Method of rebuilding solenoids for automatic transmissions
    1.
    发明授权
    Method of rebuilding solenoids for automatic transmissions 有权
    自动变速器电磁铁重建方法

    公开(公告)号:US08387254B2

    公开(公告)日:2013-03-05

    申请号:US12905409

    申请日:2010-10-15

    Applicant: Paul Fathauer

    Inventor: Paul Fathauer

    Abstract: A method of rebuilding a solenoid for use in automatic transmissions is disclosed. In one embodiment, an improvement over the original equipment design allows for increased durability of the solenoid. In another embodiment, a lower cost method is disclosed for reusing an expensive component. In either case, various components within the solenoid are reused, reconditioned or replaced. A preferred process for disassembling the solenoid is also disclosed.

    Abstract translation: 公开了一种重建用于自动变速器的螺线管的方法。 在一个实施例中,对原始设备设计的改进允许提高螺线管的耐久性。 在另一个实施例中,公开了一种用于重新使用昂贵部件的较低成本的方法。 在这两种情况下,螺线管内的各种部件被重新使用,修理或更换。 还公开了拆卸螺线管的优选方法。

    Transmission sensor with overmolding and method of manufacturing the same
    2.
    发明申请
    Transmission sensor with overmolding and method of manufacturing the same 审中-公开
    包覆成型传动传感器及其制造方法

    公开(公告)号:US20070176594A1

    公开(公告)日:2007-08-02

    申请号:US11358603

    申请日:2006-02-21

    CPC classification number: G01P3/465 G01P1/026 G01P3/488

    Abstract: A sensor including a bobbin including a first region adapted to receive windings and a second region defining a cavity formed in the bobbin. A first electrical terminal is coupled to the bobbin and disposed in the cavity and a second electrical terminal is coupled to the bobbin and disposed in the cavity. A wire including a wound portion wound about the first region. The wire is conductively coupled to the first terminal and the second terminal to provide an electrically conductive pathway from the first terminal to the second terminal. A magnetizable core is disposed at least partially within the wound portion and a magnet is positioned adjacent the magnetizable core. An overmolded shell defining an exterior surface of the sensor encapsulates at least the first region and the wound portion and contacts at least the wound portion.

    Abstract translation: 一种包括线轴的传感器,所述线轴包括适于接收绕组的第一区域和限定形成在所述线轴中的空腔的第二区域。 第一电端子耦合到线轴并设置在空腔中,并且第二电端子耦合到线轴并设置在空腔中。 一种线,包括围绕第一区域缠绕的缠绕部分。 导线与第一端子和第二端子导电耦合以提供从第一端子到第二端子的导电路径。 可磁化芯部至少部分地设置在卷绕部分内,并且磁体定位成与可磁化芯部相邻。 限定传感器的外表面的包覆成型外壳至少封装了第一区域和缠绕部分,并且至少与接合部分接触。

    Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same
    3.
    发明授权
    Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same 失效
    用于半导体晶片的化学机械平面化的抛光垫及其制造方法

    公开(公告)号:US06852020B2

    公开(公告)日:2005-02-08

    申请号:US10349201

    申请日:2003-01-22

    CPC classification number: B24B37/26 B24B37/24 B24D3/32

    Abstract: A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.

    Abstract translation: 一种抛光垫,用于对由多孔结构制成的基材进行化学机械抛光的抛光垫,该抛光垫包括由诸如酚醛树脂的热固性树脂结合的纤维等纤维构成的基质。 抛光垫表面具有在衬底的化学机械抛光期间抛光浆料流动的空隙,并且其中在衬底的化学机械抛光期间形成的碎屑被暂时储存以供随后的漂洗。 研磨垫的抛光表面以形成有助于浆料输送和抛光的凹凸,以及打开垫的多孔结构。 多孔垫包含纳米尺寸的填料颗粒,其加强了结构,与现有技术的垫相比,增加了耐磨性。 还公开了制造抛光垫的方法。

    Transmission sensor with overmolding and method of manufacturing the same
    4.
    发明申请
    Transmission sensor with overmolding and method of manufacturing the same 审中-公开
    包覆成型传动传感器及其制造方法

