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    Method for Forming a Graded Matching Layer Structure
    1.
    发明申请
    Method for Forming a Graded Matching Layer Structure 审中-公开
    形成渐变匹配层结构的方法

    公开(公告)号：US20130195333A1

    公开(公告)日：2013-08-01

    申请号：US13362096

    申请日：2012-01-31

    申请人： Prabhjot Singh ,  Lowell Scott Smith

    发明人： Prabhjot Singh ,  Lowell Scott Smith

    IPC分类号： G06K9/00 ,  G10K11/00 ,  B05D5/12 ,  H01L41/04

    CPC分类号： G03F7/0035 ,  B06B1/0629 ,  H01L41/183

    摘要： A method for forming a graded matching layer structure is presented. The method includes (a) depositing a first material slurry on at least a portion of a substrate, (b) spreading the first material slurry to a form a first material layer having a first determined thickness, (c) exposing the first material layer using light processed through a determined light pattern mask to form a first matching layer, and (d) repeating steps (a)-(c) with different material slurries to form the graded matching layer structure.

    摘要翻译： 提出了一种形成渐变匹配层结构的方法。 该方法包括（a）在基底的至少一部分上沉积第一材料浆料，（b）将第一材料浆料铺展成具有第一确定厚度的第一材料层，（c）使用 通过确定的光图案掩模处理光以形成第一匹配层，以及（d）用不同的材料浆料重复步骤（a） - （c）以形成渐变匹配层结构。

    Tileable sensor array
    2.
    发明授权
    Tileable sensor array 有权
    可分层传感器阵列

    公开(公告)号：US08659148B2

    公开(公告)日：2014-02-25

    申请号：US12956194

    申请日：2010-11-30

    申请人： John Eric Tkaczyk ,  Lowell Scott Smith ,  Charles Edward Baumgartner ,  Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Robert Stephen Lewandowski

    发明人： John Eric Tkaczyk ,  Lowell Scott Smith ,  Charles Edward Baumgartner ,  Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Robert Stephen Lewandowski

    IPC分类号： H01L23/34

    CPC分类号： H01L27/20 ,  A61B8/4483 ,  H01L27/14634 ,  H01L27/14658 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2924/00

    摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.

    摘要翻译： 提出了一种形成可瓦片检测器阵列的方法。 该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫， 传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路 其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是 与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉 传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块 在第二基板上形成可瓦片检测器阵列。

    Method of manufacturing two-dimensional array ultrasonic transducers
    4.
    发明授权
    Method of manufacturing two-dimensional array ultrasonic transducers 失效
    制造二维阵列超声换能器的方法

    公开(公告)号：US5655276A

    公开(公告)日：1997-08-12

    申请号：US386718

    申请日：1995-02-06

    申请人： Deva Narayan Pattanayak ,  Lowell Scott Smith

    发明人： Deva Narayan Pattanayak ,  Lowell Scott Smith

    IPC分类号： B06B1/06 ,  H01L41/22

    CPC分类号： B06B1/0629 ,  Y10T29/42

    摘要： In fabricating a two-dimensional array transducer wherein individual preformed piezoelectric elements are manufactured separately in a high temperature ceramic firing process, a ceramic substrate is provided, having a surface with a plurality of electrodes thereon. A layer of dielectric material is formed on the substrate surface. Holes are formed in the dielectric material layer over the electrodes, defining cavities with metal pads at the bottoms. The individual preformed piezoelectric elements are then inserted into the holes; with one end of each element in contact with a corresponding one of the substrate electrodes. The holes are sized such that the piezoelectric elements are isolated from the dielectric layer. A ground plane conductor is then formed over the dielectric material layer and over the ends of the piezoelectric elements opposite the ends in contact with the piezoelectric elements, and is photolithographically patterned and may be etched to provide a "mesh" structure. The layer of dielectric material may then be removed to provide better isolation between the piezoelectric elements.

