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公开(公告)号：US09674938B2
公开(公告)日：2017-06-06
申请号：US13883386
申请日：2011-10-27
申请人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Il Agcaoili Narag , James R. White , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney , Nathan P. Kreutter , Qihong Nie , Jian Xia Gao
发明人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Il Agcaoili Narag , James R. White , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney , Nathan P. Kreutter , Qihong Nie , Jian Xia Gao
CPC分类号： H05K1/0206 , H01L24/32 , H01L33/486 , H01L33/64 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/021 , H05K1/189 , H05K2201/09827 , H05K2201/09845 , H05K2201/10106 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.
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公开(公告)号：US09698563B2
公开(公告)日：2017-07-04
申请号：US13883354
申请日：2011-10-27
申请人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Il Agcaoili Narag , James R. White , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney , Nathan P. Kreutter , Qihong Nie , Jian Xia Gao
发明人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Il Agcaoili Narag , James R. White , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney , Nathan P. Kreutter , Qihong Nie , Jian Xia Gao
CPC分类号： H01S5/024 , H01L24/32 , H01L33/486 , H01L33/64 , H01L33/647 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/07802 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/3011 , H01L2924/351 , H05K1/183 , H05K1/189 , H05K2201/10106 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.
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公开(公告)号：US20140036461A1
公开(公告)日：2014-02-06
申请号：US13883386
申请日：2011-10-27
申请人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin II Agcaoili Narag , James R White , Fong Liang Tan , Andrew J Ouderkirk , Justine A Mooney , Nathan P Kreutter , Qihong Nie , Jian Xia Gao
发明人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin II Agcaoili Narag , James R White , Fong Liang Tan , Andrew J Ouderkirk , Justine A Mooney , Nathan P Kreutter , Qihong Nie , Jian Xia Gao
IPC分类号： H05K1/02
CPC分类号： H05K1/0206 , H01L24/32 , H01L33/486 , H01L33/64 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/021 , H05K1/189 , H05K2201/09827 , H05K2201/09845 , H05K2201/10106 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.
摘要翻译： 提供了一种诸如LED器件的柔性发光半导体器件（26），其包括具有第一和第二主表面的柔性介电层（12）和至少一个通孔（10），该通孔（10）从第一至第 所述第二主表面在所述第一和第二主表面中的每个表面上以及所述通孔中具有导电层（19,20,18）。 通孔中的导电层（18）支撑发光半导体器件（26），并且与电介质层的第一主表面上的导电层（19）电隔离。
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公开(公告)号：US20130294471A1
公开(公告)日：2013-11-07
申请号：US13883354
申请日：2011-10-27
申请人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin II Agcaoili Narag , James R. White , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney , Nathan P. Kreutter , Qihong Nie , Jian Xia Gao
发明人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin II Agcaoili Narag , James R. White , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney , Nathan P. Kreutter , Qihong Nie , Jian Xia Gao
CPC分类号： H01S5/024 , H01L24/32 , H01L33/486 , H01L33/64 , H01L33/647 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/07802 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/3011 , H01L2924/351 , H05K1/183 , H05K1/189 , H05K2201/10106 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.
摘要翻译： 提供了一种诸如LED器件的柔性发光半导体器件，其包括具有在第一主表面上具有导电层的第一和第二主表面的柔性介电层以及具有导电层的第一主表面中的至少一个空腔 在支撑发光半导体器件的腔中。 空腔中的导电层与电介质层的第二主表面电隔离。
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公开(公告)号：US09236547B2
公开(公告)日：2016-01-12
申请号：US14233266
申请日：2012-08-08
CPC分类号： H01L33/62 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L33/486 , H01L33/64 , H01L2224/48227 , H01L2224/73265 , H01L2924/01322 , H01L2924/12032 , H01S5/02236 , H01S5/02276 , H01S5/02469 , H01L2924/00
摘要： Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.
摘要翻译： 提供了一种发光半导体器件，其包括柔性介电层，介电层的至少一侧上的导电层，电介质基板中的至少一个空腔或通孔，以及由空腔或通孔支撑的发光半导体。 还提供了一种支撑制品，其包括柔性电介质层，至少一侧上的导电层和电介质基底中的至少一个空腔或通孔。 还提供了一种柔性发光半导体器件系统，其包括附着在上述支撑制品上的上述发光半导体器件。
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公开(公告)号：US20140153263A1
公开(公告)日：2014-06-05
申请号：US14233266
申请日：2012-08-08
CPC分类号： H01L33/62 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L33/486 , H01L33/64 , H01L2224/48227 , H01L2224/73265 , H01L2924/01322 , H01L2924/12032 , H01S5/02236 , H01S5/02276 , H01S5/02469 , H01L2924/00
摘要： Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.
摘要翻译： 提供了一种发光半导体器件，其包括柔性介电层，介电层的至少一侧上的导电层，电介质基板中的至少一个空腔或通孔，以及由空腔或通孔支撑的发光半导体。 还提供了一种支撑制品，其包括柔性电介质层，至少一侧上的导电层和电介质基底中的至少一个空腔或通孔。 还提供了一种柔性发光半导体器件系统，其包括附着在上述支撑制品上的上述发光半导体器件。
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公开(公告)号：US20080283278A1
公开(公告)日：2008-11-20
申请号：US11908741
申请日：2006-04-04
申请人： Li Ping Wang , Xiao Dong Wang , Jian Xia Gao
发明人： Li Ping Wang , Xiao Dong Wang , Jian Xia Gao
IPC分类号： H05K1/00
CPC分类号： H05K3/388 , H05K1/0393 , H05K3/363
摘要： The present invention is directed to a substrate for subsequent eutectic bonding with a subsequently applied metal to provide, or as a precursor to the provision of, a circuit substrate. The circuit substrate comprises a dielectric film and a layer of an oxide or oxides of a metal on the film. The metal oxide layer has been formed by sputtering the metal of the metal oxide or oxides onto a surface of the film in the presence of an inert atmosphere save for at least one reactive gas content to provide the oxygen of the oxides.
摘要翻译： 本发明涉及用于随后与随后施加的金属共晶接合以提供或作为提供电路基板的前体的基板。 电路基板包括电介质膜和膜上的金属的氧化物或氧化物层。 金属氧化物层是通过在惰性气氛的存在下将金属氧化物或氧化物的金属溅射到膜的表面而形成的，除了至少一种反应气体含量以提供氧化物的氧。
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