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公开(公告)号：US06948860B1
公开(公告)日：2005-09-27
申请号：US10784050
申请日：2004-02-20
CPC分类号： G02B6/4219 , G02B6/422
摘要： An optoelectronic subassembly for optoelectronic modules includes a supporting substrate with an optoelectronic device mounted on a mounting surface. A supporting structure includes a trench for mounting the subassembly and a lens assembly. Four offset arms are provided each including a substrate-mounting portion, a supporting-structure-mounting portion, and a linking portion. The substrate-mounting portion and the supporting-structure-mounting portion have parallel surfaces with the linking portion extending at an angle therebetween. The arms include deformable material for allowing small changes in the angle. One of the parallel surfaces of each of the offset arms is mounted on either the mounting surface or an opposed surface of the supporting substrate and the other of the parallel surfaces is mounted on the support structure with the substrate suspended in the trench. The linking portion of the arms is then deformed to align the optoelectronic device with the lens assembly.
摘要翻译： 用于光电子模块的光电子组件包括具有安装在安装表面上的光电子器件的支撑衬底。 支撑结构包括用于安装子组件的沟槽和透镜组件。 设置有四个偏移臂，每个偏移臂包括基板安装部分，支撑结构安装部分和连接部分。 基板安装部分和支撑结构安装部分具有平行的表面，其中连接部分以其间的角度延伸。 臂包括用于允许角度的小变化的可变形材料。 每个偏移臂的平行表面中的一个安装在支撑基板的安装表面或相对表面上，并且另一个平行表面安装在支撑结构上，其中基板悬挂在沟槽中。 然后将臂的连接部分变形以将光电子器件与透镜组件对准。
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公开(公告)号：US5937114A
公开(公告)日：1999-08-10
申请号：US897801
申请日：1997-07-21
IPC分类号： G02B6/32 , G02B6/42 , H01L31/0232 , H01S5/00 , G02B6/12
CPC分类号： G02B6/4277 , G02B6/4246
摘要： A micro-photonics device is described that includes a substrate and a plurality of optical and electrical components mounted on the substrate. The optical and electrical components form a transmitter and a receiver. A wall is mounted on the substrate to physically separate some of the components from other components to prevent electrical and optical interference between the transmitter and receiver. The wall mounted on the substrate may also be mounted with electrical and optical components of the micro-photonics device. In this case, the wall physically separates the components mounted on the substrate from the components mounted on the wall to prevent electrical and optical interference. Moreover, the wall with the mounted components may simply be attached to a side surface of the substrate.
摘要翻译： 描述了包括基板和安装在基板上的多个光学和电气部件的微光学器件。 光学和电气部件形成发射器和接收器。 墙壁安装在基板上以将部件与其他部件物理分离，以防止发射机和接收机之间的电和光干扰。 安装在基板上的壁也可以安装有微光子器件的电和光学部件。 在这种情况下，壁将安装在基板上的部件与安装在墙壁上的部件物理分离，以防止电气和光学干扰。 此外，具有安装部件的壁可以简单地附接到基板的侧表面。
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公开(公告)号：US06803520B1
公开(公告)日：2004-10-12
申请号：US10423182
申请日：2003-04-25
申请人： Robert William Musk
发明人： Robert William Musk
IPC分类号： H01L2302
CPC分类号： H01L23/055 , H01L2924/0002 , H01L2924/01079 , H01S5/02212 , H01S5/02296 , H01S5/0683 , H01L2924/00
摘要： An optoelectronic package includes a supporting structure with a surface, an opposed surface, and at least one side, at least one conductive interconnect extending through the supporting structure from the surface to the opposed surface of the supporting structure, wherein the at least one conductive interconnect is substantially flush with the opposed surface of the supporting structure.
摘要翻译： 光电子封装包括具有表面，相对表面和至少一个侧面的支撑结构，至少一个导电互连件，其从支撑结构的表面延伸穿过支撑结构到相对表面，其中至少一个导电互连 与支撑结构的相对表面基本齐平。
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公开(公告)号：US06999644B1
公开(公告)日：2006-02-14
申请号：US10367173
申请日：2003-02-14
IPC分类号： G02B6/12
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4204 , G02B6/4245 , G02B6/4255 , G02B6/4256 , G02B6/4277
摘要： An electro-optic package comprising an optoelectric module with a receptacle assembly, an optoelectric assembly fixedly attached to the receptacle assembly, the optoelectric assembly being in communication with the optoelectric module, wherein the optoelectric assembly includes optoelectronic circuitry and the optoelectronic circuitry includes at least one electrical connection for communication with external electronic circuitry, and wherein the electro-optic package forms a discrete package.
