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    Method and apparatus for high temperature operation of electronics
    2.
    发明申请
    Method and apparatus for high temperature operation of electronics 有权
    电子元件高温运行的方法和装置

    公开(公告)号：US20060060964A1

    公开(公告)日：2006-03-23

    申请号：US10946813

    申请日：2004-09-22

    申请人： Christopher Golla ,  Roger Schultz ,  James Masino

    发明人： Christopher Golla ,  Roger Schultz ,  James Masino

    IPC分类号： H01L21/44 ,  H01L23/34

    CPC分类号： H01L25/18 ,  E21B47/011 ,  H01L23/34 ,  H01L23/38 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Embodiments of methods and apparatus for high temperature operation of electronics according to the invention are disclosed. One embodiment of the invention generally includes an integrated circuit package having a substrate. A plurality of integrated circuits are coupled to a surface of the substrate. A lid is positioned above the substrate facing the surface. One or more pieces of compliant and thermally conductive material are compressed between at least one of the integrated circuits and the lid. The lid defines in part an enclosed volume containing the compliant and thermally conductive material.

    摘要翻译： 公开了用于根据本发明的电子设备的高温操作的方法和装置的实施例。 本发明的一个实施例通常包括具有基板的集成电路封装。 多个集成电路耦合到衬底的表面。 盖子位于面向表面的基板上。 一个或多个顺应性和导热材料在至少一个集成电路和盖子之间被压缩。 盖子部分地限定包含顺从性和导热材料的封闭容积。

    Downhole cooling system
    3.
    发明申请
    Downhole cooling system 审中-公开
    井下冷却系统

    公开(公告)号：US20060086506A1

    公开(公告)日：2006-04-27

    申请号：US10973133

    申请日：2004-10-26

    申请人： Christopher Golla ,  James Masino ,  Roger Schultz

    发明人： Christopher Golla ,  James Masino ,  Roger Schultz

    IPC分类号： E21B43/24

    CPC分类号： E21B47/011

    摘要： Apparatus and methods for operating an electronics assembly of a downhole tool. A method comprises disposing a temperature-sensitive electronic component within an insulated chamber contained within a downhole tool. The temperature of the temperature-sensitive electronic component is monitored and a temperature control system is selectively activated to regulate the temperature of the temperature-sensitive electronic component. A downhole electronic assembly comprises a temperature-sensitive electronic component and a temperature-tolerant electronic component in electrical communication with the temperature-sensitive electronic component. An insulating chamber provides a thermal barrier between the temperature-sensitive electronic component and the temperature-tolerant electronic component. A temperature control apparatus in thermal communication with the temperature-sensitive component.

    摘要翻译： 用于操作井下工具的电子组件的装置和方法。 一种方法包括将温度敏感的电子部件设置在包含在井下工具内的绝热室内。 监测温度敏感的电子元件的温度，选择性地激活温度控制系统以调节温度敏感的电子部件的温度。 井下电子组件包括温度敏感电子部件和与温度敏感电子部件电连通的耐温电子部件。 绝缘室在温度敏感的电子部件和耐温电子部件之间提供热障碍。 与温度敏感部件热连通的温度控制装置。

    High-temperature circuits
    4.
    发明申请
    High-temperature circuits 有权
    高温电路

    公开(公告)号：US20050098318A1

    公开(公告)日：2005-05-12

    申请号：US10702836

    申请日：2003-11-06

    申请人： Paul Rodney ,  James Masino ,  Roger Schultz

    发明人： Paul Rodney ,  James Masino ,  Roger Schultz

    IPC分类号： E21B36/00 ,  E21B43/24 ,  E21B49/00 ,  H01L23/34 ,  H05K20060101 ,  H05K1/02

    CPC分类号： E21B36/003 ,  E21B47/011 ,  H01L23/34 ,  H01L2924/0002 ,  H05K1/0212 ,  H01L2924/00

    摘要： Methods and systems for operating integrated circuits at temperatures higher than expected ambient temperatures. The heating may be of entire circuit boards, portions of the circuit boards (such as the components within a multiple-chip module) and/or single devices. Methods and related systems may be used in any high temperature environment such as downhole logging tools, and the devices so heated are preferably of silicon on insulator semiconductor technology.

    摘要翻译： 在高于预期环境温度的温度下运行集成电路的方法和系统。 加热可以是整个电路板，电路板的部分（例如多芯片模块内的组件）和/或单个设备。 方法和相关系统可以在诸如井下测井工具的任何高温环境中使用，并且如此加热的装置优选地是绝缘体上硅半导体技术。

    Synchronous multi-phase AC-TO-DC converter
    6.
    发明申请
    Synchronous multi-phase AC-TO-DC converter 有权
    同步多相交流 - 直流转换器

    公开(公告)号：US20060077602A1

    公开(公告)日：2006-04-13

    申请号：US10962849

    申请日：2004-10-12

    申请人： James Masino ,  Roger Schultz

    发明人： James Masino ,  Roger Schultz

    IPC分类号： H02H3/42

    CPC分类号： H02J1/10

    摘要： Disclosed herein are various embodiments of power conversion systems and methods employing synchronous multi-phase AC-to-DC conversion. In one embodiment, a power converter comprises a transistor bridge and a switching controller that operates the transistor bridge in response to AC voltage threshold crossings. The switching controller may include a period counter to measure times between threshold crossings, and a delay counter to trigger a delayed state transition for the transistor bridge. One disclosed method embodiment comprises: receiving multiple phased alternating voltages; comparing each phased alternating voltage to a threshold; determining a period associated with voltage threshold crossings; triggering state transitions at some fraction of the period after each threshold crossing; and placing a transistor bridge into a configuration associated with a current state. For each state, the transistor bridge configuration is designed to couple phased alternating voltages to two output terminals in a sequence that produces a non-alternating voltage difference.

