Abstract:
A method of rebuilding a solenoid for use in automatic transmissions is disclosed. In one embodiment, an improvement over the original equipment design allows for increased durability of the solenoid. In another embodiment, a lower cost method is disclosed for reusing an expensive component. In either case, various components within the solenoid are reused, reconditioned or replaced. A preferred process for disassembling the solenoid is also disclosed.
Abstract:
A sensor including a bobbin including a first region adapted to receive windings and a second region defining a cavity formed in the bobbin. A first electrical terminal is coupled to the bobbin and disposed in the cavity and a second electrical terminal is coupled to the bobbin and disposed in the cavity. A wire including a wound portion wound about the first region. The wire is conductively coupled to the first terminal and the second terminal to provide an electrically conductive pathway from the first terminal to the second terminal. A magnetizable core is disposed at least partially within the wound portion and a magnet is positioned adjacent the magnetizable core. An overmolded shell defining an exterior surface of the sensor encapsulates at least the first region and the wound portion and contacts at least the wound portion.
Abstract:
A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.
Abstract:
A sensor including a sensor core is disclosed. The sensor core includes a magnet, a pole piece, a bobbin, at least two terminals coupled to the bobbin, and a conductor wound about the bobbin and coupled to the terminals. At least a portion of the windings are disposed about at least a portion of the pole piece. The magnet is disposed substantially adjacent the pole piece. A support contacts at least a portion of the conductor. A supported portion of the conductor is located between the windings and the terminals. A sensor housing surrounds at least a portion of the sensor core. A method of manufacturing a sensor including providing a sensor core including a magnet, a pole piece, a bobbin, at least two terminals, and a conductor which is wound about the bobbin and coupled to the terminals is further disclosed. At least a portion of the windings surround at least a portion of the pole piece. The magnet is disposed substantially adjacent the pole piece. The method further includes adding support for a portion of conductor located in a region between windings, introducing the sensor core into a housing, and forming a seal between the sensor core and the housing. A manufacturing method including providing a magnetic circuit including a wire, the wire having a wound portion, a first portion conductively coupled to a first terminal, and second portion conductively coupled to a second terminal, the first terminal and the second terminal conductively coupled to a third terminal and a fourth terminal is also disclosed. The method further includes reinforcing a section of the wire located in a position between the wound portion and at least one of the first terminal and the second terminal, surrounding the magnetic circuit with a protective shell, and providing a seal effective to substantially seal the magnetic circuit within the shell.
Abstract:
A sensor including a bobbin including a first region adapted to receive windings and a second region defining a cavity formed in the bobbin. A first electrical terminal is coupled to the bobbin and disposed in the cavity and a second electrical terminal is coupled to the bobbin and disposed in the cavity. A wire including a wound portion wound about the first region. The wire is conductively coupled to the first terminal and the second terminal to provide an electrically conductive pathway from the first terminal to the second terminal. A magnetizable core is disposed at least partially within the wound portion and a magnet is positioned adjacent the magnetizable core. An overmolded shell defining an exterior surface of the sensor encapsulates at least the first region and the wound portion and contacts at least the wound portion.
Abstract:
A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.
Abstract:
A printed circuit assembly (PCA) that provides for a method of rebuilding an electrically operated automatic transmission solenoid module. The PCA allows for a repairable yet rugged interconnection of several solenoids that reside within the span of the module assembly.
Abstract:
A composite polishing pad for use in chemical-mechanical planarization (CMP) processes, which polishing pad of the invention is made of a paper-making-process produced fibrous-matrix of paper-making fibers bound with resin material, and consists of a top section with one or more lower sections, where each layer has unique material properties. Polishing performance can be substantially improved by modifying the individual characteristics of each layer. Typically, the top layer or working surface will be of a higher modulus material than the lower layers. Therefore, the sub-layers may consist of lower density regions or a modified surface structure, such as grooving, to effectively modify the bulk modulus.
Abstract:
A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes. The flexibility of a manufacturer to use an expanded range of temperature and pressure in CMP processes, combined with a significant reduction in the cost of consumables, provides a significant advantage in the final cost of ownership in the production of multilayer, integrated circuit devices and other products where CMP is utilized in manufacture. Moreover, the retaining with wear pad of the present invention may also retrofitted to previously used and worn retaining rings of the prior-art design, thus salvaging the major structural component of the CMP processing apparatus, thereby reducing costs. It is also an integral part of this invention to make the consumable component of the new design replaceable, so as to make replacement of this part less costly when such replacement finally does become necessary.
Abstract:
A printed circuit assembly (PCA) that provides for a method of rebuilding an electrically operated automatic transmission solenoid module. The PCA allows for a repairable yet rugged interconnection of several solenoids that reside within the span of the module assembly.