Abstract:
A micromechanical pumping system is formed on a substrate surface. The pumping system uses a pumping element which pumps a fluid through valves which move in a plane substantially parallel to the substrate surface. An electromagnetic actuating mechanism may also be fabricated on the surface of the substrate. Magnetic flux produced by a coil around a permeable core may be coupled to a permeable member affixed to a pumping element. The permeable member and pumping element may be configured to move in a plane parallel to the substrate. The electromagnetic actuating mechanism gives the pumping system a large throw and substantial force, such that the fluid pumped by the pumping system may be pumped through a transdermal cannula to deliver a therapeutic substance to the tissue underlying the skin of a patient.
Abstract:
A MEMS hysteretic thermal actuator may have a plurality of beams disposed over a heating element formed on the surface of the substrate. The plurality of beams may be coupled to a passive beam which is not disposed over the heating element. One of the plurality of beams may be formed in a first plane parallel to the substrate, whereas another of the plurality of beams may be formed in a second plane closer to the surface of the substrate. When the heating element is activated, it heats the plurality of beams such that they move the passive beam in a trajectory that is neither parallel to nor perpendicular to the surface of the substrate. When the beams are cooled, they may move in a different trajectory, approaching the substrate before moving laterally across it to their initial positions. By providing one electrical contact on the distal end of the passive beam and another stationary electrical contact on the substrate surface, the MEMS hysteretic actuator may form a reliable electrical switch that is relatively simple to manufacture and operate.
Abstract:
An improved MEMS thermal actuator has a cantilevered beam and a conductive circuit having two driving arms, an inner arm adjacent to the cantilevered beam, and an outer arm adjacent to the inner arm. Current flows through the inner and outer arms to heat the conductive circuit, causing it to expand relative to the cantilevered beam. A tether ties the conductive circuit to the cantilevered beam, so that upon expansion, the conductive circuit causes the cantilevered beam to deflect about its anchor point. However, only the inner arm of the driving beam is coupled to the cantilevered beam. Since the outer arm of the conductive circuit is not coupled to the cantilevered beam, the overall stiffness of the actuator may be decreased. In addition, serpentines may be placed in the outer arm of the conductive circuit, in order to further decrease the stiffness of this beam. The actuator may therefore be made more efficient, in that the deflection of the cantilevered beam may be increased for a given input current.
Abstract:
A MEMS hysteretic thermal device may have two passive beam segments driven by a current-carrying loop coupled to the surface of a substrate. The first beam segment is configured to move in a direction having a component perpendicular to the substrate surface, whereas the second beam segment is configured to move in a direction having a component parallel to the substrate surface. By providing this two-dimensional motion, a single MEMS hysteretic thermal device may by used to close a switch having at least one stationary contact affixed to the substrate surface.
Abstract:
A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.
Abstract:
An improved MEMS thermal actuator has a cantilevered beam and a conductive circuit having two driving arms, an inner arm adjacent to the cantilevered beam, and an outer arm adjacent to the inner arm. Current flows through the inner and outer arms to heat the conductive circuit, causing it to expand relative to the cantilevered beam. A tether ties the conductive circuit to the cantilevered beam, so that upon expansion, the conductive circuit causes the cantilevered beam to deflect about its anchor point. However, only the inner arm of the driving beam is coupled to the cantilevered beam. Since the outer arm of the conductive circuit is not coupled to the cantilevered beam, the overall stiffness of the actuator may be decreased. In addition, serpentines may be placed in the outer arm of the conductive circuit, in order to further decrease the stiffness of this beam. The actuator may therefore be made more efficient, in that the deflection of the cantilevered beam may be increased for a given input current.
Abstract:
Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. A hermetic seal may be made around the device with a larger, secondary enclosure. Electrical access to the deformable plate may be accomplished by an electrical path which is independent of the seal. The electrical path may include a via through the first substrate or the second substrate, or a flash deposited on an external region of the switch.
Abstract:
A device and a method are described which hermetically seals at least one microstructure within a cavity. Electrical access to the at least one microstructure is provided by through wafer vias formed through a via substrate which supports the at least one microstructure on its front side. The via substrate and a lid wafer may form a hermetic cavity which encloses the at least one microstructure. The through wafer vias are connected to bond pads located outside the cavity by an interconnect structure formed on the back side of the via substrate. Because they are outside the cavity, the bond pads may be placed inside the perimeter of the bond line forming the cavity, thereby greatly reducing the area occupied by the device. The through wafer vias also shorten the circuit length between the microstructure and the interconnect, thus improving heat transfer and signal loss in the device.
Abstract:
A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.
Abstract:
A MEMS hysteretic thermal device may have a cantilevered beam which bends about one or more points in at least two substantially different directions. In one exemplary embodiment, the MEMS hysteretic thermal device is made from a first segment coupled to an anchor point, and also coupled to a second segment by a joint. Heating two respective drive beams causes the first segment to bend in a direction substantially about the anchor point and the second segment to bend in a direction substantially about the joint. By cooling the first drive beam faster than the second drive beam, the motion of the MEMS thermal device may be hysteretic. The MEMS hysteretic thermal device may be used for example, as an electrical switch or as a valve or piston.