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公开(公告)号：US20170374743A1
公开(公告)日：2017-12-28
申请号：US15699570
申请日：2017-09-08
发明人： Arata KISHI , Hironori MUNAKATA , Koji MOTOMURA , Hiroki MARUO
CPC分类号： H05K1/181 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/10156 , H01L2224/16238 , H01L2224/2929 , H01L2224/293 , H01L2224/32052 , H01L2224/32057 , H01L2224/32225 , H01L2224/73203 , H01L2224/81052 , H01L2224/81191 , H01L2224/8159 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81639 , H01L2224/81647 , H01L2224/81815 , H01L2224/81935 , H01L2224/81951 , H01L2224/81986 , H01L2224/83104 , H01L2224/83192 , H01L2224/9211 , H01L2224/92125 , H01L2924/00014 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/384 , H05K3/3436 , H05K3/3463 , H05K3/3484 , H05K2201/10734 , H05K2201/10977 , H05K2201/10992 , H05K2201/2009 , H05K2201/2036 , H05K2201/2045 , Y02P70/613 , H01L2924/00012 , H01L2924/00
摘要： A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.
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公开(公告)号：US20120111617A1
公开(公告)日：2012-05-10
申请号：US13382368
申请日：2010-05-26
申请人： Koji Motomura , Seiichi Yoshinaga , Tadahiko Sakai
发明人： Koji Motomura , Seiichi Yoshinaga , Tadahiko Sakai
IPC分类号： H05K1/09
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/98 , H01L2224/0401 , H01L2224/06151 , H01L2224/06155 , H01L2224/131 , H01L2224/14135 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17135 , H01L2224/17179 , H01L2224/17505 , H01L2224/17517 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32052 , H01L2224/32225 , H01L2224/33179 , H01L2224/73203 , H01L2224/8114 , H01L2224/81191 , H01L2224/81193 , H01L2224/81194 , H01L2224/8121 , H01L2224/8159 , H01L2224/81599 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81616 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81815 , H01L2224/81855 , H01L2224/81905 , H01L2224/83104 , H01L2224/83136 , H01L2224/83192 , H01L2224/83194 , H01L2224/8321 , H01L2224/8359 , H01L2224/83599 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83616 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83855 , H01L2224/92125 , H01L2224/9221 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01048 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/225 , H05K3/3436 , H05K2203/0425 , H05K2203/176 , Y02P70/613 , Y10T29/49144 , Y10T29/49146 , H01L2924/00014 , H01L2924/01014 , H01L2924/00 , H01L2224/73204 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： It is an object of the present invention to provide an electronic element unit and a reinforcing adhesive agent in which a bonding strength can be improved between an electronic element and a circuit board and a repairing work can be carried out without giving a thermal damage to the electronic element or the circuit board. In an electronic element unit (1) including an electronic element (2) having a plurality of connecting terminals (12) on a lower surface thereof, a circuit board (3) having a plurality of electrodes (22) corresponding to the connecting terminals (12) on an upper surface thereof. The connecting terminals (12) and the electrodes (22) are connected by solder bumps (23), and the electronic element (2) and the circuit board (3) are partly bond by a resin bond part (24) made of a thermosetting material of a thermosetting resin, and a metal powder (25) is included in the resin bond parts (24) in a dispersed state. The metal powder (25) has a melting point lower than a temperature at which the resin bond parts (24) are heated when a work (a repairing work) is carried out for removing the electronic element (2) from the circuit board (3).
摘要翻译： 本发明的目的是提供一种电子元件单元和增强粘合剂，其中可以在电子元件和电路板之间提高接合强度，并且可以进行修复作业而不会对其造成热损伤 电子元件或电路板。 在包括在其下表面上具有多个连接端子（12）的电子元件（2）的电子元件单元（1）中，具有与连接端子对应的多个电极（22）的电路板（3） 12）。 连接端子（12）和电极（22）通过焊锡凸块（23）连接，电子元件（2）和电路板（3）通过由热固性树脂制成的树脂粘合部分（24） 热固性树脂的材料和金属粉末（25）以分散状态包含在树脂粘合部分（24）中。 当进行从电路板（3）移除电子元件（2）的工件（修理作业）时，金属粉末（25）的熔点低于加热树脂接合部分（24）的温度 ）。
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公开(公告)号：US20140049930A1
公开(公告)日：2014-02-20
申请号：US14007808
申请日：2012-04-02
CPC分类号： H05K13/0465 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/10126 , H01L2224/13111 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81193 , H01L2224/81411 , H01L2224/81413 , H01L2224/8149 , H01L2224/8159 , H01L2224/81613 , H01L2224/81815 , H01L2224/81862 , H01L2224/81885 , H01L2924/01006 , H01L2924/01029 , H01L2924/01049 , H01L2924/0105 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/15788 , H01L2924/19105 , H01L2924/20106 , H01L2924/351 , H05K1/141 , H05K1/181 , H05K3/3436 , H05K3/3463 , H05K2201/10977 , H05K2203/047 , Y02P70/613 , H01L2924/00 , H01L2924/01047 , H01L2924/00012 , H01L2924/0665
摘要： In a case where a first mounted substrate to which a semiconductor element is bounded by solder is mounted on a second substrate, connection strength becomes low, when the first mounted substrate is bonded to the second substrate by using a solder having a low melting point. A mounted structure, in which a first mounted substrate on which a semiconductor element is bonded by using a first solder having a melting point of 217° C. or more, is mounted on a second substrate, includes plural bonding parts bonding the first mounted substrate to the second substrate; and a reinforcing member formed around the bonding part. Each of the bonding parts contains a second solder having a melting point, that is lower than the melting point of the first solder, and a space exists, in which the reinforcing members do not exist, between the bonding parts neighboring each other.
