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公开(公告)号：US12273996B2
公开(公告)日：2025-04-08
申请号：US17441492
申请日：2020-03-26
Inventor： Tomohiro Fukao , Tomoaki Sawada , Takatoshi Abe , Kyosuke Michigami
Abstract: A fiber sheet includes: a resin layer containing a thermosetting resin; and a fiber layer, wherein the fiber sheet is stretchable by 1% or more, and an initial tensile elastic modulus of the fiber sheet is 1 MPa or more and 1 GPa or less.
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公开(公告)号：US11239004B2
公开(公告)日：2022-02-01
申请号：US17041791
申请日：2019-03-29
Inventor： Tomohiro Fukao , Tomoaki Sawada , Takatoshi Abe
IPC: H01B1/22 , C08F220/32 , C08K3/04 , C08K3/08
Abstract: A conductive composition is provided and at least includes an acrylic resin and a conductive powder, wherein the acrylic resin at least contains a polymer unit (A) of a (meth)acrylate having an epoxy group and a polymer unit (B) of a (meth)acrylate having an isobornyl group, and an amount of the polymer unit (B) is 5.0 parts by mass or more and 50.0 parts by mass or less based on 100 parts by mass of the acrylic resin.
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公开(公告)号：US10966317B2
公开(公告)日：2021-03-30
申请号：US16209518
申请日：2018-12-04
Inventor： Takatoshi Abe , Tomoaki Sawada , Shingo Yoshioka
IPC: H05K1/03 , H05K1/02 , C09J171/00 , H05K1/18 , H05K3/00
Abstract: A sheet-shaped stretchable structure including stretchable resin sheets laminated together is provided. A conductive layer may be disposed at least at one of several positions. For example, the conductive layer may be disposed between any two adjacent ones of the laminated stretchable resin sheets. The conductive layer may be disposed on a top surface of an uppermost one of the laminated stretchable resin sheets. Further, the conductive layer may be disposed on a bottom surface of a lowermost one of the laminated stretchable resin sheets, and a via hole.
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公开(公告)号：US09839119B2
公开(公告)日：2017-12-05
申请号：US14405533
申请日：2014-10-08
Inventor： Tomoaki Sawada , Shingo Yoshioka , Takatoshi Abe
IPC: G06F3/041 , H01B1/24 , H01L31/0224 , H05K1/02 , H05K1/03 , C08J5/18 , C08K7/02 , C08L101/00 , H01B1/02 , C08J7/04 , C09D105/16 , B32B5/02 , C09D163/00 , B32B15/092 , B32B15/08 , B32B3/12 , B32B3/26
CPC classification number: H05K1/0271 , B32B3/12 , B32B3/266 , B32B5/02 , B32B15/08 , B32B15/092 , B32B2260/021 , B32B2260/046 , B32B2262/103 , B32B2262/106 , B32B2262/14 , B32B2307/202 , B32B2307/412 , B32B2307/50 , B32B2363/00 , C08J5/18 , C08J7/047 , C08J2300/21 , C08J2367/02 , C08J2400/21 , C08J2463/00 , C08K7/02 , C08L101/00 , C09D105/16 , C09D163/00 , G06F3/041 , H01B1/02 , H01B1/24 , H01L31/022466 , H01L31/022491 , H05K1/0213 , H05K1/0274 , H05K1/028 , H05K1/0296 , H05K1/0326 , H05K1/0333 , H05K1/0366 , H05K2201/0108 , H05K2201/012 , H05K2201/0323 , H05K2201/0326 , Y10T428/24331 , Y10T428/24917 , C08L63/00
Abstract: The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to an electrically conductive film wherein the stress relaxation rate (R) and the residual strain rate (alpha), as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.