摘要翻译： 一种电光学封装，包括具有插座组件的光电模块，固定地连接到插座组件的光电组件，光电组件与光电模块连通，其中光电组件包括光电子电路，并且光电子电路包括至少一个 用于与外部电子电路通信的电连接，并且其中所述电光封装形成分立封装。
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公开(公告)号：US06304352B1
公开(公告)日：2001-10-16
申请号：US09076644
申请日：1998-05-12
IPC分类号： H04B1000
CPC分类号： H04B10/2581
摘要： A method and apparatus is provided for connecting an optical source to a multimode optical fibre in a multimode optical fibre communications system. A single mode fibre length is provided such that optical radiation admitted from an optical source at one end of the single mode fibre length is provided to a multimode optical fibre at the other end of the single mode fibre length. This method and apparatus is used in a duplex patchcord for connecting an optical transceiver to a pair of installed multimode fibres. The second fibre in the patchcord is a multimode fibre for passing optical signals to the optical receiver of the transceiver.
摘要翻译： 提供了一种用于在多模光纤通信系统中将光源连接到多模光纤的方法和装置。 提供单模光纤长度，使得在单模光纤长度的一端从光源允许的光辐射被提供给单模光纤长度另一端的多模光纤。 该方法和装置用于将光收发器连接到一对安装的多模光纤的双工跳线。 跳线中的第二个光纤是用于将光信号传送到收发器的光接收器的多模光纤。
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公开(公告)号：US09064861B2
公开(公告)日：2015-06-23
申请号：US14385861
申请日：2013-03-18
申请人： Robert William Musk
发明人： Robert William Musk
IPC分类号： H01L23/48 , H01L23/498 , H01L23/00 , H01L23/31 , G02B6/12
CPC分类号： H01L23/4985 , G02B6/12 , H01L23/3142 , H01L24/14 , H01L2224/13144 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01029 , H01L2924/01322 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An assembly (60) includes a substrate (1) that is provided with at least one electrical contact (3a), a flexible printed circuit membrane (51) including an electrically insulating film (6) and an electrically conducting layer (7) that is at least partially covering the insulating film (6). The conducting layer (7) is at least locally accessible from outside of the membrane (51). A connection element (10) is provided for electrically connecting the at least one electrical contact (3a) and the conducting layer (7) at a position where the conducting layer (7) is accessible, to form an electrical connection between the substrate (1) and the membrane (51). A chip package (70) includes a housing (15) having at least one electrically conducting terminal, and an assembly (60) as mentioned. The flexible printed circuit membrane (51) is arranged for electrically connecting the substrate and the at least one terminal of the housing (15).
摘要翻译： 组件（60）包括设置有至少一个电触头（3a）的基板（1），包括电绝缘膜（6）和导电层（7）的柔性印刷电路膜（51） 至少部分地覆盖绝缘膜（6）。 导电层（7）至少可以从膜（51）的外部进入。 提供连接元件（10），用于在导电层（7）可接近的位置处电连接至少一个电触点（3a）和导电层（7），以形成基板（1） ）和膜（51）。 芯片封装（70）包括具有至少一个导电端子的壳体（15）和如上所述的组件（60）。 柔性印刷电路膜（51）布置成用于电连接基板和壳体（15）的至少一个端子。
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公开(公告)号：US20150076661A1
公开(公告)日：2015-03-19
申请号：US14385861
申请日：2013-03-18
申请人： Robert William Musk
发明人： Robert William Musk
IPC分类号： H01L23/498 , H01L23/31 , G02B6/12 , H01L23/00
CPC分类号： H01L23/4985 , G02B6/12 , H01L23/3142 , H01L24/14 , H01L2224/13144 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01029 , H01L2924/01322 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An assembly (60) includes a substrate (1) that is provided with at least one electrical contact (3a), a flexible printed circuit membrane (51) including an electrically insulating film (6) and an electrically conducting layer (7) that is at least partially covering the insulating film (6). The conducting layer (7) is at least locally accessible from outside of the membrane (51). A connection element (10) is provided for electrically connecting the at least one electrical contact (3a) and the conducting layer (7) at a position where the conducting layer (7) is accessible, to form an electrical connection between the substrate (1) and the membrane (51). A chip package (70) includes a housing (15) having at least one electrically conducting terminal, and an assembly (60) as mentioned. The flexible printed circuit membrane (51) is arranged for electrically connecting the substrate and the at least one terminal of the housing (15).
