公开(公告)号：US20140015116A1

公开(公告)日：2014-01-16

申请号：US14008457

申请日：2011-12-16

Applicant: Peng Fu ,  Shan Luo ,  Zhong Lu ,  Kaiyou Qian ,  Chin Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Ye Bai

Inventor： Peng Fu ,  Shan Luo ,  Zhong Lu ,  Kaiyou Qian ,  Chin Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Ye Bai

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L2223/5442 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device.

Abstract translation: 公开了一种包括屏蔽电磁辐射和/或耗散热的金属层的存储器件，以及制造存储器件的方法。 金属层形成在金属层转移组件上。 将金属层转移组件和未封装的存储器件放置在模具中并封装。 在模塑料的包封和固化期间，金属层从屏蔽转移到封装的存储器件。

公开(公告)号：US20120193802A1

公开(公告)日：2012-08-02

申请号：US13019126

申请日：2011-02-01

Applicant: Chin-Tien Chiu ,  Chih-Chin Liao ,  Peng Fu

Inventor： Chin-Tien Chiu ,  Chih-Chin Liao ,  Peng Fu

IPC: H01L23/48

CPC classification number: H01L23/24 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A semiconductor package is disclosed including a substrate, a solder mask layer, one or more semiconductor die mounted to the solder mask layer and electrically coupled to the substrate, and a glob top cover over the semiconductor die. The solder mask further includes a dam protruding above surrounding areas of the solder mask layer and a cavity recessed into the solder mask layer for limiting flow of the glob top cover when the glob top material is applied.

Abstract translation: 公开了一种半导体封装，其包括衬底，焊接掩模层，安装到焊料掩模层并电耦合到衬底的一个或多个半导体管芯以及半导体管芯上的球顶盖。 焊料掩模还包括突出在焊料掩模层的周围区域上方的坝体和凹入焊料掩模层中的空腔，用于限制球形顶盖材料施加时球体顶盖的流动。

公开(公告)号：US09337153B2

公开(公告)日：2016-05-10

申请号：US14008457

申请日：2011-12-16

Applicant: Peng Fu ,  Shan Luo ,  Zhong Lu ,  Kaiyou Qian ,  Chin Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Ye Bai

Inventor： Peng Fu ,  Shan Luo ,  Zhong Lu ,  Kaiyou Qian ,  Chin Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Ye Bai

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/433 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L2223/5442 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device.

Abstract translation: 公开了一种包括屏蔽电磁辐射和/或耗散热的金属层的存储器件，以及制造存储器件的方法。 金属层形成在金属层转移组件上。 将金属层转移组件和未封装的存储器件放置在模具中并封装。 在模塑料的包封和固化期间，金属层从屏蔽转移到封装的存储器件。

公开(公告)号：US20120146247A1

公开(公告)日：2012-06-14

申请号：US13265666

申请日：2011-06-08

Applicant: Itzhak Pomerantz ,  Shiv Kumar ,  Robert Miller ,  Chin-Tien Chiu ,  Peng Fu ,  Cheeman Yu ,  Hem Takiar ,  Chih Chiang Tung ,  Kaiyou Qian ,  Rahav Yairi

Inventor： Itzhak Pomerantz ,  Shiv Kumar ,  Robert Miller ,  Chin-Tien Chiu ,  Peng Fu ,  Cheeman Yu ,  Hem Takiar ,  Chih Chiang Tung ,  Kaiyou Qian ,  Rahav Yairi

IPC: H01L23/28

CPC classification number: G06K19/07732 ,  H01L2924/0002 ,  H05K5/0278 ,  H01L2924/00

Abstract: A memory device is disclosed including at least one surface pre-treated to roughen the surface for better adhesion of a curable fluid such as glue or ink on the surface. The surface of the memory device may be pre-treated by scoring lines in the surface with a laser or by forming discrete deformations with a particle blaster. The surface may also be roughened by providing a roughened pattern on a mold plate during an encapsulation process. In further examples, the surface may be chemically pre-treated to roughen the surface and/or increase the adhesion energy of the surface.

Abstract translation: 公开了一种记录装置，其包括至少一个经过预处理的表面以粗糙化表面，以便在表面上更好地粘附可固化流体例如胶水或油墨。 存储器件的表面可以通过用激光在表面上刻划线或者通过用粒子喷射器形成离散的变形来预处理。 在封装过程中，通过在模板上提供粗糙图案也可以使表面粗糙化。 在另外的实施例中，表面可以被化学预处理以使表面粗糙化和/或增加表面的粘附能。

公开(公告)号：US20070196589A1

公开(公告)日：2007-08-23

申请号：US10598943

申请日：2005-06-01

Applicant: Peng Fu ,  Lingjie Guo ,  Xing Cheng

Inventor： Peng Fu ,  Lingjie Guo ,  Xing Cheng

IPC: C08G59/68

CPC classification number: G03F7/0382 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/038 ,  G03F7/0755 ,  Y10T428/31612

Abstract: A material composition, which is used as a liquid resist, includes a first component comprising a monomer portion and at least one cationically polymerizable functional group, and a crosslinker reactive with the first component and comprising at least three cationically polymerizable functional groups. The material composition also includes a cationic photoinitiator. Upon exposure to UV light, the material composition crosslinks via cure to form a cured resist film that is the reaction product of the first component, the crosslinker, and the cationic photoinitiator. An article includes a substrate layer and a resist layer formed on the substrate layer from the material composition.

