公开(公告)号：US20240355781A1

公开(公告)日：2024-10-24

申请号：US18628469

申请日：2024-04-05

Applicant: QUALCOMM Incorporated

Inventor： Yangyang SUN ,  Xuefeng ZHANG ,  Jun CHEN ,  Lily ZHAO

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2225/06513 ,  H01L2225/06562 ,  H01L2924/1306 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/182

Abstract: A device includes an integrated device. The integrated device includes a die that is at least partially encapsulated. The die includes a conductive pad. The device also includes a first passivation layer coupled to a first surface of the die. The device includes an offset interconnect extending along a surface of the first passivation layer and including a portion that extends through an opening in the first passivation layer to contact the conductive pad. The device includes a bump including a portion that extends through an opening in a second passivation layer to contact the offset interconnect. The bump is offset, in a direction along a surface of the second passive layer, from the conductive pad.

公开(公告)号：US20210118834A1

公开(公告)日：2021-04-22

申请号：US17071432

申请日：2020-10-15

Applicant: QUALCOMM Incorporated

Inventor： Yangyang SUN ,  John HOLMES ,  Xuefeng ZHANG ,  Dongming HE

IPC: H01L23/00

Abstract: Disclosed are devices, fabrication methods and design rules for flip-chip devices. Aspects include an apparatus including a flip-chip device. The flip-chip device including a die having a plurality of under bump metallizations (UBMs). A package substrate having a plurality of bond pads is also included. A plurality of solder joints coupling the die to the package substrate. The plurality of solder joints are formed from a plurality of solder bumps plated on the plurality of UBMs, where the plurality of solder bumps are directly connected to the plurality of bond pads.

公开(公告)号：US20240105688A1

公开(公告)日：2024-03-28

申请号：US17952163

申请日：2022-09-23

Applicant: QUALCOMM Incorporated

Inventor： Xia LI ,  Xuefeng ZHANG ,  Aniket PATIL

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L25/105 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5381 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/08 ,  H01L24/16 ,  H01L2224/08145 ,  H01L2224/08235 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/182 ,  H01L2924/37001

Abstract: A package comprising a substrate comprising at least one dielectric layer and a plurality of interconnects, a first chiplet coupled to the substrate, a second chiplet coupled to the first chiplet, an encapsulation layer coupled to the substrate, the first chiplet and the second chiplet, a plurality of encapsulation interconnects located in the encapsulation layer, a metallization portion coupled to the encapsulation layer, the second chiplet and the plurality of encapsulation interconnects and a first integrated device coupled to the metallization portion.

公开(公告)号：US20240429141A1

公开(公告)日：2024-12-26

申请号：US18340556

申请日：2023-06-23

Applicant: QUALCOMM Incorporated

Inventor： Xia LI ,  Xuefeng ZHANG ,  Aniket PATIL

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065

Abstract: A device comprising a package. The package comprises a package substrate; a first integrated device coupled to the package substrate through a first plurality of bump interconnects; an encapsulation layer at least partially encapsulating the first integrated device; a plurality of post interconnects located in the encapsulation layer; a metallization portion coupled to the plurality of post interconnects; a second integrated device coupled to the metallization portion through a second plurality of bump interconnects; and a plurality of side wall interconnects coupled to the encapsulation layer and the metallization portion.