摘要翻译： 在通过使用具有低熔点的焊料将第一安装基板接合到第二基板的情况下，在第二基板上安装半导体元件被焊料界定的第一安装基板的情况下，连接强度变低。 一种安装结构，其中通过使用熔点为217℃或更高的第一焊料将半导体元件接合在其上的第一安装基板安装在第二基板上，包括多个接合部分接合第一安装基板 到第二基板; 以及形成在所述接合部周围的加强部件。 每个接合部分包含熔点低于第一焊料的熔点的第二焊料，并且在彼此相邻的接合部分之间存在不存在增强部件的空间。
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公开(公告)号：US08217403B1
公开(公告)日：2012-07-10
申请号：US13179073
申请日：2011-07-08
申请人： Shigenobu Sekine , Yurina Sekine
发明人： Shigenobu Sekine , Yurina Sekine
IPC分类号： H01L27/15
CPC分类号： H05K1/097 , H01L23/49866 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L31/022425 , H01L31/0682 , H01L33/62 , H01L2224/16145 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/81191 , H01L2224/81193 , H01L2224/81395 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/8359 , H01L2224/83605 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83618 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/8366 , H01L2224/83666 , H01L2224/83669 , H01L2224/83701 , H01L2224/83799 , H01L2224/83815 , H01L2224/83825 , H01L2224/83851 , H01L2224/83886 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/01327 , H01L2924/12041 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H05K1/111 , H05K2201/0338 , H05K2201/099 , Y02E10/547 , Y02P70/611 , H01L2924/00 , H01L2224/8159 , H01L2924/00014 , H01L2224/81799 , H01L2924/00012 , H01L2224/81639 , H01L2224/81647 , H01L2224/81644 , H01L2224/81669 , H01L2224/81666 , H01L2224/81624 , H01L2224/81618 , H01L2224/8166 , H01L2224/81655 , H01L2224/81611 , H01L2224/81609 , H01L2224/81613 , H01L2224/81605 , H01L2224/29075
摘要： An electronic device includes a substrate and an electronic component. The substrate has a metallized trace. The metallized trace has a metallized layer and an insulation layer. The metallized layer has a high melting point metal component and a low melting point metal component, the high melting point metal component and the low melting point metal component being diffusion bonded together. The insulation layer is formed simultaneously with the metallized layer to cover an outer surface of the metallized layer. The electronic component is electrically connected to the metallized layer.
摘要翻译： 电子设备包括基板和电子部件。 衬底具有金属化迹线。 金属化迹线具有金属化层和绝缘层。 金属化层具有高熔点金属成分和低熔点金属成分，高熔点金属成分和低熔点金属成分被扩散接合在一起。 绝缘层与金属化层同时形成以覆盖金属化层的外表面。 电子部件电连接到金属化层。
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公开(公告)号：US09795036B2
公开(公告)日：2017-10-17
申请号：US14396297
申请日：2013-04-05
发明人： Arata Kishi , Hironori Munakata , Koji Motomura , Hiroki Maruo
CPC分类号： H05K1/181 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/10156 , H01L2224/16238 , H01L2224/2929 , H01L2224/293 , H01L2224/32052 , H01L2224/32057 , H01L2224/32225 , H01L2224/73203 , H01L2224/81052 , H01L2224/81191 , H01L2224/8159 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81639 , H01L2224/81647 , H01L2224/81815 , H01L2224/81935 , H01L2224/81951 , H01L2224/81986 , H01L2224/83104 , H01L2224/83192 , H01L2224/9211 , H01L2224/92125 , H01L2924/00014 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/384 , H05K3/3436 , H05K3/3463 , H05K3/3484 , H05K2201/10734 , H05K2201/10977 , H05K2201/10992 , H05K2201/2009 , H05K2201/2036 , H05K2201/2045 , Y02P70/613 , H01L2924/00012 , H01L2924/00
摘要： A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.
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公开(公告)号：US20150116970A1
公开(公告)日：2015-04-30
申请号：US14396297
申请日：2013-04-05
发明人： Arata Kishi , Hironori Munakata , Koji Motomura , Hiroki Maruo
CPC分类号： H05K1/181 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/10156 , H01L2224/16238 , H01L2224/2929 , H01L2224/293 , H01L2224/32052 , H01L2224/32057 , H01L2224/32225 , H01L2224/73203 , H01L2224/81052 , H01L2224/81191 , H01L2224/8159 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81639 , H01L2224/81647 , H01L2224/81815 , H01L2224/81935 , H01L2224/81951 , H01L2224/81986 , H01L2224/83104 , H01L2224/83192 , H01L2224/9211 , H01L2224/92125 , H01L2924/00014 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/384 , H05K3/3436 , H05K3/3463 , H05K3/3484 , H05K2201/10734 , H05K2201/10977 , H05K2201/10992 , H05K2201/2009 , H05K2201/2036 , H05K2201/2045 , Y02P70/613 , H01L2924/00012 , H01L2924/00
摘要： A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.