Abstract translation: 用作液体抗蚀剂的材料组合物包括包含单体部分和至少一种阳离子可聚合官能团的第一组分和与第一组分反应并包含至少三个可阳离子聚合的官能团的交联剂。 该材料组合物还包括阳离子光引发剂。 在暴露于UV光下时，材料组合物通过固化交联以形成固化的抗蚀剂膜，其是第一组分，交联剂和阳离子光引发剂的反应产物。 一种制品包括从该材料组合物形成在基底层上的基底层和抗蚀剂层。

公开(公告)号：US20070122749A1

公开(公告)日：2007-05-31

申请号：US11290866

申请日：2005-11-30

Applicant: Peng Fu ,  Lingjie Guo

Inventor： Peng Fu ,  Lingjie Guo

IPC: G03C5/00

CPC classification number: G03F7/0757 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: A method of nanopatterning includes the steps of providing a resist film (12) and forming a pattern in the resist film (12). The resist film (12) includes a copolymer consisting of an organosilicone component and an organic component. An article (10) includes a substrate (14) and the resist film (12) disposed on the substrate (14). The copolymer of the organosilicone component and the organic component is sufficiently elastic, due to the presence of the organosilicone component, to be capable of resisting fracture and delamination during mold release. Furthermore, during pattern formation, the copolymer develops relatively low surface energy at an interface with the surface of a mold, as compared to conventional polymeric materials, and preferentially adheres to the substrate (14) rather than the mold, which provides for relatively easy mold release. The presence of the organosilicone component in the copolymer also allows the resist film (12) to exhibit excellent resistance to oxygen plasma etching.

Abstract translation: 纳米图案的方法包括提供抗蚀剂膜（12）并在抗蚀剂膜（12）中形成图案的步骤。 抗蚀膜（12）包括由有机硅组分和有机组分组成的共聚物。 制品（10）包括基板（14）和设置在基板（14）上的抗蚀膜（12）。 由于有机硅组分的存在，有机硅组分和有机组分的共聚物具有足够的弹性，能够抵抗脱模过程中的断裂和分层。 此外，在图案形成期间，与常规聚合物材料相比，共聚物在与模具表面的界面处产生相对低的表面能，并优先粘附到基材（14）而不是模具，其提供相对容易的模具 发布。 共聚物中有机硅组分的存在也允许抗蚀剂膜（12）表现出优异的耐氧等离子体蚀刻性。

公开(公告)号：US20060250351A1

公开(公告)日：2006-11-09

申请号：US10947621

申请日：2004-09-21

Applicant: Peng Fu

Inventor： Peng Fu

IPC: G09G5/00

CPC classification number: A63F13/22 ,  A63F13/06 ,  A63F13/235 ,  A63F13/24 ,  A63F13/28 ,  A63F13/42 ,  A63F2300/1018 ,  A63F2300/1037 ,  A63F2300/1043 ,  G06F3/038 ,  G06F3/04847

Abstract: Embodiments of the inventions include a gamepad that supports an internal mapping system. A user may remap functions associated with any input mechanism of the gamepad to any other input mechanism. The gamepad may include extra, non-standard, input mechanisms. Mapping may be stored internal to the gamepad.

Abstract translation: 本发明的实施例包括支持内部映射系统的游戏手柄。 用户可以将与游戏手柄的任何输入机构相关联的功能重新映射到任何其它输入机构。 游戏手柄可能包括额外的非标准输入机制。 映射可以存储在游戏手柄的内部。

公开(公告)号：US20120081860A1

公开(公告)日：2012-04-05

申请号：US13129510

申请日：2010-10-04

Applicant: Itzhak Pomerantz ,  Shiv Kumar ,  Robert Miller ,  Chin-Tien Chiu ,  Peng Fu ,  Cheeman Yu ,  Hem Takiar ,  Chih Chiang Tung ,  Kaiyou Qian

Inventor： Itzhak Pomerantz ,  Shiv Kumar ,  Robert Miller ,  Chin-Tien Chiu ,  Peng Fu ,  Cheeman Yu ,  Hem Takiar ,  Chih Chiang Tung ,  Kaiyou Qian

IPC: H05K1/14 ,  B32B3/10 ,  B32B3/02 ,  H05K7/00 ,  B32B3/30

CPC classification number: H05K5/0252 ,  G06K19/07 ,  Y10T428/239 ,  Y10T428/24479 ,  Y10T428/2457 ,  Y10T428/24802

Abstract: A memory device is disclosed including at least one surface pre-treated to roughen the surface for better adhesion of ink on the surface. The surface of the memory device may be pre-treated by scoring lines in the surface with a laser or by forming discrete deformations with a particle blaster. The surface may also be roughened by providing a roughened pattern on a mold plate during an encapsulation process. In further examples, the surface may be chemically pre-treated to roughen the surface and/or increase the adhesion energy of the surface.

Abstract translation: 公开了一种记录装置，其包括至少一个预处理表面的表面，以便更好地粘附在表面上的墨。 存储器件的表面可以通过用激光在表面上刻划线或者通过用粒子喷射器形成离散的变形来预处理。 在封装过程中，通过在模板上提供粗糙图案也可以使表面粗糙化。 在另外的实施例中，表面可以被化学预处理以使表面粗糙化和/或增加表面的粘附能。