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    Cooling of substrate using interposer channels
    2.
    发明授权
    Cooling of substrate using interposer channels 有权
    使用插入器通道冷却衬底

    公开(公告)号：US08059400B2

    公开(公告)日：2011-11-15

    申请号：US12233104

    申请日：2008-09-18

    申请人： Minhua Lu ,  Lawrence S. Mok

    发明人： Minhua Lu ,  Lawrence S. Mok

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L23/433 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A method of forming a structure. An interposer is provided. The interposer is adapted to be interposed between a heat source and a heat sink and to transfer heat from the heat source to the heat sink. The interposer includes an enclosure that encloses a cavity. The enclosure is made of a thermally conductive material. The cavity includes a thermally conductive foam material. The foam material includes pores and includes at least one serpentine channel. Each serpentine channel has at least two contiguously connected channel segments. Each serpentine channel independently forms a closed loop or an open ended loop. The foam material is adapted to be soaked by a liquid filling the pores. Each serpentine channel is adapted to be partially filled with a fluid that serves to transfer heat from the heat source to the heat sink.

    摘要翻译： 一种形成结构的方法。 提供了插入器。 插入件适于插入在热源和散热器之间并将热量从热源传递到散热器。 插入器包括封闭空腔的外壳。 外壳由导热材料制成。 空腔包括导热泡沫材料。 泡沫材料包括孔，并且包括至少一个蛇形通道。 每个蛇形通道具有至少两个连续连接的通道段。 每个蛇形通道独立地形成闭环或开放端环。 泡沫材料适于被填充孔的液体浸泡。 每个蛇形通道适于部分地填充有用于将热量从热源传递到散热器的流体。

    Cooling of substrate using interposer channels
    3.
    发明授权
    Cooling of substrate using interposer channels 有权
    使用插入器通道冷却衬底

    公开(公告)号：US07888603B2

    公开(公告)日：2011-02-15

    申请号：US12212925

    申请日：2008-09-18

    申请人： Minhua Lu ,  Lawrence S. Mok

    发明人： Minhua Lu ,  Lawrence S. Mok

    IPC分类号： H05K1/00

    CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L23/433 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A structure. The structure includes a substrate and an interposer. The substrate includes a heat source and N continuous substrate channels on a first side of the substrate (N≧2). The interposer includes N continuous interposer channels coupled to the N substrate channels to form M continuous loops (1≦M≦N). Each loop independently consists of K substrate channels and K interposer channels in an alternating sequence. For each loop, K is at least 1 and is subject to an upper limit consistent with a constraint of the M loops collectively consisting of the N interposer channels and the N substrate channels. Each loop is independently open ended or closed. The first side of the substrate is connected to the interposer. The interposer is adapted to be thermally coupled to a heat sink such that the interposer is interposed between the substrate and the heat sink.

    摘要翻译： 一个结构。 该结构包括基板和插入件。 衬底在衬底的第一侧上包括热源和N个连续衬底通道（N≥2）。 插入器包括耦合到N个衬底通道的N个连续插入器通道，以形成M个连续环路（1＆amp; NlE; M＆amp; N; N）。 每个回路以交替顺序独立地由K个衬底通道和K个插入器通道组成。 对于每个循环，K至少为1，并且受到与由N个插入物通道和N个底物通道组成的M个回路的约束一致的上限。 每个循环是独立开放的或封闭的。 衬底的第一面连接到插入器。 插入器适于热耦合到散热器，使得插入器插入在基板和散热器之间。

    COOLING OF SUBSTRATE USING INTERPOSER CHANNELS
    4.
    发明申请
    COOLING OF SUBSTRATE USING INTERPOSER CHANNELS 有权
    使用插入式通道冷却基板

    公开(公告)号：US20090008130A1

    公开(公告)日：2009-01-08

    申请号：US12233061

    申请日：2008-09-18

    申请人： Minhua Lu ,  Lawrence S. Mok

    发明人： Minhua Lu ,  Lawrence S. Mok

    IPC分类号： H05K1/00

    CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L23/433 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A structure. The structure includes an interposer adapted to be interposed between a heat source and a heat sink and to transfer heat from the heat source to the heat sink. The interposer includes an enclosure that encloses a cavity. The enclosure is made of a thermally conductive material. The cavity includes a thermally conductive foam material. The foam material includes pores and includes at least one serpentine channel. Each serpentine channel has at least two contiguously connected channel segments. Each serpentine channel independently forms a closed loop or an open ended loop. The foam material is adapted to be soaked by a liquid filling the pores. Each serpentine channel is adapted to be partially filled with a fluid that serves to transfer heat from the heat source to the heat sink.

