公开(公告)号：US20170374743A1

公开(公告)日：2017-12-28

申请号：US15699570

申请日：2017-09-08

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Arata KISHI ,  Hironori MUNAKATA ,  Koji MOTOMURA ,  Hiroki MARUO

IPC: H05K1/18 ,  H01L23/00 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10156 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32052 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/8159 ,  H01L2224/81609 ,  H01L2224/81611 ,  H01L2224/81613 ,  H01L2224/81639 ,  H01L2224/81647 ,  H01L2224/81815 ,  H01L2224/81935 ,  H01L2224/81951 ,  H01L2224/81986 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/384 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

公开(公告)号：US20160255716A1

公开(公告)日：2016-09-01

申请号：US14993753

申请日：2016-01-12

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hideki EIFUKU ,  Wanyu TIE ,  Hironori MUNAKATA

IPC: H05K1/02 ,  H05K3/38

CPC classification number: H05K3/361 ,  H05K3/323 ,  H05K2203/0278

Abstract: A manufacturing method of an electronic component including a circuit component provided with plural first electrodes in an end, and a substrate provided with plural second electrodes includes: pressing a part of a second surface of an inside of a second edge of the circuit component in the end to the substrate by a press attaching surface of the press attaching tool with an adhesive arranged between the circuit component and the substrate; making a part of the adhesive reach the second surface to cover at least a part of the second edge by the pressing; and curing the adhesive between the end and the substrate and the part of the adhesive covering the at least the part of the second edge.

Abstract translation: 一种电子部件的制造方法，其特征在于，具有：端部具备多个第一电极的电路部件和设置有多个第二电极的基板的电子部件的制造方法，包括：将所述电路部件的第二边缘的内部的第二表面的一部分按压在 通过压力安装工具的压力附接表面与布置在电路部件和基板之间的粘合剂结束到基板; 使得粘合剂的一部分到达第二表面以通过按压覆盖第二边缘的至少一部分; 以及固化所述端部和所述基底之间的粘合剂，并且所述粘合剂的所述部分覆盖所述至少所述第二边缘的所述部分。