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11 条记录 (耗时 0.019 秒)

    Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor
    1.
    发明申请
    Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor 有权
    具有通孔的硅芯片载体使用激光辅助化学气相沉积导体

    公开(公告)号：US20050082676A1

    公开(公告)日：2005-04-21

    申请号：US10686640

    申请日：2003-10-17

    申请人： Paul Andry ,  Leena Buchwalter ,  Russell Budd ,  Thomas Wassick

    发明人： Paul Andry ,  Leena Buchwalter ,  Russell Budd ,  Thomas Wassick

    IPC分类号： H01L21/768 ,  H01L23/48

    CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

    摘要： This disclosure teaches a method of filling deep vias or capping deep conducting paste filled vias in silicon or glass substrate using laser assisted chemical vapor deposition of metals. This method uses a continuous wave or pulsed laser to heat the via bottom and the growing metal fill selectively by selecting the laser wavelength such that silicon and/or glass do not absorb the energy of the laser in any appreciable manner to cause deposition in the field. Alternatively holographic mask or an array of micro lenses may be used to focus the laser beams to the vias to fill them with metal. The substrate is moved in a controlled manner in the z-direction away from the laser at about the rate of deposition thus causing the laser heating to be focused on the surface region of the growing metal fill.

    摘要翻译： 该公开内容教导了使用金属的激光辅助化学气相沉积在硅或玻璃基板中填充深通孔或者封装深导电糊填充通孔的方法。 该方法使用连续波或脉冲激光器通过选择激光波长来选择性地加热通孔底部和生长金属填充物，使得硅和/或玻璃不以任何可察觉的方式吸收激光的能量以在场中沉积 。 或者，可以使用全息掩模或微透镜阵列来将激光束聚焦到通孔以用金属填充它们。 以大约的沉积速率，以z方向以受控方式远离激光器移动衬底，从而使激光加热聚焦在生长金属填充物的表面区域上。

    Optical assembly with optoelectronic device alignment
    4.
    发明申请
    Optical assembly with optoelectronic device alignment 有权
    具有光电器件对准的光学组件

    公开(公告)号：US20060045410A1

    公开(公告)日：2006-03-02

    申请号：US10931713

    申请日：2004-09-01

    申请人： Gary Trott ,  Russell Budd ,  Jeannine Trewhella

    发明人： Gary Trott ,  Russell Budd ,  Jeannine Trewhella

    IPC分类号： G02B6/12

    CPC分类号： G02B6/423 ,  G02B6/4214 ,  G02B6/4228 ,  G02B6/4232

    摘要： At least one optical waveguide is supported on a substrate and has a plurality of key apertures formed in a complaint element thereof. An optoelectronic device such as a vertical cavity surface emitting laser (VCSEL) has a plurality of projections that register with corresponding key apertures to position the optoelectronic device in a predetermined alignment relative to the optical waveguide.

    摘要翻译： 至少一个光波导支撑在基板上，并且在其投诉元件中形成有多个键孔。 诸如垂直腔表面发射激光器（VCSEL）的光电子器件具有多个突起，其与相应的键孔对准，以相对于光波导以预定的对准定位光电器件。

    Compact optical system and packaging for head mounted display
    5.
    发明申请
    Compact optical system and packaging for head mounted display 有权
    紧凑的光学系统和头戴式显示器的包装

    公开(公告)号：US20050219152A1

    公开(公告)日：2005-10-06

    申请号：US10764638

    申请日：2004-01-26

    申请人： Russell Budd ,  Derek Dove ,  Istvan Lovas ,  Robert Olyha ,  Carl Powell

    发明人： Russell Budd ,  Derek Dove ,  Istvan Lovas ,  Robert Olyha ,  Carl Powell

    IPC分类号： G02B5/04 ,  G02B1/10 ,  G02B5/10 ,  G02B5/30 ,  G02B17/08 ,  G02B27/00 ,  G02B27/01 ,  G02B27/02 ,  H04N5/64 ,  G09G5/00

    CPC分类号： G02B27/0172 ,  G02B5/30 ,  G02B27/0176 ,  G02B2027/0132 ,  G02B2027/0178

    摘要： A head mounted virtual image display unit is provided which is compact in size and weight, and incorporates a high performance optical system offering a clear see-through capability. A sliding light shield may be incorporated for those instances when see-through capability is not desired. A focus adjustment may be incorporated to permit the focusing of the image, for example, at a distance of approximately 18 inches to infinity. An adjustable headband may be incorporated that adapts to fit the users head. A flexible boom structure may be incorporated to facilitate fine positional adjustment of the optical assembly. A slider and ball joint mechanism may also be incorporated to facilitate positional adjustment of the optical assembly. A built-in microphone may be incorporated to enable speech input by the user. The head mounted virtual image display unit may be used comfortably in conjunction with eye or safety glasses, and provides a useful image to the user without blocking his view of the surrounding environment. The unit is designed to have a pleasing appearance so as to greatly enhance user acceptability.

    摘要翻译： 提供头戴式虚拟图像显示单元，其尺寸和重量紧凑，并且包括提供清晰透视能力的高性能光学系统。 对于不需要透视能力的那些情况，可以结合滑动遮光罩。 可以结合焦点调整以允许图像的聚焦，例如在大约18英寸到无穷远的距离处。 可以并入可调节的头带以适应用户头部。 可并入柔性起重臂结构以便于光学组件的精细位置调整。 还可以结合滑块和球接头机构以便于光学组件的位置调整。 可以并入内置麦克风以使用户能够进行语音输入。 头戴式虚拟图像显示单元可以舒适地与眼睛或安全眼镜结合使用，并且向用户提供有用的图像而不阻挡他对周围环境的观察。 该单元设计具有令人愉快的外观，从而大大提高用户的可接受性。

    Silicon based optical vias
    9.
    发明申请
    Silicon based optical vias 有权
    硅基光通孔

    公开(公告)号：US20070085215A1

    公开(公告)日：2007-04-19

    申请号：US10675139

    申请日：2003-09-30

    申请人： Russell Budd ,  Punit Chiniwalla ,  Chirag Patel

    发明人： Russell Budd ,  Punit Chiniwalla ,  Chirag Patel

    IPC分类号： H01L23/48

    CPC分类号： G02B6/43 ,  H01L23/481 ,  H01L2924/0002 ,  H05K1/0274 ,  H01L2924/00

    摘要： Method of fabricating a semiconductor die with a microlens associated therewith. More particularly, a method for fabricating a vertical channel guide optical via through a silicon substrate wherein the optical via can contain lens elements, a discrete index gradient guiding pillar and other embodiments. Also disclosed are means for transferring, coupling and or focusing light from an electronic-optical device on the top of a semiconductor substrate through the substrate to a waveguiding medium below the substrate. The high alignment accuracies afforded by standard semiconductor fabrication processes are exploited so as to obviate the need for active alignment of the optical coupling or light guiding elements.

    摘要翻译： 制造具有与之相关联的微透镜的半导体管芯的方法。 更具体地，涉及一种通过硅衬底制造垂直沟道引导光通孔的方法，其中光通孔可以包含透镜元件，离散折射率梯度引导柱和其它实施例。 还公开了用于将来自半导体衬底顶部的电子光学器件的光通过衬底转移，耦合和聚焦到衬底下面的波导介质的装置。 利用由标准半导体制造工艺提供的高对准精度，以便消除对光学耦合或导光元件的主动对准的需要。