    公开(公告)号:US20070176595A1

    公开(公告)日:2007-08-02

    申请号:US11431895

    申请日:2006-05-10

    Applicant: Paul Fathauer

    Inventor: Paul Fathauer

    CPC classification number: G01P1/026 G01D11/24 G01P3/488

    Abstract: A sensor including a sensor core is disclosed. The sensor core includes a magnet, a pole piece, a bobbin, at least two terminals coupled to the bobbin, and a conductor wound about the bobbin and coupled to the terminals. At least a portion of the windings are disposed about at least a portion of the pole piece. The magnet is disposed substantially adjacent the pole piece. A support contacts at least a portion of the conductor. A supported portion of the conductor is located between the windings and the terminals. A sensor housing surrounds at least a portion of the sensor core. A method of manufacturing a sensor including providing a sensor core including a magnet, a pole piece, a bobbin, at least two terminals, and a conductor which is wound about the bobbin and coupled to the terminals is further disclosed. At least a portion of the windings surround at least a portion of the pole piece. The magnet is disposed substantially adjacent the pole piece. The method further includes adding support for a portion of conductor located in a region between windings, introducing the sensor core into a housing, and forming a seal between the sensor core and the housing. A manufacturing method including providing a magnetic circuit including a wire, the wire having a wound portion, a first portion conductively coupled to a first terminal, and second portion conductively coupled to a second terminal, the first terminal and the second terminal conductively coupled to a third terminal and a fourth terminal is also disclosed. The method further includes reinforcing a section of the wire located in a position between the wound portion and at least one of the first terminal and the second terminal, surrounding the magnetic circuit with a protective shell, and providing a seal effective to substantially seal the magnetic circuit within the shell.

    Abstract translation: 公开了一种包括传感器芯的传感器。 传感器芯包括磁体,极片,线轴,耦合到绕线管的至少两个端子,以及缠绕在线轴上并连接到端子的导体。 绕组的至少一部分围绕极片的至少一部分设置。 磁体大体上邻近极片设置。 支撑件接触导体的至少一部分。 导体的支撑部分位于绕组和端子之间。 传感器壳体围绕传感器芯的至少一部分。 还公开了一种制造传感器的方法,该传感器包括提供包括磁体,极片,线轴,至少两个端子的传感器芯和围绕绕线筒缠绕并连接到端子的导体。 绕组的至少一部分围绕极片的至少一部分。 磁体大体上邻近极片设置。 该方法还包括对位于绕组之间的区域中的导体的一部分添加支撑,将传感器芯引入壳体中,以及在传感器芯和壳体之间形成密封。 一种制造方法,包括提供包括线的磁路,所述线具有卷绕部分,导电耦合到第一端子的第一部分和与第二端子导电耦合的第二部分,所述第一端子和第二端子导电耦合到 也公开了第三终端和第四终端。 该方法还包括加强位于卷绕部分和第一端子和第二端子中的至少一个之间的位置处的导线的一部分,用保护壳围绕磁路,并且提供有效地基本上密封磁性的密封件 电路在壳内。

    Transmission sensor with overmolding and method of manufacturing the same

    公开(公告)号:US20070176593A1

    公开(公告)日:2007-08-02

    申请号:US11343959

    申请日:2006-01-31

    Applicant: Paul Fathauer

    Inventor: Paul Fathauer

    CPC classification number: G01P3/465 G01P1/026 G01P3/488

    Abstract: A sensor including a bobbin including a first region adapted to receive windings and a second region defining a cavity formed in the bobbin. A first electrical terminal is coupled to the bobbin and disposed in the cavity and a second electrical terminal is coupled to the bobbin and disposed in the cavity. A wire including a wound portion wound about the first region. The wire is conductively coupled to the first terminal and the second terminal to provide an electrically conductive pathway from the first terminal to the second terminal. A magnetizable core is disposed at least partially within the wound portion and a magnet is positioned adjacent the magnetizable core. An overmolded shell defining an exterior surface of the sensor encapsulates at least the first region and the wound portion and contacts at least the wound portion.

