公开(公告)号：US20070133183A1

公开(公告)日：2007-06-14

申请号：US10577965

申请日：2004-10-29

申请人： Peter Urbach ,  Wolfgang Feiler ,  Thomas Raica ,  Stefan Hornung

发明人： Peter Urbach ,  Wolfgang Feiler ,  Thomas Raica ,  Stefan Hornung

IPC分类号： H05K7/00

CPC分类号： H01L25/072 ,  H01L23/49861 ,  H01L25/071 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： Electric motor (10), in particular for adjusting moving parts in a motor vehicle, comprising an electronic unit (70) with a sandwich construction, which contains a first electrically conductive substrate (71) and a second electric conductive substrate (72), between which power components are located and electrically connected to both substrates (71, 72), and a side (84) of the second substrate (72) facing away from the first substrate (71) is equipped with additional electronic components (56), wherein the first substrate (71) is embodied as a punched grid (44), which together with the second substrate (72) is extrusion coated with a plastic body (95) in such a way that the extensions (97) of the punched grid (44) protrude from the plastic body (95), forming an electrical and/or mechanical interface (98) for connecting additional motor components (99, 38, 40, 104, 102, 80).

摘要翻译： 电动机（10），特别是用于调节机动车辆中的运动部件，包括具有夹层结构的电子单元（70），其包含第一导电基板（71）和第二导电基板（72） 哪个功率部件被定位并电连接到两个基板（71,72），并且第二基板（72）的背离第一基板（71）的侧面（84）配备有附加的电子部件（56），其中 第一基板（71）被实施为冲压格栅（44），其与第二基板（72）一起被挤塑地涂覆有塑料体（95），使得冲孔网格的延伸部（97） 44）从所述塑料体（95）突出，形成用于连接附加的电动机部件（99,38,40,104,102,80）的电气和/或机械接口（98）。

公开(公告)号：US07687947B2

公开(公告)日：2010-03-30

申请号：US10577965

申请日：2004-10-29

申请人： Peter Urbach ,  Wolfgang Feiler ,  Thomas Raica ,  Stefan Hornung

发明人： Peter Urbach ,  Wolfgang Feiler ,  Thomas Raica ,  Stefan Hornung

IPC分类号： H02K11/00

CPC分类号： H01L25/072 ,  H01L23/49861 ,  H01L25/071 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： Electric motor (10), in particular for adjusting moving parts in a motor vehicle, comprising an electronic unit (70) with a sandwich construction, which contains a first electrically conductive substrate (71) and a second electric conductive substrate (72), between which power components are located and electrically connected to both substrates (71, 72), and a side (84) of the second substrate (72) facing away from the first substrate (71) is equipped with additional electronic components (56), wherein the first substrate (71) is embodied as a punched grid (44), which together with the second substrate (72) is extrusion coated with a plastic body (95) in such a way that the extensions (97) of the punched grid (44) protrude from the plastic body (95), forming an electrical and/or mechanical interface (98) for connecting additional motor components (99, 38, 40, 104, 102, 80).

摘要翻译： 电动机（10），特别是用于调节机动车辆中的运动部件，包括具有夹层结构的电子单元（70），其包含第一导电基板（71）和第二导电基板（72） 哪个功率部件被定位并电连接到两个基板（71,72），并且第二基板（72）的背离第一基板（71）的侧面（84）配备有附加的电子部件（56），其中 第一基板（71）被实施为冲压格栅（44），其与第二基板（72）一起被挤塑地涂覆有塑料体（95），使得冲孔网格的延伸部（97） 44）从所述塑料体（95）突出，形成用于连接附加的电动机部件（99,38,40,104,102,80）的电气和/或机械接口（98）。

公开(公告)号：US08072043B2

公开(公告)日：2011-12-06

申请号：US11664857

申请日：2005-09-12

申请人： Peter Flohrs ,  Alfred Goerlach ,  Peter Urbach ,  Wolfgang Feiler ,  Ning Qu ,  Klaus Heyers

发明人： Peter Flohrs ,  Alfred Goerlach ,  Peter Urbach ,  Wolfgang Feiler ,  Ning Qu ,  Klaus Heyers

IPC分类号： H01L29/00

CPC分类号： H01L28/20 ,  G01K7/22 ,  H01L27/0802 ,  H01L29/8605 ,  H01L29/8611

摘要： A semiconductor component and a method for manufacturing such a semiconductor component which has a resistance behavior which depends heavily on the temperature. This resistance behavior is obtained by a special multi-layer structure of the semiconductor component, one layer being designed in such a way that, for example, multiple p-doped regions are present in an n-doped region, said regions being short-circuited on one side via a metal-plated layer. For example, the semiconductor component may be used for reducing current peaks, by being integrated into a conductor. In the cold state, the semiconductor component has a high resistance which becomes significantly lower when the semiconductor component is heated as a result of the flowing current.

