公开(公告)号：US20030054588A1

公开(公告)日：2003-03-20

申请号：US10005308

申请日：2001-12-03

Applicant: REFLECTIVITY, INC., a California corporation

Inventor： Satyadev R. Patel ,  Andrew G. Huibers ,  Steven S. Chiang

IPC: H01L021/44

CPC classification number: B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

公开(公告)号：US20040100677A1

公开(公告)日：2004-05-27

申请号：US10305536

申请日：2002-11-26

Applicant: REFLECTIVITY, INC., a California corporation

Inventor： Andrew G. Huibers ,  Satyadev R. Patel

IPC: G02B026/00

CPC classification number: G02B26/0833 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A projection system, a spatial light modulator, and a method for forming a micromirror array such as for a projection display are disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micro-mirror array. The two substrates can be bonded at the wafer level after depositing a getter material and/or solid or liquid lubricant on one or both of the wafers if desired. In one embodiment of the invention, one of the substrates is a light transmissive substrate and a light absorbing layer is provided on the light transmissive substrate to selectively block light from passing through the substrate. The light absorbing layer can form a pattern, such as a frame around an array of micro-mirrors.

Abstract translation: 公开了投影系统，空间光调制器和用于形成诸如投影显示器的微镜阵列的方法。 空间光调制器可以具有与包括微镜阵列的基板之一粘合在一起的两个基板。 如果需要，在沉积吸气剂材料和/或固体或液体润滑剂在一个或两个晶片上之后，两个基底可以在晶片层上结合。 在本发明的一个实施例中，一个基板是透光基板，并且在透光基板上设置光吸收层，以选择性地阻挡光通过基板。 光吸收层可以形成图案，例如围绕微镜阵列的框架。

公开(公告)号：US20040069747A1

公开(公告)日：2004-04-15

申请号：US10269149

申请日：2002-10-11

Applicant: REFLECTIVITY, INC., a California corporation

Inventor： Satyadev R. Patel ,  Gregory P. Schaadt ,  Douglas B. MacDonald ,  Niles K. MacDonald ,  Hongqin Shi

IPC: G01L021/30 ,  G01R031/00

CPC classification number: H01J37/32963 ,  B81C1/00476 ,  B81C1/00587 ,  B81C99/0065 ,  B81C2201/0132 ,  B81C2201/0138 ,  H01J37/32449 ,  H01J37/32935

Abstract: Processes for the removal of a layer or region from a workpiece material by contact with a process gas in the manufacture of a microstructure are enhanced by the ability to accurately determine the endpoint of the removal step. A vapor phase etchant is used to remove a material that has been deposited on a substrate, with or without other deposited structure thereon. By creating an impedance at the exit of an etching chamber (or downstream thereof), as the vapor phase etchant passes from the etching chamber, a gaseous product of the etching reaction is monitored, and the endpoint of the removal process can be determined. The vapor phase etching process can be flow through, a combination of flow through and pulse, or recirculated back to the etching chamber

Abstract translation: 通过与制造微结构中的工艺气体接触从工件材料去除层或区域的工艺通过精确地确定去除步骤的终点的能力增强。 气相蚀刻剂用于去除已经沉积在基底上的材料，其上具有或不具有其它沉积结构。 通过在蚀刻室（或其下游）的出口处产生阻抗，当气相蚀刻剂从蚀刻室通过时，监测蚀刻反应的气态产物，并且可以确定去除过程的终点。 气相蚀刻工艺可以流过，流过和脉冲的组合，或再循环回蚀刻室

公开(公告)号：US20040233505A1

公开(公告)日：2004-11-25

申请号：US10346506

申请日：2003-01-15

Applicant: REFLECTIVITY, INC., a California corporation

Inventor： Andrew G. Huibers ,  Satyadev R. Patel

IPC: G02B026/00

CPC classification number: G02B26/0841

Abstract: A MEMS device is disclosed comprising: a substrate; a movable micromechanical element movable relative to the substrate; a connector and a hinge for allowing movement of the micromechanical element, wherein the connector is made of a material different than the hinge. In another embodiment of the invention, the connector has a conductivity greater than the hinge. In a further embodiment of the invention, the hinge provides at least 90% of the restoring force to the MEMS device, and the connector provides 10% or less of the restoring force. In a further embodiment of the invention, the connector and the hinge have different spring constants. In a still further embodiment of the invention, the connector experiences a lower strain at maximum deflection of the micromechanical element than the hinge.

Abstract translation: 公开了一种MEMS器件，包括：衬底; 可移动微机械元件，其相对于所述基板移动; 用于允许微机械元件移动的连接器和铰链，其中连接器由不同于铰链的材料制成。 在本发明的另一个实施例中，连接器的导电率大于铰链。 在本发明的另一实施例中，铰链提供至少90％的恢复力到MEMS装置，并且连接器提供10％或更小的恢复力。 在本发明的另一实施例中，连接器和铰链具有不同的弹簧常数。 在本发明的另一个实施例中，连接器在微机械元件的最大偏转处经受比铰链更低的应变。