公开(公告)号：US5061744A

公开(公告)日：1991-10-29

申请号：US376284

申请日：1989-07-05

申请人： Osamu Ogitani ,  Takashi Shimizu ,  Ryuichi Fujii ,  Masao Kawashima ,  Tuyoshi Kobayashi ,  Ichiro Akutagawa

发明人： Osamu Ogitani ,  Takashi Shimizu ,  Ryuichi Fujii ,  Masao Kawashima ,  Tuyoshi Kobayashi ,  Ichiro Akutagawa

IPC分类号： H05K3/00 ,  H05K3/18

CPC分类号： H05K3/184 ,  H05K2201/0209 ,  H05K2203/1173 ,  H05K3/0076

摘要： A resist ink composition suitable for forming a masking pattern resistive against chemical attack by a chemical plating liquor is disclosed which comprises:a phenol novolak epoxy resin having an epoxy equivalent of 170-250;a phenol novolak resin having a softening point of 60.degree.-130.degree. C.;a montmorillonite organic complex such as bentonite ion-exchanged with an organic cation;a curing-accelerating catalyst; andan organic solvent.

摘要翻译： 公开了一种抗蚀剂油墨组合物，其适用于形成耐化学镀液的化学侵蚀的掩模图案，其包含：环氧当量为170-250的苯酚酚醛清漆环氧树脂; 软化点为60〜130℃的苯酚酚醛清漆树脂。 与有机阳离子离子交换的膨润土等蒙脱石有机配合物; 固化促进催化剂; 和有机溶剂。

公开(公告)号：US4997863A

公开(公告)日：1991-03-05

申请号：US397791

申请日：1989-08-24

申请人： Osamu Ogitani ,  Takashi Shimizu ,  Ryuichi Fujii

发明人： Osamu Ogitani ,  Takashi Shimizu ,  Ryuichi Fujii

IPC分类号： B32B15/08 ,  C08G59/00 ,  C08G59/50 ,  C08K3/34 ,  C08K3/36 ,  C08L63/00 ,  H01B3/00 ,  H05K1/03 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K1/0373 ,  C08K3/346 ,  C08K3/36 ,  H01B3/006 ,  H05K1/0326 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0376 ,  H05K3/184 ,  H05K3/426 ,  H05K3/4626

摘要： A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed circuit board is disclosed which includes an aromatic epoxy resin having at least two epoxy groups, an aromatic polyamine mica having an average particle size of 50 .mu.m or less, and silica having an average particle size of 20 .mu.m or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80% based on the total weight of the silica and the mica.

摘要翻译： 公开了一种适用于形成绝缘层以在多层印刷电路板的两个相邻布线图案之间形成的热固性树脂组合物，其包括具有至少两个环氧基的芳族环氧树脂，平均粒度为50的芳族多胺云母 μm以下，平均粒径为20μm以下的二氧化硅，二氧化硅的平均粒径小于云母的平均粒径，二氧化硅的量相对于总重量为20〜80％ 的二氧化硅和云母。

公开(公告)号：US5043184A

公开(公告)日：1991-08-27

申请号：US457530

申请日：1989-12-27

申请人： Ryuichi Fujii ,  Osamu Ogitani ,  Toru Shirose

发明人： Ryuichi Fujii ,  Osamu Ogitani ,  Toru Shirose

IPC分类号： G03F7/032 ,  H05K1/00 ,  H05K3/00 ,  H05K3/46

CPC分类号： G03F7/032 ,  H05K3/4676 ,  H05K3/0023 ,  H05K3/4652 ,  H05K3/4661

摘要： A conducting layer such as an additional wiring pattern or an electromagnetic insulation layer is formed on a conducting surface such as of a printed circuit board with an insulating layer being interposed therebetween, by a method which includes the steps of:(a) providing a liquid thermosetting composition containing an epoxy resin, a curing agent, a polymerizable compound having at least two acrylate or methacrylate groups and a photopolymerization initiator;(b) applying the composition to the conducting surface to form a coated layer;(c) irradiating actinic light on the coated layer to polymerize the polymerizable compound and to obtain a solid, thermosetting layer,(d) heating the thermosetting layer to cure the epoxy resin and to form the insulating layer; and(e) forming an electrically conducting layer on the cured resin layer. Steps (b) and (c) are repeated until the solid thermosetting layer has a desired thickness. Step (d) may be performed before or after step (e).

公开(公告)号：US5095047A

公开(公告)日：1992-03-10

申请号：US502939

申请日：1990-04-02

申请人： Osamu Ogitani ,  Ryuichi Fujii ,  Toru Shirose

发明人： Osamu Ogitani ,  Ryuichi Fujii ,  Toru Shirose

IPC分类号： C08G59/00 ,  C08G59/24 ,  C08G59/50 ,  C08K3/34 ,  C08K3/36 ,  C08L63/00 ,  H05K1/03

CPC分类号： H05K1/0373 ,  C08G59/245 ,  C08G59/5033 ,  C08K3/346 ,  C08K3/36 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0251

摘要： A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed wiring board is disclosed which includes a bisphenol AD epoxy resin, an aromatic polyamine, mica having an average particle size of 50 .mu.m or less, and silica having an average particle size of 20 .mu.m or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80% based on the total weight of the silica and the mica.

