公开(公告)号：US20130003346A1

公开(公告)日：2013-01-03

申请号：US13536707

申请日：2012-06-28

申请人： RONAN LETOQUIN ,  PETER GUSCHL ,  JAMES IBBETSON ,  ERIC TARSA ,  TAO TONG ,  ZONGJIE YUAN ,  BERND KELLER

发明人： RONAN LETOQUIN ,  PETER GUSCHL ,  JAMES IBBETSON ,  ERIC TARSA ,  TAO TONG ,  ZONGJIE YUAN ,  BERND KELLER

IPC分类号： F21V9/16 ,  F21V29/00 ,  F21V13/02

CPC分类号： H05B33/0803 ,  F21K9/232 ,  F21K9/64 ,  F21S8/033 ,  F21V3/04 ,  F21V23/008 ,  F21V23/023 ,  F21V29/75 ,  F21V29/773 ,  F21V29/89

摘要： Solid state modules and fixtures comprising different combinations and arrangements of a light source, one or more wavelength conversion materials, thermally conductive connection adapters allowing dissipation of heat outside of the module, and a remote power supply unit. This arrangement allows for greater thermal efficiency and reliability while employing solid state lighting and providing emission patterns that are equivalent with ENERGY STAR® standards. Some embodiments additionally place compensation circuits, previously included with power supply units, on the optical element itself, remote from the power supply unit. Various embodiments of the invention may be used to address many of the difficulties associated with utilizing efficient solid state light sources such as LEDs in the fabrication of lamps or bulbs suitable for direct replacement of traditional incandescent bulbs or fixtures using bulbs.

摘要翻译： 固体模块和固定装置包括光源，一个或多个波长转换材料的不同组合和布置，允许在模块外部散热的导热连接适配器以及远程电源单元。 这种布置允许在采用固态照明并提供与ENERGYSTAR®标准相当的发射模式时具有更高的热效率和可靠性。 一些实施例另外将以前包括在电源单元中的补偿电路放置在远离电源单元的光学元件本身上。 可以使用本发明的各种实施例来解决与在制造适合于使用灯泡直接替代传统白炽灯泡或固定装置的灯泡或灯泡中使用有效的固态光源（例如LED）有关的许多困难。

公开(公告)号：US20130049021A1

公开(公告)日：2013-02-28

申请号：US13219486

申请日：2011-08-26

申请人： JAMES IBBETSON ,  Bernd Keller ,  Ronan Letoquin ,  Matthew Donofrio ,  Michael Bergmann

发明人： JAMES IBBETSON ,  Bernd Keller ,  Ronan Letoquin ,  Matthew Donofrio ,  Michael Bergmann

IPC分类号： H01L33/50 ,  H01L21/66

CPC分类号： H01L33/504 ,  H01L33/0095 ,  H01L2933/0041

摘要： Methods for fabricating semiconductor devices such as LED chips with emission wavelength correction and devices fabricated using these methods. Different embodiments include sequential coating methods that provide two or more coatings or layers of conversion material over LEDs, which can be done at the wafer level. The methods are particularly applicable to fabricating LED chips that emit a warm white light, which typically requires covering LEDs with one or more wavelength conversion materials such as phosphors. In one embodiment, a base wavelength conversion material is applied to the semiconductor devices. A portion of the base conversion material is removed. At least two different tuning wavelength conversion materials are also applied to the semiconductor devices, either before or after the application of the base conversion material.

摘要翻译： 用于制造具有发射波长校正的LED芯片的半导体器件的方法以及使用这些方法制造的器件。 不同的实施方案包括在LED上提供两个或更多个转化材料的涂层或多层的顺序涂覆方法，其可以在晶片级完成。 该方法特别适用于制造发出暖白光的LED芯片，其通常需要用一种或多种波长转换材料如磷光体覆盖LED。 在一个实施例中，将基础波长转换材料施加到半导体器件。 一部分碱转换材料被去除。 在应用基底转换材料之前或之后，至少两种不同的调谐波长转换材料也被应用于半导体器件。

