disclosed, comprising an epoxy resin, a reaction product of dicyclopentadiene and maleic anhydride, and a cure accelerator.The coating composition may further comprise an aromatic acid anhydride based curing agent, an impact modifier and a surface smoothing agent.The coating composition has stable powder characteristic and provides good heat resistance and electrical insulation.

摘要翻译： 公开了一种环氧树脂基粉末涂料组合物，其包含环氧树脂，二环戊二烯与马来酸酐的反应产物和固化促进剂。 涂料组合物可以进一步包括基于芳族酸酐的固化剂，抗冲改性剂和表面平滑剂。 涂料组合物具有稳定的粉末特性，提供良好的耐热性和电绝缘性。

公开(公告)号：US4954602A

公开(公告)日：1990-09-04

申请号：US369998

申请日：1989-06-23

申请人： Ichiro Akutagawa ,  Tsutomu Yamaguchi ,  Toshihiro Hanamori ,  Kunimitsu Matsuzaki ,  Shinobu Okamura

发明人： Ichiro Akutagawa ,  Tsutomu Yamaguchi ,  Toshihiro Hanamori ,  Kunimitsu Matsuzaki ,  Shinobu Okamura

IPC分类号： H01B3/40 ,  C08G59/00 ,  C08G59/20 ,  C08G59/22 ,  C08G59/42 ,  C08G59/62 ,  C08G59/68 ,  C08L63/00

CPC分类号： C08G59/686 ,  C08G59/226 ,  C08G59/4215

摘要： A liquid, epoxy resin composition suitable for use in fixation of a stator coil or a rotor coil is disclosed, which comprises (A) a mixture containing (a.sub.1) a Bisphenol A epoxy resin and (a.sub.2) an alicyclic epoxy resin; and (B) a curing agent including (b.sub.1) an acid anhydride, and (b.sub.2) a phenol compound of the general formula: ##STR1## wherein R.sup.1 and R.sup.2 represent independently from each other a lower alkyl, R.sup.3 represents a lower alkylene and n is an integer of 1-5, the amount of the phenol compound (b.sub.2) being in the range of 2-8% based on the weight of the mixture (A).