摘要翻译： 一种半导体元件及其制造方法，该半导体元件具有很大程度上取决于温度的电阻特性。 该电阻特性通过半导体元件的特殊的多层结构获得，一层被设计成例如在n掺杂区域中存在多个p掺杂区域，所述区域被短路 在一侧通过金属镀层。 例如，半导体组件可以用于通过集成到导体中来减小电流峰值。 在冷态中，当由于流动电流而加热半导体元件时，半导体元件具有高电阻，其变得明显较低。

公开(公告)号：US20090206438A1

公开(公告)日：2009-08-20

申请号：US11664857

申请日：2005-09-12

申请人： Peter Flohrs ,  Alfred Goerlach ,  Peter Urbach ,  Wolfgang Feiler ,  Ning Qu ,  Klaus Heyers

发明人： Peter Flohrs ,  Alfred Goerlach ,  Peter Urbach ,  Wolfgang Feiler ,  Ning Qu ,  Klaus Heyers

IPC分类号： H01L29/66 ,  H01L21/24 ,  H01L21/50

CPC分类号： H01L28/20 ,  G01K7/22 ,  H01L27/0802 ,  H01L29/8605 ,  H01L29/8611

摘要： A semiconductor component and a method for manufacturing such a semiconductor component which has a resistance behavior which depends heavily on the temperature. This resistance behavior is obtained by a special multi-layer structure of the semiconductor component, one layer being designed in such a way that, for example, multiple p-doped regions are present in an n-doped region, said regions being short-circuited on one side via a metal-plated layer. For example, the semiconductor component may be used for reducing current peaks, by being integrated into a conductor. In the cold state, the semiconductor component has a high resistance which becomes significantly lower when the semiconductor component is heated as a result of the flowing current.

摘要翻译： 一种半导体元件及其制造方法，该半导体元件具有很大程度上取决于温度的电阻特性。 该电阻特性通过半导体元件的特殊的多层结构获得，一层被设计成例如在n掺杂区域中存在多个p掺杂区域，所述区域被短路 在一侧通过金属镀层。 例如，半导体组件可以用于通过集成到导体中来减小电流峰值。 在冷态中，当由于流动电流而加热半导体元件时，半导体元件具有高电阻，其变得明显较低。

公开(公告)号：US20060124957A1

公开(公告)日：2006-06-15

申请号：US10538269

申请日：2003-06-12

申请人： Stefan Hornung ,  Peter Urbach ,  Barbara Will

发明人： Stefan Hornung ,  Peter Urbach ,  Barbara Will

IPC分类号： H01L29/74

CPC分类号： H01L25/074 ,  H01L23/49562 ,  H01L2924/0002 ,  H01L2924/00

摘要： A converter module is described having a positive terminal (2), a negative terminal (4), and a phase terminal (3), as well as a first semiconductor chip (9) and a second semiconductor chip (9), the terminals (2-4) and the semiconductor chips (9) being situated on top of one another in a stack. A particularly simple and cost-effective converter module may produced in that the positive terminal (2), the negative terminal (4), or the phase terminal (3) are made up of a contact plate (5), including a bar-shaped terminal lug (6) which is positioned asymmetrically on the contact plate (5), and an auxiliary element (7) is provided at its end which prevents the terminal (2-4) from tilting.

摘要翻译： A转换器模块被描述为具有正端子（2），负端子（4）和相位端子（3），以及第一半导体芯片（9）和第二半导体芯片（9），端子 2 - 4），并且半导体芯片（9）在堆叠中彼此位于顶部。 可以产生一种特别简单且具有成本效益的转换器模块，其中正极端子（2），负极端子（4）或相位端子（3）由接触板（5）构成，该接触板包括棒状 在所述接触板（5）上不对称地定位的端子凸耳（6），并且在其端部设置辅助元件（7），以防止所述端子（2 - 4）倾斜。

公开(公告)号：US06953145B2

公开(公告)日：2005-10-11

申请号：US10344015

申请日：2001-07-20

申请人： Kuno Wolf ,  Alexander Wallrauch ,  Horst Meinders ,  Barbara Will ,  Peter Urbach