公开(公告)号：US20100155746A1

公开(公告)日：2010-06-24

申请号：US12418816

申请日：2009-04-06

申请人： JAMES IBBETSON ,  Sten Heikman

发明人： JAMES IBBETSON ,  Sten Heikman

IPC分类号： H01L33/00 ,  H01L21/30

CPC分类号： H01L27/153 ,  H01L33/0079 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A monolithic LED chip is disclosed comprising a plurality of junctions or sub-LEDs (“sub-LEDs”) mounted on a submount. The sub-LEDs are serially interconnected such that the voltage necessary to drive the sub-LEDs is dependent on the number of serially interconnected sub-LEDs and the junction voltage of the sub-LEDs. Methods for fabricating a monolithic LED chip are also disclosed with one method comprising providing a single junction LED on a submount and separating the single junction LED into a plurality of sub-LEDs. The sub-LEDs are then serially interconnected such that the voltage necessary to drive the sub-LEDs is dependent on the number of the serially interconnected sub-LEDs and the junction voltage of the sub-LEDs.

摘要翻译： 公开了一种单片LED芯片，其包括安装在基座上的多个接头或子LED（“sub-LED”）。 子LED串联连接，使得驱动子LED所需的电压取决于串联连接的子LED的数量和子LED的结电压。 还公开了制造单片LED芯片的方法，其中一种方法包括在底座上提供单结LED并将单结LED分离成多个子LED。 子LED然后串联互连，使得驱动子LED所需的电压取决于串联的子LED的数量和子LED的结电压。

公开(公告)号：US20110169036A1

公开(公告)日：2011-07-14

申请号：US13071349

申请日：2011-03-24

申请人： JAMES IBBETSON ,  Ting Li ,  Monica Hansen

发明人： JAMES IBBETSON ,  Ting Li ,  Monica Hansen

IPC分类号： H01L33/60

CPC分类号： H01L33/10 ,  H01L33/46 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A high efficiency light emitting diode with a composite high reflectivity layer integral to said LED to improve emission efficiency. One embodiment of a light emitting diode (LED) chip comprises an LED and a composite high reflectivity layer integral to the LED to reflect light emitted from the active region. The composite layer comprises a first layer, and alternating plurality of second and third layers on the first layer, and a reflective layer on the topmost of said plurality of second and third layers. The second and third layers have a different index of refraction, and the first layer is at least three times thicker than the thickest of the second and third layers. For composite layers internal to the LED chip, conductive vias can be included through the composite layer to allow an electrical signal to pass through the composite layer to the LED.

摘要翻译： 一种具有与所述LED集成的复合高反射层的高效率发光二极管，以提高发射效率。 发光二极管（LED）芯片的一个实施例包括LED和与LED成一体的复合高反射层，以反射从有源区发射的光。 所述复合层包括第一层和在第一层上交替的多个第二和第三层，以及在所述多个第二层和第三层的最上层的反射层。 第二层和第三层具有不同的折射率，并且第一层比第二层和第三层中最厚的层厚至少三倍。 对于LED芯片内部的复合层，可以通过复合层包括导电通孔，以允许电信号通过复合层到达LED。

公开(公告)号：US20100252840A1

公开(公告)日：2010-10-07

申请号：US12814241

申请日：2010-06-11

申请人： JAMES IBBETSON ,  Sten Heikman

发明人： JAMES IBBETSON ,  Sten Heikman

IPC分类号： H01L33/62

CPC分类号： H01L25/0753 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED chip comprising a plurality of sub-LEDs on a submount. Electrically conductive and electrically insulating features are included that serially interconnect the sub-LEDs such that an electrical signal applied to the serially interconnected sub-LEDs along the electrically conductive features spreads to the serially interconnected sub-LEDs. A via is included that is arranged to electrically couple one of the sub-LEDs to the submount. The sub-LED can be interconnected by more than one of the conductive features, with each one of the conductive features capable of spreading an electrical signal between the two of the sub-LEDs.

摘要翻译： 一种LED芯片，包括在底座上的多个子LED。 包括导电和电绝缘特征，其将子LED串联连接，使得沿着导电特征施加到串联的子LED的电信号扩展到串联的子LED。 包括通孔，其布置成将子LED中的一个电耦合到基座。 子LED可以由多于一个的导电特征相互连接，每个导电特征能够在两个子LED之间扩展电信号。