    摘要翻译： 一个结构。 该结构包括适于插入在热源和散热器之间并将热量从热源传递到散热器的插入件。 插入器包括封闭空腔的外壳。 外壳由导热材料制成。 空腔包括导热泡沫材料。 泡沫材料包括孔，并且包括至少一个蛇形通道。 每个蛇形通道具有至少两个连续连接的通道段。 每个蛇形通道独立地形成闭环或开放端环。 泡沫材料适于被填充孔的液体浸泡。 每个蛇形通道适于部分地填充有用于将热量从热源传递到散热器的流体。

    Cooling of substrate using interposer channels
    6.
    发明授权
    Cooling of substrate using interposer channels 有权
    使用插入器通道冷却衬底

    公开(公告)号：US07434308B2

    公开(公告)日：2008-10-14

    申请号：US10933051

    申请日：2004-09-02

    申请人： Minhua Lu ,  Lawrence S. Mok

    发明人： Minhua Lu ,  Lawrence S. Mok

    IPC分类号： H05K3/36

    CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L23/433 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A structure, and method of forming and cooling the structure. The structure may include a substrate (e.g., a semiconductor chip) having N continuous substrate channels and an interposer having N continuous interposer channels (N≧2). The N interposer channels are coupled to the N substrate channels to form M continuous loops (1≦M≦N). The M loops may transfer heat from a heat source within the substrate to the interposer and then to a heat sink thermally coupled to the interposer. The structure may include an interposer having a thermally conductive enclosure surrounding a cavity. The cavity contains a thermally conductive foam material (e.g., graphite foam). The foam material contains a serpentine channel having contiguously connected channel segments. The serpentine channel may transfer heat from a heat source within a substrate (e.g., a semiconductor chip) to the interposer and then to a heat sink thermally coupled to the interposer.

    摘要翻译： 一种结构，以及形成和冷却结构的方法。 该结构可以包括具有N个连续衬底通道的衬底（例如，半导体芯片）和具有N个连续插入器通道（N> = 2）的插入器。 N个插入器通道耦合到N个衬底沟道以形成M个连续环（1≤M≤N）。 M环可将热量从衬底内的热源传递到插入器，然后传递到热耦合到插入器的散热器。 该结构可以包括具有围绕空腔的导热外壳的插入器。 空腔包含导热泡沫材料（例如石墨泡沫）。 泡沫材料包含具有连续连接的通道段的蛇形通道。 蛇形通道可以将热量从衬底（例如，半导体芯片）内的热源传递到插入器，然后传递到热耦合到插入器的散热器。

    COOLING OF SUBSTRATE USING INTERPOSER CHANNELS
    7.
    发明申请
    COOLING OF SUBSTRATE USING INTERPOSER CHANNELS 有权
    使用插入式通道冷却基板

    公开(公告)号：US20090008129A1

    公开(公告)日：2009-01-08

    申请号：US12212925

    申请日：2008-09-18

    申请人： Minhua Lu ,  Lawrence S. Mok

    发明人： Minhua Lu ,  Lawrence S. Mok

    IPC分类号： H05K1/00

    CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L23/433 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A structure. The structure includes a substrate and an interposer. The substrate includes a heat source and N continuous substrate channels on a first side of the substrate (N≧2). The interposer includes N continuous interposer channels coupled to the N substrate channels to form M continuous loops (1≦M≦N). Each loop independently consists of K substrate channels and K interposer channels in an alternating sequence. For each loop, K is at least 1 and is subject to an upper limit consistent with a constraint of the M loops collectively consisting of the N interposer channels and the N substrate channels. Each loop is independently open ended or closed. The first side of the substrate is connected to the interposer. The interposer is adapted to be thermally coupled to a heat sink such that the interposer is interposed between the substrate and the heat sink.

