公开(公告)号：US11938561B2

公开(公告)日：2024-03-26

申请号：US17232412

申请日：2021-04-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Izuru Nakai ,  Takaaki Kassai ,  Takayuki Yoshida

IPC: B23K26/0622 ,  B23K26/064 ,  B23K26/067

CPC classification number: B23K26/0622 ,  B23K26/064 ,  B23K26/067

Abstract: A laser processing apparatus includes a light source configured to emit laser light; a power supply configured to supply a current to the light source; a deflection unit on an optical path of the laser light and including an optical element configured to change an amount of transmission of the laser light to deflect at least a part of the laser light; an optical separation unit on the optical path of the laser light and being configured to shield higher-order light included in the laser light and deflected by the optical element in the deflection unit, and transmit zero-order light that is included in the laser light and passes through the deflection unit; and a signal synchronization unit configured to control the power supply to selectively turn the current on or off in synchronization with a timing at which the higher-order light is deflected by the optical element.

公开(公告)号：US10003169B2

公开(公告)日：2018-06-19

申请号：US15511049

申请日：2015-08-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takuma Motofuji ,  Takayuki Yoshida ,  Naoto Ueda ,  Kouji Oomori

IPC: H01S3/08 ,  H01S5/00 ,  H01S5/022 ,  H01S5/40 ,  G02B19/00

CPC classification number: H01S5/005 ,  G02B19/0014 ,  G02B19/0057 ,  G02B27/0922 ,  G02B27/0961 ,  G02B27/0966 ,  H01S5/022 ,  H01S5/02288 ,  H01S5/4025 ,  H01S5/4031

Abstract: A laser module according to the present disclosure includes a laser diode, a first collimating lens, and a beam twister. The laser diode includes a plurality of emitters and emits laser light from each of the plurality of emitters through a light emission surface. The first collimating lens is provided at a first distance from the light emission surface of the laser diode and parallelizes a fast-axis-wise divergence of the laser light. The beam twister is provided at a second distance away from the first collimating lens and turns the laser light approximately 90 degrees. Each of the plurality of emitters has a width of 5 μm to 120 μm on the light emission surface. The plurality of emitters have a pitch of 295 μm to 305 μm on the light emission surface.

公开(公告)号：US09853415B2

公开(公告)日：2017-12-26

申请号：US15322232

申请日：2015-07-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takayuki Yoshida ,  Jing-Bo Wang

IPC: H01S3/04 ,  H01S5/024 ,  H01S5/042 ,  H01S5/42 ,  H01S5/40

CPC classification number: H01S5/02423 ,  H01L23/473 ,  H01L2924/0002 ,  H01S5/024 ,  H01S5/02476 ,  H01S5/0425 ,  H01S5/4025 ,  H01S5/42 ,  H01L2924/00

Abstract: A semiconductor laser device of the present disclosure includes a cooling plate, an insulating sheet, a first cooling block, and a first semiconductor laser element. The conductive cooling plate includes a water supply passage and a drain passage. The insulating sheet is provided to the cooling plate, and includes a first through hole connected to the water supply passage and a second through hole connected to the drain passage. A first cooling block is provided to the insulating sheet, includes therein a first tube connected to the first through hole and the second through hole, and is electrically conductive. The first semiconductor laser element is provided to the first cooling block. The first semiconductor laser element includes a first electrode, and a second electrode opposite to the first electrode. The first electrode is electrically connected to the first cooling block, and the cooling plate is at a floating potential.

公开(公告)号：US10424897B2

公开(公告)日：2019-09-24

申请号：US16071987

申请日：2017-02-27

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Naoto Ueda ,  Kouji Oomori ,  Takayuki Yoshida

IPC: H01S5/024 ,  H01S5/022 ,  H01S5/026 ,  H01S5/042 ,  H01S5/40

Abstract: A semiconductor laser device includes a heat sink, a submount, a first electrode, an insulating layer, a semiconductor laser element, a connecting portion, and a second electrode. The submount is conductive and on a first region of an upper surface of the heat sink. The first electrode is conductive and on a second region, different from the first region, of the upper surface of the heat sink. The first electrode is electrically connected either to at least part of a side surface of the submount or to an upper surface of the submount.

公开(公告)号：US10290560B2

公开(公告)日：2019-05-14

申请号：US15517338

申请日：2015-08-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Naoto Ueda ,  Kouji Oomori ,  Takayuki Yoshida ,  Takuma Motofuji

IPC: H01S5/024 ,  H01L23/373 ,  H01L23/36 ,  H01L23/48 ,  H01L25/07 ,  H01L25/18 ,  H01S5/042 ,  H01L23/06 ,  H01L23/13 ,  H01L23/14 ,  H01L23/40 ,  H01L23/00 ,  H01S5/022 ,  H01L29/861

Abstract: A semiconductor device according to the present disclosure includes an electrically conductive first electrode block, an electrically conductive submount, an insulating layer, a semiconductor element, an electrically conductive bump, and an electrically conductive second electrode block. The submount is provided in a first region of the upper surface of the first electrode block, and electrically connected to the first electrode block. The semiconductor element is provided on the submount, and has a first electrode electrically connected to the submount. The bump is provided on the upper surface of a second electrode, opposite the first electrode, of the semiconductor element, and electrically connected to the second electrode. A third region of the lower surface of the second electrode block is electrically connected to the bump via an electrically conductive metal layer. An electrically conductive metal sheet is provided between the metal layer and the bump.