公开(公告)号：US20160168378A1

公开(公告)日：2016-06-16

申请号：US14956358

申请日：2015-12-01

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIROAKI UMEHARA ,  HIROHARU INOUE

IPC: C08L71/12 ,  H05K1/03

CPC classification number: C08L71/126 ,  C08G65/485 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/06 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0355 ,  C08L25/06 ,  C08L25/10 ,  C08L33/00

Abstract: A poly(phenylene ether) resin composition includes a modified poly(phenylene ether) copolymer, a polymer substance having a weight-average molecular weight larger than that of the modified poly(phenylene ether) copolymer, and a compound compatible with the modified poly(phenylene ether) copolymer. The modified poly(phenylene ether) copolymer is produced by modifying the phenolic hydroxyl group in a molecular terminal of a poly(phenylene ether) copolymer with a compound having a carbon-carbon unsaturated double bond. The polymer substance has a structure of at least one selected from a polystyrene framework, a polybutadiene framework, and a methacrylate framework. The polymer substance has a softening temperature not higher than 110° C. The compound compatible with the modified poly(phenylene ether) copolymer includes two or more carbon-carbon unsaturated double-bonds per molecule, and has a melting point not higher than 30° C.

Abstract translation: 聚（苯醚）树脂组合物包含改性聚苯醚共聚物，重均分子量大于改性聚苯醚共聚物的聚合物物质和与改性聚（苯醚）共聚物相容的化合物 苯醚）共聚物。 通过用具有碳 - 碳不饱和双键的化合物改性聚（苯醚）共聚物的分子末端中的酚羟基来制备改性聚（苯醚）共聚物。 聚合物物质具有选自聚苯乙烯框架，聚丁二烯骨架和甲基丙烯酸酯骨架中的至少一种的结构。 聚合物物质的软化温度不高于110℃。与改性聚苯醚共聚物相容的化合物每分子含有两个或多个碳 - 碳不饱和双键，熔点不高于30℃ C。

公开(公告)号：US20160366761A1

公开(公告)日：2016-12-15

申请号：US15173697

申请日：2016-06-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKASHI HOSHI ,  TAKESHI KITAMURA ,  KEIKO KASHIHARA ,  HIROHARU INOUE

IPC: H05K1/03 ,  H05K1/11 ,  C08J5/24

CPC classification number: H05K1/0366 ,  B32B15/14 ,  B32B2260/046 ,  C08G59/62 ,  C08J5/24 ,  C08J2363/00 ,  C08J2433/02 ,  C08J2433/06 ,  C08J2433/08 ,  C08L63/00 ,  H05K1/0271 ,  H05K1/0373 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/029

Abstract: A prepreg includes a resin composition including: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton; (B) a polymer having at least the structures of formulae (2) and (3) among formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and (C) an inorganic filler: wherein x:y:z (molar fraction)=0:0.95:0.05 to 0.2:0.6:0.2 (where x+y+z≦1, 0≦x≦0.2, 0.6≦y≦0.95, 0.05≦z≦0.2); R1 represents a hydrogen atom or a methyl group and R2 includes at least one of a glycidyl group and an epoxidized alkyl group among a hydrogen atom, an alkyl group, a glycidyl group and an epoxidized alkyl group in formula (2); and R3 represents a hydrogen atom or a methyl group and R4 represents Ph (phenyl group), —COOCH2Ph or —COO(CH2)2Ph in formula (3).

公开(公告)号：US20180312683A1

公开(公告)日：2018-11-01

申请号：US16029064

申请日：2018-07-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIROAKI UMEHARA ,  HIROHARU INOUE

IPC: C08L51/08 ,  C08J5/24 ,  C08F290/06 ,  H05K1/03 ,  H05K1/02

CPC classification number: B32B15/08 ,  C08F2/44 ,  C08F290/06 ,  C08J5/24 ,  C08K3/00 ,  C08L9/00 ,  C08L33/04 ,  C08L71/12 ,  C08L101/12 ,  H05K1/03

Abstract: A polyphenylene ether resin composition contains a modified polyphenylene ether copolymer and a high-molecular-weight compound. The modified polyphenylene ether copolymer is obtained by modifying a polyphenylene ether copolymer at a phenolic hydroxy group of a molecular chain end with a substituent having a carbon-carbon unsaturated double bond. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20° C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.