发明人： Kuno Wolf ,  Alexander Wallrauch ,  Horst Meinders ,  Barbara Will ,  Peter Urbach

IPC分类号： B23K3/00 ,  B23K1/20 ,  H01L21/52 ,  H01L21/60 ,  H01R43/02 ,  H05K3/34 ,  B23K31/00 ,  B23K31/02

CPC分类号： H05K3/341 ,  B23K1/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32057 ,  H01L2224/83101 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01R43/0235 ,  H05K2201/0373 ,  H05K2201/10924 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K2203/0405 ,  Y02P70/613 ,  H01L2924/00

摘要： A method is proposed for fastening at least one electrical component to a substrate using solder, in which elevations are produced in the solder substrate, the elevations being at least as high as the thickness of a solder layer to be produced. In another step, the solder is laid upon the elevations, and in a further step, the elevations are pressed down until they have reached approximately the height of the solder, so that a soldering procedure may follow. The method is used for producing exactly specified thicknesses of solder layers having tolerances less than 10 micrometers.

摘要翻译： 提出一种用于使用焊料将至少一个电气部件固定到基板的方法，其中在焊料基板中产生高度，其高度至少等于要生产的焊料层的厚度。 在另一步骤中，将焊料放置在高度上，并且在另一步骤中，将高度压下直到它们已经达到焊料的高度，从而可以遵循焊接过程。 该方法用于产生具有小于10微米的公差的精确规定的焊料层厚度。

公开(公告)号：US20050212125A1

公开(公告)日：2005-09-29

申请号：US10514996

申请日：2003-05-23

申请人： Richard Spitz ,  Peter Urbach ,  Karin Hamsen

发明人： Richard Spitz ,  Peter Urbach ,  Karin Hamsen

IPC分类号： H01L23/24 ,  H01L23/62 ,  H01L23/34

CPC分类号： H01L24/01 ,  H01L23/24 ,  H01L23/62 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/00

摘要： An electrical component, e.g., a press-in diode, is provided, which is suited for high currents and which ensures reverse-polarity protection. The electrical component includes at least one chip which is connected via soldering layers to a lead wire and a base. In the event of a rising temperature caused by polarity reversal, the clamp-type connection between the individual parts of the electrical component, e.g., the lead wire and the base, is released since the connecting plastic sheath softens, resulting in the release of the clamp-type connection, thereby interrupting the electrical connection and thus a current flow. At normal operating temperature, the clamp-type connection between the individual parts of the diode is ensured via a plastic sheath and a plastic sleeve, with bulges of the lead wire and the base protruding into the plastic sheath, thereby making the connection particularly stable.

摘要翻译： 提供了诸如压入二极管的电气部件，其适用于高电流并且确保反向极性保护。 电气部件包括至少一个通过焊接层连接到引线和基座的芯片。 在由极性反转引起的温度上升的情况下，电气部件的各个部件（例如引线和基座）之间的夹紧型连接被释放，因为连接塑料护套软化，导致释放 夹紧型连接，从而中断电连接，从而中断电流。 在正常工作温度下，通过塑料护套和塑料套筒确保二极管各部件之间的夹紧型连接，导线和底座的凸起突出到塑料护套中，从而使连接特别稳定。

公开(公告)号：US06812604B2

公开(公告)日：2004-11-02

申请号：US10250744

申请日：2003-10-27

申请人： Horst Braun ,  Holger Scholzen ,  Peter Urbach ,  Holger Haussmann ,  Dana Keppeler ,  Thomas Bilsing

发明人： Horst Braun ,  Holger Scholzen ,  Peter Urbach ,  Holger Haussmann ,  Dana Keppeler ,  Thomas Bilsing

IPC分类号： H02K1100

CPC分类号： H02K9/06 ,  H02K11/046

摘要： The invention relates to an electrical machine, preferably an alternator (10) for motor vehicles, comprising a rectifier assembly (11a) that is fixed to an end shield (23) of the machine. Said rectifier assembly is cooled by a fan (27) that operates in the end shield (23), the diodes being positioned on a negative connecting plate (15) and a positive connecting plate (17) of the rectifier assembly (11). The aim of the invention is to evacuate the dissipated heat from the rectifier assembly (11a) in an advantageous manner. To achieve this, the rectifier assembly is located in an opening in the front face (32) of the end shield (23) and is connected in an electrically and thermally conductive manner by one of its two connecting plates (15 and 17) to a cooling body (33), which is connected to the exterior of the end shield (23) and covers the opening (32). The cooling air that is thus taken in by the fan (27) first flows from the exterior across the cooling body (33) in a radial manner towards the interior, entering the machine in the vicinity of the shaft through orifices (30) in the end shield (23) and from here, having reached the fan (27), subsequently flows past the other connecting plate (15 and 17) in a radial manner towards the exterior.

