公开(公告)号：US09093812B2

公开(公告)日：2015-07-28

申请号：US14556042

申请日：2014-11-28

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Makoto Ryudo ,  Naoto Ueda

IPC: G02B6/36 ,  H01S5/022 ,  G02B6/42 ,  H01S5/026 ,  H01S5/40

CPC classification number: H01S5/02284 ,  G02B6/4237 ,  G02B6/4249 ,  H01S5/02256 ,  H01S5/026 ,  H01S5/4025

Abstract: A semiconductor laser module includes a laser diode array, an optical fiber array, a fiber array fitting for fixing the optical fiber array, a casing, and a support fitting for fixing the fiber array fitting and casing. The fiber array fitting and support fitting have a first contact section that is in line-contact or surface-contact with the plane section parallel with the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the first contact section. The support fitting and casing have a second contact section that is in line-contact or surface-contact with the plane section vertical to the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the second contact section.

Abstract translation: 半导体激光器模块包括激光二极管阵列，光纤阵列，用于固定光纤阵列的光纤阵列配件，壳体和用于固定光纤阵列配件和外壳的支撑配件。 光纤阵列配件和支撑配件具有与平行于激光二极管阵列的发光表面的平面部分线接触或表面接触的第一接触部分，并且被激光焊接并彼此固定在 第一接触部分。 支撑配件和壳体具有第二接触部分，其与垂直于激光二极管阵列的发光表面的平面部分线接触或表面接触，并且在第二接触处被激光焊接并彼此固定 部分。

公开(公告)号：US10003169B2

公开(公告)日：2018-06-19

申请号：US15511049

申请日：2015-08-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takuma Motofuji ,  Takayuki Yoshida ,  Naoto Ueda ,  Kouji Oomori

IPC: H01S3/08 ,  H01S5/00 ,  H01S5/022 ,  H01S5/40 ,  G02B19/00

CPC classification number: H01S5/005 ,  G02B19/0014 ,  G02B19/0057 ,  G02B27/0922 ,  G02B27/0961 ,  G02B27/0966 ,  H01S5/022 ,  H01S5/02288 ,  H01S5/4025 ,  H01S5/4031

Abstract: A laser module according to the present disclosure includes a laser diode, a first collimating lens, and a beam twister. The laser diode includes a plurality of emitters and emits laser light from each of the plurality of emitters through a light emission surface. The first collimating lens is provided at a first distance from the light emission surface of the laser diode and parallelizes a fast-axis-wise divergence of the laser light. The beam twister is provided at a second distance away from the first collimating lens and turns the laser light approximately 90 degrees. Each of the plurality of emitters has a width of 5 μm to 120 μm on the light emission surface. The plurality of emitters have a pitch of 295 μm to 305 μm on the light emission surface.

公开(公告)号：US10424897B2

公开(公告)日：2019-09-24

申请号：US16071987

申请日：2017-02-27

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Naoto Ueda ,  Kouji Oomori ,  Takayuki Yoshida

IPC: H01S5/024 ,  H01S5/022 ,  H01S5/026 ,  H01S5/042 ,  H01S5/40

Abstract: A semiconductor laser device includes a heat sink, a submount, a first electrode, an insulating layer, a semiconductor laser element, a connecting portion, and a second electrode. The submount is conductive and on a first region of an upper surface of the heat sink. The first electrode is conductive and on a second region, different from the first region, of the upper surface of the heat sink. The first electrode is electrically connected either to at least part of a side surface of the submount or to an upper surface of the submount.

公开(公告)号：US10290560B2

公开(公告)日：2019-05-14

申请号：US15517338

申请日：2015-08-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Naoto Ueda ,  Kouji Oomori ,  Takayuki Yoshida ,  Takuma Motofuji

IPC: H01S5/024 ,  H01L23/373 ,  H01L23/36 ,  H01L23/48 ,  H01L25/07 ,  H01L25/18 ,  H01S5/042 ,  H01L23/06 ,  H01L23/13 ,  H01L23/14 ,  H01L23/40 ,  H01L23/00 ,  H01S5/022 ,  H01L29/861

Abstract: A semiconductor device according to the present disclosure includes an electrically conductive first electrode block, an electrically conductive submount, an insulating layer, a semiconductor element, an electrically conductive bump, and an electrically conductive second electrode block. The submount is provided in a first region of the upper surface of the first electrode block, and electrically connected to the first electrode block. The semiconductor element is provided on the submount, and has a first electrode electrically connected to the submount. The bump is provided on the upper surface of a second electrode, opposite the first electrode, of the semiconductor element, and electrically connected to the second electrode. A third region of the lower surface of the second electrode block is electrically connected to the bump via an electrically conductive metal layer. An electrically conductive metal sheet is provided between the metal layer and the bump.