公开(公告)号：US20180250916A1

公开(公告)日：2018-09-06

申请号：US15753571

申请日：2016-09-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： AKIHIRO YAMAUCHI ,  YOSHIAKI ESAKI ,  TAKAYOSHI OZEKI ,  HIROAKI UMEHARA ,  HIROHARU INOUE ,  YOSHIHIKO NAKAMURA

IPC: B32B15/092 ,  C08L63/00 ,  C08G65/44 ,  C08G59/62 ,  C08K3/36

CPC classification number: B32B15/092 ,  B32B15/08 ,  C08G59/62 ,  C08G65/44 ,  C08K3/36 ,  C08L13/00 ,  C08L63/00 ,  H05K1/03 ,  H05K1/0353 ,  H05K3/022 ,  H05K2201/0209 ,  C08K3/013 ,  C08L71/12

Abstract: A metal foil with resin is a metal foil with resin including a metal foil and a resin layer disposed on the metal foil, resin layer being obtained by half-curing a resin composition. The resin composition contains a first component that is a polymer, a second component that is a polyarylene ether copolymer, and a third component that is an epoxy resin. The first component has structures represented by formulae (1) and (2) below, with no unsaturated bond between carbon atoms. The third component has two or more epoxy groups per molecule. The second component is compatible with the first component, and the third component is incompatible with the first component.In the formulae (1) and (2), a ratio between x and y is x:y=0:1 to 0.35:0.65, R1 represents hydrogen atom or methyl group, and R2 represents hydrogen atom or an alkyl group.

公开(公告)号：US20180275031A1

公开(公告)日：2018-09-27

申请号：US15757002

申请日：2016-09-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KEIKO KASHIHARA ,  HIROHARU INOUE ,  SHINGO YOSHIOKA ,  TAKASHI HOSHI

IPC: G01N3/18 ,  B32B15/08 ,  B32B37/10 ,  H05K1/03 ,  H05K1/02 ,  H05K3/06

CPC classification number: G01N3/18 ,  B32B5/28 ,  B32B15/08 ,  B32B37/10 ,  B32B37/1018 ,  B32B2038/0076 ,  B32B2309/02 ,  B32B2309/105 ,  B32B2457/08 ,  C08J5/24 ,  C08J2363/00 ,  G01N2203/0017 ,  G01N2203/0057 ,  H05K1/0271 ,  H05K1/0373 ,  H05K1/038 ,  H05K3/06 ,  H05K2201/0209 ,  H05K2201/068

Abstract: A prepreg includes a resin layer constituted by a half-cured product of a thermosetting resin composition, and a fibrous substrate provided in the resin layer. A prepreg test piece that is a cured product obtained by heat curing the thermosetting resin composition has a maximum value of 400 kPa or less for thermal shrinkage stress measured by a predetermined thermal stress test.

公开(公告)号：US20160090457A1

公开(公告)日：2016-03-31

申请号：US14859210

申请日：2015-09-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIROAKI UMEHARA ,  HIROHARU INOUE

IPC: C08J5/24 ,  H05K1/03

CPC classification number: C08J5/24 ,  C08J2363/00 ,  C08J2433/20 ,  H05K1/0346 ,  H05K1/0366

Abstract: A prepreg satisfies the following properties (A) and (B).(A) The resin flow of the prepreg measured under conditions of 170° C. and 30 kgf/cm2 according to IEC 60249-3-1, 1981, is 0% or more and 5% or less.(B) In a dynamic viscoelasticity test under conditions of a temperature of 30° C. or higher and 200° C. or lower, a temperature rising rate of 3° C./min, and a frequency of 0.5 Hz, a relation of 1≦Vb/Va≦15 is established, where Va is a minimum melt viscosity of the resin composition collected from the prepreg, and Vb is a melt viscosity of the collected resin composition at a temperature Tb, Tb=Ta+20° C., and Ta is a temperature when the melt viscosity is the minimum melt viscosity Va.

Abstract translation: 预浸料满足以下性能（A）和（B）。 （A）根据IEC60249-3-1，1981，在170℃，30kgf / cm 2的条件下测定的预浸料的树脂流量为0％以上且5％以下。 （B）在温度为30℃以上且200℃以下的动态粘弹性试验中，升温速度为3℃/分钟，频率为0.5Hz，关系为 1＆nlE; Vb / Va＆nlE; 15，其中Va是从预浸料收集的树脂组合物的最小熔融粘度，Vb是在Tb，Tb = Ta + 20℃的温度下收集的树脂组合物的熔体粘度。 ，Ta是当熔体粘度为最小熔融粘度Va时的温度。