    摘要翻译： 这里公开了使用同步多相AC-DC转换的功率转换系统和方法的各种实施例。 在一个实施例中，功率转换器包括晶体管桥接器和开关控制器，其响应于AC电压阈值交叉而操作晶体管桥接器。 切换控制器可以包括用于测量阈值交叉之间的时间的周期计数器和用于触发晶体管桥的延迟状态转换的延迟计数器。 一种公开的方法实施例包括：接收多个相控交流电压; 将每个相控交流电压与阈值进行比较; 确定与电压阈值交叉相关联的周期; 在每个阈值交叉后的一段时间内触发状态转换; 并将晶体管桥放置在与当前状态相关联的配置中。 对于每个状态，晶体管桥结构被设计成以产生非交流电压差的顺序将相控交流电耦合到两个输出端。

    Temperature compensation apparatus, systems, and methods
    7.
    发明申请
    Temperature compensation apparatus, systems, and methods 有权
    温度补偿装置，系统和方法

    公开(公告)号：US20060227024A1

    公开(公告)日：2006-10-12

    申请号：US11102119

    申请日：2005-04-08

    申请人： James Masino ,  Roger Schultz

    发明人： James Masino ,  Roger Schultz

    IPC分类号： H03M1/00

    CPC分类号： H03M1/089 ,  H03M1/12

    摘要： In some embodiments, apparatus and systems, as well as methods, may include providing an analog temperature output responsive to a combination signal comprising a combination of an analog compensation output and a reference signal, and converting the analog temperature output to a digital temperature output responsive to an analog reference signal output, perhaps according to a polynomial function. Providing a digital compensation output corresponding to the digital temperature output, and converting the digital compensation output to the analog compensation output responsive to the analog reference signal output may also be included.

    摘要翻译： 在一些实施例中，装置和系统以及方法可以包括响应于包括模拟补偿输出和参考信号的组合的组合信号提供模拟温度输出，并且将模拟温度输出转换为响应于数字温度输出 到模拟参考信号输出，可能根据多项式函数。 提供对应于数字温度输出的数字补偿输出，以及响应于模拟参考信号输出将数字补偿输出转换为模拟补偿输出。

    Wireless telemetry systems and methods for real time transmission of electromagnetic signals through a lossy environment
    8.
    发明申请
    Wireless telemetry systems and methods for real time transmission of electromagnetic signals through a lossy environment 审中-公开
    无线遥测系统和方法，用于通过有损环境实时传输电磁信号

    公开(公告)号：US20050107079A1

    公开(公告)日：2005-05-19

    申请号：US10714332

    申请日：2003-11-14

    申请人： Roger Schultz ,  Craig Zitterich ,  James Masino

    发明人： Roger Schultz ,  Craig Zitterich ,  James Masino

    IPC分类号： E21B47/12 ,  H04Q7/20

    CPC分类号： E21B47/122

    摘要： The current invention relates to novel systems and methods for communicating with equipment and sensors located within a lossy environment. In particular, the current invention provides a wireless telemetry system suitable for use in a lossy environment. The wireless telemetry system provides essentially “real-time” communication between subsurface devices and the surface. Additionally, the current invention provides a method for positioning wireless transceivers used in the telemetry systems of the current invention.

    摘要翻译： 本发明涉及用于与位于有损环境内的设备和传感器进行通信的新型系统和方法。 特别地，本发明提供了适用于有损环境的无线遥测系统。 无线遥测系统在地下设备和地面之间提供基本的“实时”通信。 此外，本发明提供了一种用于定位在本发明的遥测系统中使用的无线收发器的方法。

    High temperature memory device
    9.
    发明申请
    High temperature memory device 审中-公开
    高温记忆装置

    公开(公告)号：US20050104104A1

    公开(公告)日：2005-05-19

    申请号：US10992144

    申请日：2004-11-18

    申请人： Roger Schultz ,  James Freeman

    发明人： Roger Schultz ,  James Freeman

    IPC分类号： G11C11/22 ,  H01L20060101 ,  H01L27/10 ,  H01L27/22

    CPC分类号： H01L27/101 ,  H01L21/8213 ,  H01L21/8252 ,  H01L21/84 ,  H01L21/86 ,  H01L27/11502 ,  H01L27/12 ,  H01L27/228 ,  H01L2224/16 ,  H01L2924/13091 ,  H01L2924/16152 ,  H01L2924/00

    摘要： Disclosed herein are various nonvolatile integrated device embodiments suitable for use at high temperatures. In some embodiments, a high temperature nonvolatile integrated device comprises a sapphire or spinel substrate having multiple ferroelectric memory cells disposed upon it. In other embodiments, a high temperature nonvolatile integrated device comprises a silicon on insulator substrate or a large bandgap semiconductor substrate having multiple ferroelectric or magnetic memory cells disposed on it. In yet other embodiments, a high temperature nonvolatile integrated device comprises a sapphire, silicon on insulator, or a large bandgap substrate having programmable read only memory (PROM) cells or electrically erasable PROM (EEPROM) cells disposed on it.

    摘要翻译： 本文公开了适用于在高温下使用的各种非易失性集成器件实施例。 在一些实施例中，高温非易失性集成器件包括具有设置在其上的多个铁电存储器单元的蓝宝石或尖晶石衬底。 在其他实施例中，高温非易失性集成器件包括绝缘体上硅衬底或具有设置在其上的多个铁电或磁存储单元的大带隙半导体衬底。 在其他实施例中，高温非易失性集成器件包括蓝宝石，绝缘体上硅或具有可编程只读存储器（PROM）单元或设置在其上的电可擦除PROM（EEPROM）单元）的大带隙衬底。