摘要翻译： 组件（60）包括设置有至少一个电触头（3a）的基板（1），包括电绝缘膜（6）和导电层（7）的柔性印刷电路膜（51） 至少部分地覆盖绝缘膜（6）。 导电层（7）至少可以从膜（51）的外部进入。 提供连接元件（10），用于在导电层（7）可接近的位置处电连接至少一个电触点（3a）和导电层（7），以形成基板（1） ）和膜（51）。 芯片封装（70）包括具有至少一个导电端子的壳体（15）和如上所述的组件（60）。 柔性印刷电路膜（51）布置成用于电连接基板和壳体（15）的至少一个端子。
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公开(公告)号：US06894314B2
公开(公告)日：2005-05-17
申请号：US10775910
申请日：2004-02-10
申请人： Robert William Musk
发明人： Robert William Musk
IPC分类号： H01L27/10 , H01L27/15 , H01L31/12 , H01L33/00 , H01S20060101 , H01S5/022 , H01S5/024 , H01S5/0683
CPC分类号： H01S5/0683 , H01S5/0071 , H01S5/02228 , H01S5/02248
摘要： A power monitoring arrangement for semiconductor light emitting devices used in optoelectronic packages includes a mounting structure, a light emitting device, and a monitor photodetector. The mounting structure has a mounting surface with the light emitting device and the monitor photodetector positioned thereon. The light emitting device provides emitted light at a monitoring output and an active output. The monitor photodetector has a light sensitive region and is positioned on the mounting surface of the mounting structure proximate the monitoring output of the light emitting device. A hemisphere of material is formed to include at least the light sensitive region of the monitor photodetector and the monitoring output of the light emitting device. An outer surface of the hemisphere operates as a reflecting surface to reflect light from the monitoring output of the light emitting device to the light sensitive region of the monitor photodetector.
摘要翻译： 用于光电封装的半导体发光器件的功率监控装置包括安装结构，发光器件和监视器光电检测器。 安装结构具有安装表面，发光装置和监视器光电检测器定位在其上。 发光器件在监视输出和有源输出端提供发光。 监视器光电检测器具有光敏区域，并且位于靠近发光器件的监视输出端的安装结构的安装表面上。 材料的半球形成为至少包括监视光电检测器的光敏区域和发光器件的监视输出。 半球的外表面用作反射表面，以将来自发光器件的监视输出的光反射到监视器光检测器的光敏区域。
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公开(公告)号：US06609834B2
公开(公告)日：2003-08-26
申请号：US09932911
申请日：2001-08-20
IPC分类号： G02B638
CPC分类号： H04B10/2581
摘要： A method and apparatus is provided for connecting an optical source to a multimode optical fibre in a multimode optical fibre communications system. A single mode fibre length is provided such that optical radiation admitted from an optical source at one end of the single mode fibre length is provided to a multimode optical fibre at the other end of the single mode fibre length. This method and apparatus is used in a duplex patchcord for connecting an optical transceiver to a pair of installed multimode fibres. The second fibre in the patchcord is a multimode fibre for passing optical signals to the optical receiver of the transceiver.
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公开(公告)号：US5745621A
公开(公告)日：1998-04-28
申请号：US724983
申请日：1996-10-03
申请人： Robert William Musk
发明人： Robert William Musk
CPC分类号： G02B6/327 , G02B6/4207 , G02B6/4292 , G02B6/3822
摘要： An optical connector is provided for connecting an optical fiber to, for example, a laser. The optical connector comprises a housing defining a passage therethrough and a stop for abutment against a face of a ferrule containing an optical fiber. The stop is positioned and shaped so that in use the area of contact between the stop and the ferrule end face is less than 10% of the total area of the end face of the ferrule, and the area of contact between the stop and the ferrule end face is close to a central axis of the ferrule. Many different designs of angled ferrule are available for reducing the level of optical reflections within optical systems. The present optical connector allows these many different designs of angled ferrules to be accurately aligned to an optical device.
摘要翻译： 提供光连接器用于将光纤连接到例如激光器。 光学连接器包括限定穿过其中的通道的壳体和用于邻接包含光纤的套圈的表面的止动件。 止动件的定位和成形使得在使用中，止动件和套圈端面之间的接触面积小于套圈端面的总面积的10％，并且止动件和套圈之间的接触面积 端面靠近套圈的中心轴线。 角度套圈的许多不同设计可用于降低光学系统内的光学反射水平。 本光学连接器允许这些许多不同的倾斜套圈的设计能够精确地对准光学装置。
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