摘要翻译： 本发明涉及一种电机，优选用于机动车辆的交流发电机（10），其包括固定到机器的端部屏蔽（23）上的整流器组件（11a）。 所述整流器组件由在端盖（23）中操作的风扇（27）冷却，二极管位于整流器组件（11）的负连接板（15）和正连接板（17）上。 本发明的目的是以有利的方式从整流器组件（11a）排出散热。 为了实现这一点，整流器组件位于端部屏蔽件（23）的前表面（32）中的开口中，并且通过其两个连接板（15和17）之一以电和导热方式连接到 冷却体（33），其连接到端部屏蔽件（23）的外部并覆盖开口（32）。 风扇（27）所吸入的冷却空气首先从外部横向冷却主体（33）以径向方式流向内部，通过孔中的孔（30）进入机器附近 端部罩（23），并且从这里到达风扇（27），随后以径向方式朝向外部流过另一个连接板（15和17）。

公开(公告)号：US06774476B2

公开(公告)日：2004-08-10

申请号：US10220085

申请日：2002-12-04

申请人： Richard Spitz ,  Alfred Goerlach ,  Alexander Wallrauch ,  Christoph Ruf ,  Peter Urbach ,  Uwe Knappenberger

发明人： Richard Spitz ,  Alfred Goerlach ,  Alexander Wallrauch ,  Christoph Ruf ,  Peter Urbach ,  Uwe Knappenberger

IPC分类号： H01L2302

CPC分类号： H01L25/071 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power converter having at least two semiconductor substrates is provided. Each of the substrates has at least two contact surfaces, and the converter also has two thermally conductive mounting plates carrying the semiconductor substrates, which each have an electrical terminal, an attachment arrangement implemented on one of the mounting plates, and having at least one third electrical terminal, which is distinguished in that the mounting plates and the semiconductor substrates form stacks, the mounting plates receiving the semiconductor substrates between themselves, and an electrically and thermally conductive insert, which has at least the third terminal, is arranged between the semiconductor substrates.

摘要翻译： 提供具有至少两个半导体衬底的功率转换器。 每个基板具有至少两个接触表面，并且转换器还具有承载半导体基板的两个导热安装板，每个具有电端子，在其中一个安装板上实现的附接布置，并且具有至少一个第三 电端子的特征在于安装板和半导体基板形成堆叠，在它们之间接收半导体衬底的安装板和至少具有第三端子的导电和导热插入件布置在半导体衬底之间 。

公开(公告)号：US07675156B2

公开(公告)日：2010-03-09

申请号：US10514996

申请日：2003-05-23

申请人： Richard Spitz ,  Peter Urbach ,  Karin Hamsen

发明人： Richard Spitz ,  Peter Urbach ,  Karin Hamsen

IPC分类号： H01L23/31

CPC分类号： H01L24/01 ,  H01L23/24 ,  H01L23/62 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/00

摘要： An electrical component, e.g., a press-in diode, is provided, which is suited for high currents and which ensures reverse-polarity protection. The electrical component includes at least one chip which is connected via soldering layers to a lead wire and a base. In the event of a rising temperature caused by polarity reversal, the clamp-type connection between the individual parts of the electrical component, e.g., the lead wire and the base, is released since the connecting plastic sheath softens, resulting in the release of the clamp-type connection, thereby interrupting the electrical connection and thus a current flow. At normal operating temperature, the clamp-type connection between the individual parts of the diode is ensured via a plastic sheath and a plastic sleeve, with bulges of the lead wire and the base protruding into the plastic sheath, thereby making the connection particularly stable.

摘要翻译： 提供了诸如压入二极管的电气部件，其适用于高电流并且确保反向极性保护。 电气部件包括至少一个通过焊接层连接到引线和基座的芯片。 在由极性反转引起的温度升高的情况下，电气部件的各个部件（例如引线和基座）之间的夹紧型连接被释放，因为连接塑料护套软化，导致释放 夹紧型连接，从而中断电连接，从而中断电流。 在正常工作温度下，通过塑料护套和塑料套筒确保二极管各部件之间的夹紧型连接，导线和底座的凸起突出到塑料护套中，从而使连接特别稳定。