    POLISHING PAD FOR USE IN CHEMICAL/MECHANICAL PLANARIZATION OF SEMICONDUCTOR WAFERS HAVING A TRANSPARENT WINDOW FOR END-POINT DETERMINATION AND METHOD OF MAKING
    6.
    发明申请
    POLISHING PAD FOR USE IN CHEMICAL/MECHANICAL PLANARIZATION OF SEMICONDUCTOR WAFERS HAVING A TRANSPARENT WINDOW FOR END-POINT DETERMINATION AND METHOD OF MAKING 失效
    用于具有用于端点测定的透明窗口的半导体波导的化学/机械平面化的抛光垫及其制造方法

    公开(公告)号:US20050191945A1

    公开(公告)日:2005-09-01

    申请号:US11091965

    申请日:2005-03-28

    CPC classification number: B24B37/205 B24B37/24 B24B37/26 B24D3/32

    Abstract: A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.

    Abstract translation: 用于半导体晶片的化学/机械平面化的多孔抛光垫具有通过将聚合物材料直接注入到垫的修改部分中而形成在多孔抛光垫的一部分中的透明部分。 修改的部分可以是低密度区域,或者可以通过去除衬垫的完整垂直部分来创建。 注入的聚合物通过在垫/窗口界面处流入垫的矩阵而与垫形成整体窗口。 不需要额外的钢筋来固定窗户; 然而,粘合剂和/或另一不透水层可以附着在窗户的后面用于额外的支撑。 在替代实施例中,将单独和不同的窗口插入衬垫的切口部分中,并且通过衬垫的背面非工作表面上的一个或多个粘合膜层粘合到衬垫。

    Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers
    8.
    发明授权
    Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers 失效
    由用于晶片化学/机械平面化的造纸纤维制成的梯度抛光垫

    公开(公告)号:US07025668B2

    公开(公告)日:2006-04-11

    申请号:US10464821

    申请日:2003-06-18

    CPC classification number: B24B37/24 B24B37/22 B24D3/32

    Abstract: A composite polishing pad for use in chemical-mechanical planarization (CMP) processes, which polishing pad of the invention is made of a paper-making-process produced fibrous-matrix of paper-making fibers bound with resin material, and consists of a top section with one or more lower sections, where each layer has unique material properties. Polishing performance can be substantially improved by modifying the individual characteristics of each layer. Typically, the top layer or working surface will be of a higher modulus material than the lower layers. Therefore, the sub-layers may consist of lower density regions or a modified surface structure, such as grooving, to effectively modify the bulk modulus.

    Abstract translation: 一种用于化学机械平面化(CMP)工艺的复合抛光垫,本发明的抛光垫由造纸工艺制成,制成与树脂材料结合的造纸纤维的纤维基质,并由顶部 部分具有一个或多个下部,其中每个层具有独特的材料性质。 通过修改每个层的各个特征,可以显着提高抛光性能。 通常,顶层或工作表面将具有比下层更高的材料模量。 因此,子层可以由较低密度区域或改性表面结构(例如开槽)组成,以有效地改变体积弹性模量。

    Retaining ring with wear pad for use in chemical mechanical planarization

    公开(公告)号:US06899610B2

    公开(公告)日:2005-05-31

    申请号:US10156655

    申请日:2002-05-28

    CPC classification number: B24B37/32

    Abstract: A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes. The flexibility of a manufacturer to use an expanded range of temperature and pressure in CMP processes, combined with a significant reduction in the cost of consumables, provides a significant advantage in the final cost of ownership in the production of multilayer, integrated circuit devices and other products where CMP is utilized in manufacture. Moreover, the retaining with wear pad of the present invention may also retrofitted to previously used and worn retaining rings of the prior-art design, thus salvaging the major structural component of the CMP processing apparatus, thereby reducing costs. It is also an integral part of this invention to make the consumable component of the new design replaceable, so as to make replacement of this part less costly when such replacement finally does become necessary.

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