摘要:
A flash memory having over-erased cells eliminated and comprising adjustable erase and program conditions. The maximum and minimum threshold voltages of the cells are measured during the whole erase and program operations. The over-erased cells are shut down by applying a word line voltage lower than the minimum threshold voltage measured previously. Pre-program and repair operations for the over-erased cell are eliminated. Low read voltage is achieved. The erase and program conditions for the gate, source, drain voltage, width of a pulse, and number of pulses are adjustable in accordance with the threshold voltage to optimize the performance. A lookup table stores the relevant gate, source, drain voltage, width of a pulse, and number of pulses with respect to the threshold voltage for the adjustable conditions. The benefits achieved by the operation of the flash memory include high efficiency, long endurance, narrow threshold voltage distribution, low power consumption, and low process-sensitivity.
摘要:
An apparatus and method for operating an array of NOR connected flash nonvolatile memory cells erases the array in increments of a page, block, sector, or the entire array while minimizing sub-threshold leakage current through unselected nonvolatile memory cells. The apparatus has a row decoder circuit and a source decoder circuit for selecting the nonvolatile memory cells for providing biasing conditions for reading, programming, verifying, and erasing the selected nonvolatile memory cells while minimizing sub-threshold leakage current through unselected nonvolatile memory cells.
摘要:
A NOR flash nonvolatile memory device provides the memory cell size and a low current program process of a NAND flash nonvolatile memory device and the fast, asynchronous random access of a NOR flash nonvolatile memory device. The NOR flash nonvolatile memory device has an array of NOR flash nonvolatile memory circuits that includes charge retaining transistors serially connected in a NAND string such that at least one of the charge retaining transistors functions as a select gate transistor to prevent leakage current through the charge retaining transistors when the charge retaining transistors is not selected for reading. The topmost charge retaining transistor's drain is connected to a bit line parallel to the charge retaining transistors and the bottommost charge retaining transistor's source is connected to a source line and is parallel to the bit line. The charge retaining transistors are programmed and erased with a Fowler-Nordheim tunneling process.
摘要:
An apparatus and method for operating an array of NOR connected flash nonvolatile memory cells erases the array in increments of a page, block, sector, or the entire array while minimizing sub-threshold leakage current through unselected nonvolatile memory cells. The apparatus has a row decoder circuit and a source decoder circuit for selecting the nonvolatile memory cells for providing biasing conditions for reading, programming, verifying, and erasing the selected nonvolatile memory cells while minimizing sub-threshold leakage current through unselected nonvolatile memory cells.
摘要:
In this invention a reverse split gate device is described for creating a flash memory that avoids both programming and erase disturb conditions. The cell is designed so that the stacked gate is associated with the source and the enhancement gate is associated with the drain. This is the reverse of a conventional spit gate design and allows the drain to buffer the stacked gate from bit lines of a flash memory array. The source line now key to both program and erase operations is laid out in rows where two adjacent rows of cells share the same source line. The source line can be segmented to prevent the entire length of the pair of rows from being erased. The cell is programmed by flowing current backwards in the channel and injecting electrons in to the floating gate from an impact ionization that occurs near the source. Erasure is accomplished by Fowler-Nordheim tunneling from the floating gate to the source caused by a potential between the source and the enhancement gate.
摘要:
Flash memory circuits provide sector protection or file protection with protection attribute status bits held in a flash memory array. The sector protection protects memory data based on the physical location of the data. The flash memory array is divided into a number of memory sectors. Each memory sector can be protected independently. The size of the memory sector is flexible and may be as large as the whole memory array or as small as a single bit group. Each memory sector has protection bits stored in a protection bit array for indicating the protection state of the sector. A parallel protection structure providing both sector protection and block protection is also included. The parallel protection allows small size data protection as well as large size block protection. File protection protects memory data on a file basis regardless of the physical location of the data. Each file has protection bits stored in an attribute memory for indicating the protection state of the file. The attribute memory is made from part of the flash memory which simplifies the process of manufacturing the memory. It also reduces the area size of the attribute memory and the complexity of the control circuits.
摘要:
Methods of increasing the speed of random read and write operations of a memory device are provided for improving the performance of volatile and non-volatile memory devices. In contrast to the conventional approach that latches the current memory address right before the currently accessed memory data are outputted, the methods latch the next memory address before the currently accessed memory data are read out. The flow, timing waveforms and control sequences of applying the methods to parallel NOR flash, parallel pSRAM, serial SQI NOR flash and NAND flash are described in detail. The NOR flash device designed with the method can be integrated with a NAND flash device on a same die in a combo flash device packaged in either an ONFI compatible NAND flash package or other standard NAND flash package.
摘要:
A NOR flash nonvolatile memory or reconfigurable logic device has an array of NOR flash nonvolatile memory circuits that includes charge retaining transistors serially connected in a NAND string such that at least one of the charge retaining transistors functions as a select gate transistor to prevent leakage current through the charge retaining transistors when the charge retaining transistors is not selected for reading. The topmost charge retaining transistor's drain is connected to a bit line parallel to the charge retaining transistors and the bottommost charge retaining transistor's source is connected to a source line and is parallel to the bit line. The charge retaining transistors are programmed and erased with a Fowler-Nordheim tunneling process.
摘要:
A nonvolatile memory device includes an array of EEPROM configured nonvolatile memory cells each having a floating gate memory transistor for storing a digital datum and a floating gate select transistor for activating the floating gate memory transistor for reading, programming, and erasing. The nonvolatile memory device has a row decoder to transfer the operational biasing voltage levels to word lines connected to the floating gate memory transistors for reading, programming, verifying, and erasing the selected nonvolatile memory cells. The nonvolatile memory device has a select gate decoder circuit transfers select gate control biasing voltages to the select gate control lines connected to the control gate of the floating gate select transistor for reading, programming, verifying, and erasing the floating gate memory transistor of the selected nonvolatile memory cells. The operational biasing voltage levels are generated to minimize operational disturbances and preventing drain to source breakdown in peripheral devices.
摘要:
New bias conditions for flash memory cells and X-decoder circuits for providing the bias conditions. In an erasing operation, a positive high voltage is provided to the bulk and a negative high voltage is provided to the control gate for establishing a sufficient electric field to induce electron tunneling effect. In an operation for repairing a cell's threshold voltage, the biased voltages are reversed. A first X-decoder circuit structure is presented for supplying positive and negative high voltages to the memory cells for block erasing or repairing. The first X-decoder circuit structure has a plurality of X-decoder blocks each being constructed in a separated X-decoder well, and the memory cells are fabricated in a separate common array well. A second X-decoder circuit structure is presented to provide an appropriate bias condition for erasing or repairing a small sector of word lines. For the second X-decoder circuit structure, each memory block is fabricated in a separated array well. Separated X-decoder wells are constructed to provide voltages to the word lines of memory blocks. Every word line in a memory block has an X-decoder driver so that the word line can be erased or repaired individually. A new layout is also presented for the construction of the X-decoder circuits.