    摘要翻译： 一个结构。 该结构包括基板和插入件。 衬底在衬底的第一侧上包括热源和N个连续衬底通道（N> = 2）。 插入器包括耦合到N个衬底沟道的N个连续插入器通道，以形成M个连续环（1≤M≤N）。 每个回路以交替顺序独立地由K个衬底通道和K个插入器通道组成。 对于每个循环，K至少为1，并且受到与由N个插入物通道和N个底物通道组成的M个回路的约束一致的上限。 每个循环是独立开放的或封闭的。 衬底的第一面连接到插入器。 插入器适于热耦合到散热器，使得插入器插入在基板和散热器之间。

    Thermal interposer for thermal management of semiconductor devices
    9.
    发明授权
    Thermal interposer for thermal management of semiconductor devices 失效
    用于半导体器件热管理的热插入器

    公开(公告)号：US07180179B2

    公开(公告)日：2007-02-20

    申请号：US10872575

    申请日：2004-06-18

    申请人： Lawrence S. Mok ,  Evan G. Colgan ,  Minhua Lu ,  Da-Yuan Shih

    发明人： Lawrence S. Mok ,  Evan G. Colgan ,  Minhua Lu ,  Da-Yuan Shih

    IPC分类号： H01L23/34 ,  H01L23/495

    CPC分类号： H01L23/427 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/15311

    摘要： A thermal interposer is provided for attachment to a surface of a semiconductor device. In one embodiment, the thermal interposer includes an upper plate having a bottom surface with a plurality of grooves and made of a material having high thermal conductivity, and a lower plate having a top surface with a plurality of grooves and made of a material having a coefficient of thermal expansion that is substantially the same as the coefficient of thermal expansion of the material of a semiconductor device that is bonded to the bottom surface of the lower plate. The bottom surface of the upper plate is hermetically bonded to the top surface of the lower plate so that a vapor chamber is formed by the upper and lower plates, and walls of the grooves on the top surface of the lower plate extend to within less than 250 microns from walls of the grooves on the bottom surface of the upper plate comprise a plurality of second walls the first walls.

    摘要翻译： 提供了用于附接到半导体器件的表面的热插入件。 在一个实施例中，热插入件包括具有多个凹槽并由具有高导热性的材料制成的底表面的上板，以及具有多个凹槽的顶表面的下板，并由具有 热膨胀系数与结合到下板的底面的半导体器件的材料的热膨胀系数基本相同。 上板的底面与下板的顶面密封，从而通过上板和下板形成蒸气室，下板顶表面上的槽的壁延伸到小于 在上板的底表面上的槽的壁250微米包括多个第二壁和第一壁。

    Method of forming a substrate with interposer channels for cooling the substrate
    10.
    发明授权
    Method of forming a substrate with interposer channels for cooling the substrate 有权
    用于具有用于冷却衬底的中介层通道形成衬底的方法

    公开(公告)号：US07856711B2

    公开(公告)日：2010-12-28

    申请号：US12212998

    申请日：2008-09-18

    申请人： Minhua Lu ,  Lawrence S. Mok

    发明人： Minhua Lu ,  Lawrence S. Mok

    IPC分类号： H01K3/10 ,  H01L23/02

    CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L23/433 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A method of forming structure. A substrate and an interposer are provided. The substrate includes a heat source and N continuous substrate channels on a first side of the substrate (N≧2). N interposer channels are coupled to the N substrate channels so as to form M continuous loops (1≦M≦N). Each loop independently consists of K substrate channels and K interposer channels in an alternating sequence. For each loop, K is at least 1 and is subject to an upper limit consistent with a constraint of the M loops collectively consisting of the N interposer channels and the N substrate channels. Each loop is independently open ended or closed. The first side of the substrate is connected to the interposer. The interposer is adapted to be thermally coupled to a heat sink such that the interposer is interposed between the substrate and the heat sink.

    摘要翻译： 一种形成结构的方法。 提供了基板和插入件。 衬底在衬底的第一侧上包括热源和N个连续衬底通道（N≥2）。 N个内插器通道耦合到N个衬底通道，以便形成M个连续环路（1＆amp; NlE; M＆amp; N; N）。 每个回路以交替顺序独立地由K个衬底通道和K个插入器通道组成。 对于每个循环，K至少为1，并且受到与由N个插入物通道和N个底物通道组成的M个回路的约束一致的上限。 每个循环是独立开放的或封闭的。 衬底的第一面连接到插入器。 插入器适于热耦合到散热器，使得插入器插入在基板和散热器之间。