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公开(公告)号：US11963558B2
公开(公告)日：2024-04-23
申请号：US17603765
申请日：2020-04-16
Inventor： Takatoshi Abe , Tomohiro Fukao , Tomoaki Sawada , Susumu Fukushima
CPC classification number: A41D1/005 , H05K1/0277 , H05K1/181 , H05K2201/2009
Abstract: A circuit mounted article to be fixed to a fabric is provided and includes a circuit board having flexibility, an electronic component mounted on a fabric facing face side, which faces the fabric, of the circuit board, and further a reinforcing portion to be used for fixing of the circuit mounted article to the fabric on the fabric facing face side of the circuit board.
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Patent Agency Ranking
公开(公告)号：US11864310B2
公开(公告)日：2024-01-02
申请号：US17603781
申请日：2020-04-16
Inventor： Takatoshi Abe , Tomohiro Fukao , Tomoaki Sawada , Kyosuke Michigami
CPC classification number: H05K1/0283 , A41D1/002 , H05K1/09 , H05K2201/0311 , H05K2201/0355
Abstract: A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.
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公开(公告)号：US10009994B2
公开(公告)日：2018-06-26
申请号：US14405541
申请日：2014-03-07
Inventor： Tomoaki Sawada , Takatoshi Abe , Shingo Yoshioka
IPC: H05K1/02 , C08J5/18 , C08K7/02 , C08L101/00 , G06F3/041 , H01B1/02 , H01L31/0224 , H05K1/03 , C08J7/04 , C09D105/16 , B32B5/02 , H01B1/24 , C09D163/00 , B32B15/092 , B32B15/08 , B32B3/12 , B32B3/26
CPC classification number: H05K1/0271 , B32B3/12 , B32B3/266 , B32B5/02 , B32B15/08 , B32B15/092 , B32B2260/021 , B32B2260/046 , B32B2262/103 , B32B2262/106 , B32B2262/14 , B32B2307/202 , B32B2307/412 , B32B2307/50 , B32B2363/00 , C08J5/18 , C08J7/047 , C08J2300/21 , C08J2367/02 , C08J2400/21 , C08J2463/00 , C08K7/02 , C08L101/00 , C09D105/16 , C09D163/00 , G06F3/041 , H01B1/02 , H01B1/24 , H01L31/022466 , H01L31/022491 , H05K1/0213 , H05K1/0274 , H05K1/028 , H05K1/0296 , H05K1/0326 , H05K1/0333 , H05K1/0366 , H05K2201/0108 , H05K2201/012 , H05K2201/0323 , H05K2201/0326 , Y10T428/24331 , Y10T428/24917 , C08L63/00
Abstract: The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate α, as measured in a prescribed extension-restoration test, are as follows: 20%≤R≤95% and 0%≤α≤3%.
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公开(公告)号：US12207397B2
公开(公告)日：2025-01-21
申请号：US17440453
申请日：2020-03-26
Inventor： Tomohiro Fukao , Tomoaki Sawada , Takatoshi Abe , Kyosuke Michigami , Makoto Takashiro , Susumu Fukushima , Daisuke Honda
Abstract: Provided is a stretchable circuit board including a stretchable insulating layer, and a wiring, in which the wiring is formed of a combination of a metal wiring portion that forms a main portion of the wiring, and a conductive stretchable portion disposed ancillary to the metal wiring portion.
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公开(公告)号：US11503706B2
公开(公告)日：2022-11-15
申请号：US17371955
申请日：2021-07-09
Inventor： Takatoshi Abe , Tomoaki Sawada , Tomohiro Fukao
Abstract: A stretchable circuit board includes a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material. The land part is formed of a patterned metal foil, or a printed product of an electroconductive ink containing metal particles. The stretchable base material has a tensile modulus at 25° C. room temperature of 0.5 MPa to 0.5 GPa.
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公开(公告)号：US11096276B2
公开(公告)日：2021-08-17
申请号：US16643764
申请日：2018-09-03
Inventor： Takatoshi Abe , Tomoaki Sawada , Tomohiro Fukao
Abstract: The present application relates to a circuit board for use in electronic components. Specifically, the present application relates to a stretchable circuit board including a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material.
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