    摘要翻译： 在制造二维阵列换能器中，其中单独的预成型压电元件在高温陶瓷烧制工艺中单独制造，提供了具有其上具有多个电极的表面的陶瓷基片。 在基板表面上形成介电材料层。 在电极上的电介质材料层中形成孔，在底部形成具有金属垫的空腔。 然后将各个预制的压电元件插入孔中; 每个元件的一端与相应的一个衬底电极接触。 孔的尺寸使得压电元件与电介质层隔离。 接地平面导体然后形成在电介质材料层之上并且在与压电元件接触的端部相对的压电元件的端部之上，并且被光刻图案化并且可被蚀刻以提供“网格”结构。 然后可以去除电介质材料层，以在压电元件之间提供更好的隔离。

    Methods of making and using integrated and testable sensor array
    5.
    发明授权
    Methods of making and using integrated and testable sensor array 有权
    制作和使用集成和可测量传感器阵列的方法

    公开(公告)号：US07781238B2

    公开(公告)日：2010-08-24

    申请号：US11951360

    申请日：2007-12-06

    申请人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    发明人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    IPC分类号： H01L21/66

    CPC分类号： H01L22/20 ,  H01L22/14

    摘要： A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.

    摘要翻译： 提供了制造可测试的传感器组件的方法。 该方法包括在具有第一侧和第二侧的第一衬底上形成第一传感器阵列，其中第一传感器阵列形成在第一衬底的第一侧上，将具有第一侧和第二侧的第一半导体晶片 到第一传感器阵列，其中第一半导体晶片的第一侧耦合到第一传感器阵列，使第一衬底的第二侧或第一半导体晶片的第二面之一变薄，并将第一传感器阵列测试为 在将传感器组件与接口电子器件集成之前，确定可测试传感器组件中的操作和非操作单元。

    METHODS OF MAKING AND USING INTEGRATED AND TESTABLE SENSOR ARRAY
    6.
    发明申请
    METHODS OF MAKING AND USING INTEGRATED AND TESTABLE SENSOR ARRAY 有权
    制造和使用集成和可测传感器阵列的方法

    公开(公告)号：US20090148967A1

    公开(公告)日：2009-06-11

    申请号：US11951360

    申请日：2007-12-06

    申请人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    发明人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    IPC分类号： H01L21/66

    CPC分类号： H01L22/20 ,  H01L22/14

    摘要： A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.

    摘要翻译： 提供了制造可测试的传感器组件的方法。 该方法包括在具有第一侧和第二侧的第一衬底上形成第一传感器阵列，其中第一传感器阵列形成在第一衬底的第一侧上，将具有第一侧和第二侧的第一半导体晶片 到第一传感器阵列，其中第一半导体晶片的第一侧耦合到第一传感器阵列，使第一衬底的第二侧或第一半导体晶片的第二面之一变薄，并将第一传感器阵列测试为 在将传感器组件与接口电子器件集成之前，确定可测试传感器组件中的操作和非操作单元。

    Matching layer having gradient in impedance for ultrasound transducers
    9.
    发明授权
    Matching layer having gradient in impedance for ultrasound transducers 失效
    匹配层具有超声换能器的阻抗梯度

    公开(公告)号：US06936009B2

    公开(公告)日：2005-08-30

    申请号：US09681220

    申请日：2001-02-27

    申请人： Venkat Subramaniam Venkataramani ,  Lionel Monty Levinson ,  Lowell Scott Smith

    发明人： Venkat Subramaniam Venkataramani ,  Lionel Monty Levinson ,  Lowell Scott Smith

    IPC分类号： G10K11/02 ,  A61B8/0029

    CPC分类号： G10K11/02 ,  Y10T29/42

    摘要： A matching layer for ultrasound transducers has a gradient in impedance value from one surface to the other surface of the matching layer. The matching layer is composed of a plurality of sublayers made of composite materials and securely attached together and is disposed on the surface of the transducer element. The first sublayer adjacent to the transducer element has an impedance value less than or equal to that of the transducer element. The last sublayer adjacent to the target has an impedance value greater than or equal to that of the target. The impedance values of the sublayers decrease monotonically from the first to the last sublayer.

    摘要翻译： 用于超声换能器的匹配层具有从匹配层的一个表面到另一个表面的阻抗值的梯度。 匹配层由复合材料制成的多个子层组成，并且牢固地附着在一起并设置在换能器元件的表面上。 与换能器元件相邻的第一子层具有小于或等于换能器元件的阻抗值的阻抗值。 与目标相邻的最后一个子层具有大于或等于目标的阻抗值。 子层的阻抗值从第一个子层到最后一个子层单调减小。