公开(公告)号：US10431511B2

公开(公告)日：2019-10-01

申请号：US15584000

申请日：2017-05-01

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel Kim ,  Shu Zhang ,  Bonhoon Koo ,  Manuel Aldrete ,  Jie Fu ,  Chin-Kwan Kim ,  Babak Nejati ,  Husnu Ahmet Masaracioglu

IPC: H01L23/12 ,  H01L23/66 ,  H01L23/498 ,  H01L23/552

Abstract: In exemplary aspects of the disclosure, magnetic coupling problems in a power amplifier/antenna circuit may be address by using a self-shielded RF inductor mounted over the PA output match inductor embedded in the substrate to offer full RF isolation of both PA output match inductors (self-shielded and embedded) or using a self-shielded RF inductor mounted over the PA output match inductor embedded in the substrate along with a component level conformal shield around the self-shielded inductor on the assembly structure.

公开(公告)号：US10262786B2

公开(公告)日：2019-04-16

申请号：US15288967

申请日：2016-10-07

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel Kim ,  Babak Nejati ,  Husnu Ahmet Masaracioglu

IPC: H03H7/01 ,  H03H7/46 ,  H01F17/00 ,  H01F27/28 ,  H01F41/04 ,  H01L49/02 ,  H01L23/498 ,  H01L23/538 ,  H01L23/522 ,  H03H1/00

Abstract: A stepped-width, co-spiral inductor structure includes a first exterior layer having a first exterior width. The stepped-width, co-spiral inductor structure also includes a first interior layer coupled to the first exterior layer. The first interior layer includes a first interior width that is wider than the first exterior width of the first exterior layer. The stepped-width, co-spiral inductor structure further includes a second exterior layer coupled to the first interior layer. The second exterior layer includes a second exterior width that is narrower than the first interior width of the first interior layer.

公开(公告)号：US10312193B2

公开(公告)日：2019-06-04

申请号：US15235790

申请日：2016-08-12

Applicant: QUALCOMM Incorporated

Inventor： Shiqun Gu ,  Chengjie Zuo ,  Steve Fanelli ,  Husnu Ahmet Masaracioglu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/538 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/66 ,  H01L25/07 ,  H01L25/00 ,  H03H1/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

Abstract: A package includes a redistribution portion, a first portion, and a second portion. The first portion is coupled to the redistribution portion. The first portion includes a first switch comprising a plurality of switch interconnects, and a first encapsulation layer that at least partially encapsulates the first switch. The second portion is coupled to the first portion. The second portion includes a first plurality of filters. Each filter includes a plurality of filter interconnects. The second portion also includes a second encapsulation layer that at least partially encapsulates the first plurality of filters. The first portion includes a second switch positioned next to the first switch, where the first encapsulation layer at least partially encapsulates the second switch. The second portion includes a second plurality of filters positioned next to the first plurality of filters, where the secod encapsulation layer at least partially encapsulates the second plurality of filters.

公开(公告)号：US10978240B2

公开(公告)日：2021-04-13

申请号：US15857478

申请日：2017-12-28

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel Kim ,  Babak Nejati ,  Husnu Ahmet Masaracioglu

IPC: H01F27/29 ,  H01F27/28 ,  H01F41/04 ,  H05K1/02 ,  H01F17/00 ,  H05K1/16 ,  H01F5/00 ,  H04B1/00 ,  H04B1/40 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

Abstract: A laminate substrate inductor reduces insertion loss and improves isolation while reducing the area for integrating the laminate substrate inductor. The laminate substrate includes a spiral trace. The laminate substrate also includes a first capture pad at a first end of the spiral trace. The first end is located at a corner of the spiral trace. The first capture pad is substantially within a bounding box of the spiral trace. At least a portion of the first capture pad and an outer edge of the spiral trace have a same distance from a ground.

公开(公告)号：US20180047673A1

公开(公告)日：2018-02-15

申请号：US15235790

申请日：2016-08-12

Applicant: QUALCOMM Incorporated

Inventor： Shiqun Gu ,  Chengjie Zuo ,  Steve Fanelli ,  Husnu Ahmet Masaracioglu

IPC: H01L23/538 ,  H01L23/31 ,  H01L25/07 ,  H01L25/00 ,  H01L23/48 ,  H01L21/768 ,  H01L21/56 ,  H03H1/00 ,  H01L23/66

CPC classification number: H01L23/5386 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/568 ,  H01L21/768 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/24 ,  H01L24/97 ,  H01L25/072 ,  H01L25/50 ,  H01L2223/6661 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/24147 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/19101 ,  H01L2924/30111 ,  H03H1/0007 ,  H03H2001/0021 ,  H01L2224/83005

Abstract: A package includes a redistribution portion, a first portion, and a second portion. The first portion is coupled to the redistribution portion. The first portion includes a first switch comprising a plurality of switch interconnects, and a first encapsulation layer that at least partially encapsulates the first switch. The second portion is coupled to the first portion. The second portion includes a first plurality of filters. Each filter includes a plurality of filter interconnects. The second portion also includes a second encapsulation layer that at least partially encapsulates the first plurality of filters. The first portion includes a second switch positioned next to the first switch, where the first encapsulation layer at least partially encapsulates the second switch. The second portion includes a second plurality of filters positioned next to the first plurality of filters, where the second encapsulation layer at least partially encapsulates the second plurality of filters.