公开(公告)号：US4985474A

公开(公告)日：1991-01-15

申请号：US434263

申请日：1989-11-13

申请人： Osamu Ogitani ,  Ryuichi Fujii

发明人： Osamu Ogitani ,  Ryuichi Fujii

IPC分类号： C08F2/48 ,  C08F2/44 ,  C08F20/26 ,  C08F220/26 ,  C08F220/28 ,  C09J4/00 ,  C09J4/02 ,  C09J4/06 ,  G03F7/027 ,  G03F7/032 ,  H05K3/00 ,  H05K3/06

CPC分类号： H05K3/0094 ,  G03F7/027 ,  G03F7/032 ,  H05K2203/0759 ,  H05K3/0076

摘要： A resin composition hardenable by irradiation of a high energy ray is disclosed, which includes:(a) a resin selected from the group consisting of rosins and modified rosins and having an acid value of at least 150 and a Gardner color scale of not greater than 15;(b) a compound of the general formula (I):Y--CO--O--A--O).sub. m CO--CR.dbd.CH.sub.2 (I) wherein Y represents ##STR1## A represents an alkylene having 1-4 carbon atoms, R represents hydrogen or methyl and m is an integer of 1-4;(c) a hydroxyl group-containing compound having only one acrylic or methacrylic group and at least one hydroxyl group; and(d) a polyol compound having at least two hydroxyl groups. The resin composition is useful for plugging through-holes of a metal plated board in manufacturing printed wiring boards.

摘要翻译： 公开了通过高能射线照射可硬化的树脂组合物，其包括：（a）选自松香和改性松香，并且酸值至少为150的树脂和不大于 15; （b）通式（I）的化合物：Y-CO-OAO）mCO-CR = CH 2（I）其中Y表示A表示具有1-4个碳原子的亚烷基，R表示氢或甲基， m为1-4的整数; （c）仅具有一个丙烯酸或甲基丙烯酸基团和至少一个羟基的含羟基化合物; 和（d）具有至少两个羟基的多元醇化合物。 树脂组合物可用于在制造印刷线路板时堵塞金属电镀板的通孔。

公开(公告)号：US4205018A

公开(公告)日：1980-05-27

申请号：US957502

申请日：1978-11-03

申请人： Kohtaro Nagasawa ,  Osamu Ogitani ,  Ryuichi Fujii

发明人： Kohtaro Nagasawa ,  Osamu Ogitani ,  Ryuichi Fujii

IPC分类号： C08F2/46 ,  C08F290/06 ,  C08F290/14 ,  C08L61/02

CPC分类号： C08F290/144 ,  C08F290/06 ,  Y10S525/922

摘要： A resin composition is disclosed comprising, as essential ingredients, (I) a urethanized epoxy resin or a urethanized epoxy resin acrylate or methacrylate, (II) a ketone resin and (III) a cross-linkable or polymerizable compound containing at least two ethylenically unsaturated groups.

摘要翻译： 公开了一种树脂组合物，其包含作为必要成分的（I）氨基甲酸酯化环氧树脂或氨基甲酸酯化环氧树脂丙烯酸酯或甲基丙烯酸酯，（II）酮树脂和（III）可交联或可聚合的化合物，其含有至少两个烯键式不饱和 团体

公开(公告)号：US5158989A

公开(公告)日：1992-10-27

申请号：US593947

申请日：1990-10-09

申请人： Osamu Ogitani ,  Toru Shirose

发明人： Osamu Ogitani ,  Toru Shirose

IPC分类号： C09D11/00 ,  C09D11/033 ,  C09D11/10 ,  C09D11/101 ,  C09D11/102 ,  G03F7/028 ,  H05K3/00 ,  H05K3/18

CPC分类号： H05K3/184 ,  G03F7/028 ,  H05K2201/0209 ,  H05K2203/1173 ,  H05K3/0076

摘要： A photocurable ink composition for forming patterns resistive to electroless plating is disclosed which includes (a) an epoxy resin, (b) an aliphatic polyol polyglycidyl ether as a reactive, viscosity controlling agent, (c) a photopolymerization catalyst, and (d) hydrophobic silica particles as a thixotropic agent.

公开(公告)号：US4991359A

公开(公告)日：1991-02-12

申请号：US428622

申请日：1989-10-30

申请人： Osamu Ogitani

发明人： Osamu Ogitani

IPC分类号： B24B29/00 ,  B24B1/00 ,  C08J7/02 ,  H05K3/00 ,  H05K3/28

CPC分类号： B24B1/00 ,  H05K3/0094 ,  H05K3/288 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/0769 ,  H05K2203/0793

摘要： A method of treating a metal-plated board for the removal of a hardened, alkali-soluble resin layer therefrom, comprising the steps of:(a) contacting a surface of the resin layer with an aqueous alkaline liquid such as an aqueous sodium carbonate solution to swell the surface;(b) abrading the resin layer having the swollen surface, step (b) being preceded by or simultaneous with step (a); and(c) then washing the abraded surface with an aqueous neutral liquid such as water.

摘要翻译： 一种处理金属镀板以从其中除去硬化的碱溶性树脂层的方法，包括以下步骤：（a）使树脂层的表面与碱性水溶液如碳酸钠水溶液 膨胀表面; （b）研磨具有膨胀表面的树脂层，步骤（b）在步骤（a）之前或同时进行; 和（c）然后用水性中性液体如水洗涤磨损的表面。