摘要翻译： 安装结构包括将电路板（105）的第二电极（104）和半导体封装（101）的凸块（103）接合的接合材料（106），所述接合材料（106）被第一增强树脂 （107）。 此外，半导体封装（101）的外周与电路基板（105）之间的部分被第二增强树脂（108）覆盖。 即使接合材料（106）是具有比常规接合材料低的熔点的焊料，也可获得高的耐滴落性。
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公开(公告)号：US09603295B2
公开(公告)日：2017-03-21
申请号：US14007808
申请日：2012-04-02
CPC分类号： H05K13/0465 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/10126 , H01L2224/13111 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81193 , H01L2224/81411 , H01L2224/81413 , H01L2224/8149 , H01L2224/8159 , H01L2224/81613 , H01L2224/81815 , H01L2224/81862 , H01L2224/81885 , H01L2924/01006 , H01L2924/01029 , H01L2924/01049 , H01L2924/0105 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/15788 , H01L2924/19105 , H01L2924/20106 , H01L2924/351 , H05K1/141 , H05K1/181 , H05K3/3436 , H05K3/3463 , H05K2201/10977 , H05K2203/047 , Y02P70/613 , H01L2924/00 , H01L2924/01047 , H01L2924/00012 , H01L2924/0665
摘要： In a case where a first mounted substrate to which a semiconductor element is bounded by solder is mounted on a second substrate, connection strength becomes low, when the first mounted substrate is bonded to the second substrate by using a solder having a low melting point. A mounted structure, in which a first mounted substrate on which a semiconductor element is bonded by using a first solder having a melting point of 217° C. or more, is mounted on a second substrate, includes plural bonding parts bonding the first mounted substrate to the second substrate; and a reinforcing member formed around the bonding part. Each of the bonding parts contains a second solder having a melting point, that is lower than the melting point of the first solder, and a space exists, in which the reinforcing members do not exist, between the bonding parts neighboring each other.
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公开(公告)号：US08686299B2
公开(公告)日：2014-04-01
申请号：US13382368
申请日：2010-05-26
申请人： Koji Motomura , Seiichi Yoshinaga , Tadahiko Sakai
发明人： Koji Motomura , Seiichi Yoshinaga , Tadahiko Sakai
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/98 , H01L2224/0401 , H01L2224/06151 , H01L2224/06155 , H01L2224/131 , H01L2224/14135 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17135 , H01L2224/17179 , H01L2224/17505 , H01L2224/17517 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32052 , H01L2224/32225 , H01L2224/33179 , H01L2224/73203 , H01L2224/8114 , H01L2224/81191 , H01L2224/81193 , H01L2224/81194 , H01L2224/8121 , H01L2224/8159 , H01L2224/81599 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81616 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81815 , H01L2224/81855 , H01L2224/81905 , H01L2224/83104 , H01L2224/83136 , H01L2224/83192 , H01L2224/83194 , H01L2224/8321 , H01L2224/8359 , H01L2224/83599 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83616 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83855 , H01L2224/92125 , H01L2224/9221 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01048 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/225 , H05K3/3436 , H05K2203/0425 , H05K2203/176 , Y02P70/613 , Y10T29/49144 , Y10T29/49146 , H01L2924/00014 , H01L2924/01014 , H01L2924/00 , H01L2224/73204 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： An electronic element unit (1) includes an electronic element (2) having a plurality of connecting terminals (12) on a lower surface thereof, a circuit board (3) having a plurality of electrodes (22) corresponding to the connecting terminals (12) on an upper surface thereof. The connecting terminals (12) and the electrodes (22) are connected by solder bumps (23), and the electronic element (2) and the circuit board (3) are partly bond by a resin bond part (24) made of a thermosetting material of a thermosetting resin, and a metal powder (25) is included in the resin bond parts (24) in a dispersed state. The metal powder (25) has a melting point lower than a temperature at which the resin bond parts (24) are heated when a work (a repairing work) is carried out for removing the electronic element (2) from the circuit board (3).
摘要翻译： 电子元件单元（1）包括在其下表面上具有多个连接端子（12）的电子元件（2），具有对应于连接端子（12）的多个电极（22）的电路板（3） ）在其上表面。 连接端子（12）和电极（22）通过焊锡凸块（23）连接，电子元件（2）和电路板（3）通过由热固性树脂制成的树脂粘接部分（24） 热固性树脂的材料和金属粉末（25）以分散状态包含在树脂粘合部分（24）中。 当进行从电路板（3）移除电子元件（2）的工件（修理作业）时，金属粉末（25）的熔点低于加热树脂接合部分（24）的温度 ）。
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