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公开(公告)号：US09236547B2
公开(公告)日：2016-01-12
申请号：US14233266
申请日：2012-08-08
CPC分类号： H01L33/62 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L33/486 , H01L33/64 , H01L2224/48227 , H01L2224/73265 , H01L2924/01322 , H01L2924/12032 , H01S5/02236 , H01S5/02276 , H01S5/02469 , H01L2924/00
摘要： Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.
摘要翻译： 提供了一种发光半导体器件，其包括柔性介电层，介电层的至少一侧上的导电层，电介质基板中的至少一个空腔或通孔，以及由空腔或通孔支撑的发光半导体。 还提供了一种支撑制品，其包括柔性电介质层，至少一侧上的导电层和电介质基底中的至少一个空腔或通孔。 还提供了一种柔性发光半导体器件系统，其包括附着在上述支撑制品上的上述发光半导体器件。
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公开(公告)号：US09674938B2
公开(公告)日：2017-06-06
申请号：US13883386
申请日：2011-10-27
申请人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Il Agcaoili Narag , James R. White , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney , Nathan P. Kreutter , Qihong Nie , Jian Xia Gao
发明人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Il Agcaoili Narag , James R. White , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney , Nathan P. Kreutter , Qihong Nie , Jian Xia Gao
CPC分类号： H05K1/0206 , H01L24/32 , H01L33/486 , H01L33/64 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/021 , H05K1/189 , H05K2201/09827 , H05K2201/09845 , H05K2201/10106 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.
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公开(公告)号：US09698563B2
公开(公告)日：2017-07-04
申请号：US13883354
申请日：2011-10-27
申请人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Il Agcaoili Narag , James R. White , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney , Nathan P. Kreutter , Qihong Nie , Jian Xia Gao
发明人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Il Agcaoili Narag , James R. White , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney , Nathan P. Kreutter , Qihong Nie , Jian Xia Gao
CPC分类号： H01S5/024 , H01L24/32 , H01L33/486 , H01L33/64 , H01L33/647 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/07802 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/3011 , H01L2924/351 , H05K1/183 , H05K1/189 , H05K2201/10106 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.
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公开(公告)号：US09716061B2
公开(公告)日：2017-07-25
申请号：US13985096
申请日：2012-02-17
申请人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Il Agcaoili Narag , Siang Sin Foo , Fong Liang Tan , Wei Meng Pee , Andrew J. Ouderkirk , Justine A. Mooney
发明人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Il Agcaoili Narag , Siang Sin Foo , Fong Liang Tan , Wei Meng Pee , Andrew J. Ouderkirk , Justine A. Mooney
CPC分类号： H01L23/4985 , H01L23/498 , H01L23/49838 , H01L23/49872 , H01L24/17 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2924/00 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/112 , H05K1/189 , H05K2201/10106
摘要： A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one via extending from the second major surface to the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semi-conductor device to the conductive layer.
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公开(公告)号：US09179543B2
公开(公告)日：2015-11-03
申请号：US13881466
申请日：2011-10-27
申请人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Il Agcaoili Narag , Siang Sin Foo , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney
发明人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Il Agcaoili Narag , Siang Sin Foo , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney
CPC分类号： H01L33/647 , H01L24/17 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/07802 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/0203 , H05K1/0277 , H05K1/183 , H05K1/189 , H05K2201/10106 , H05K2201/2054 , H01L2924/00
摘要： An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.
摘要翻译： 一种制品包括具有第一和第二主表面的柔性聚合物介电层。 第一主表面上具有导电层，其中至少有一个空腔。 所述至少一个腔包含导电材料，所述导电材料包括电分离的第一和第二部分，所述第一和第二部分支撑并将发光半导体器件电连接到第一主表面上的导电层。
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公开(公告)号：US20130213697A1
公开(公告)日：2013-08-22
申请号：US13881466
申请日：2011-10-27
申请人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Il Agcaoili Narag , Siang Sin Foo , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney
发明人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Il Agcaoili Narag , Siang Sin Foo , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney
IPC分类号： H05K1/02
CPC分类号： H01L33/647 , H01L24/17 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/07802 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/0203 , H05K1/0277 , H05K1/183 , H05K1/189 , H05K2201/10106 , H05K2201/2054 , H01L2924/00
摘要： An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.
摘要翻译： 一种制品包括具有第一和第二主表面的柔性聚合物介电层。 第一主表面上具有导电层，其中至少有一个空腔。 所述至少一个空腔包含导电材料，所述导电材料包括电分离的第一和第二部分，所述第一和第二部分支撑并将发光半导体器件电连接到所述第一主表面上的导电层。
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公开(公告)号：US20140153263A1
公开(公告)日：2014-06-05
申请号：US14233266
申请日：2012-08-08
CPC分类号： H01L33/62 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L33/486 , H01L33/64 , H01L2224/48227 , H01L2224/73265 , H01L2924/01322 , H01L2924/12032 , H01S5/02236 , H01S5/02276 , H01S5/02469 , H01L2924/00
摘要： Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.
摘要翻译： 提供了一种发光半导体器件，其包括柔性介电层，介电层的至少一侧上的导电层，电介质基板中的至少一个空腔或通孔，以及由空腔或通孔支撑的发光半导体。 还提供了一种支撑制品，其包括柔性电介质层，至少一侧上的导电层和电介质基底中的至少一个空腔或通孔。 还提供了一种柔性发光半导体器件系统，其包括附着在上述支撑制品上的上述发光半导体器件。
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公开(公告)号：US20140036461A1
公开(公告)日：2014-02-06
申请号：US13883386
申请日：2011-10-27
申请人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin II Agcaoili Narag , James R White , Fong Liang Tan , Andrew J Ouderkirk , Justine A Mooney , Nathan P Kreutter , Qihong Nie , Jian Xia Gao
发明人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin II Agcaoili Narag , James R White , Fong Liang Tan , Andrew J Ouderkirk , Justine A Mooney , Nathan P Kreutter , Qihong Nie , Jian Xia Gao
IPC分类号： H05K1/02
CPC分类号： H05K1/0206 , H01L24/32 , H01L33/486 , H01L33/64 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/021 , H05K1/189 , H05K2201/09827 , H05K2201/09845 , H05K2201/10106 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.
摘要翻译： 提供了一种诸如LED器件的柔性发光半导体器件（26），其包括具有第一和第二主表面的柔性介电层（12）和至少一个通孔（10），该通孔（10）从第一至第 所述第二主表面在所述第一和第二主表面中的每个表面上以及所述通孔中具有导电层（19,20,18）。 通孔中的导电层（18）支撑发光半导体器件（26），并且与电介质层的第一主表面上的导电层（19）电隔离。
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公开(公告)号：US20130294471A1
公开(公告)日：2013-11-07
申请号：US13883354
申请日：2011-10-27
申请人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin II Agcaoili Narag , James R. White , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney , Nathan P. Kreutter , Qihong Nie , Jian Xia Gao
发明人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin II Agcaoili Narag , James R. White , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney , Nathan P. Kreutter , Qihong Nie , Jian Xia Gao
CPC分类号： H01S5/024 , H01L24/32 , H01L33/486 , H01L33/64 , H01L33/647 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/07802 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/3011 , H01L2924/351 , H05K1/183 , H05K1/189 , H05K2201/10106 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.
摘要翻译： 提供了一种诸如LED器件的柔性发光半导体器件，其包括具有在第一主表面上具有导电层的第一和第二主表面的柔性介电层以及具有导电层的第一主表面中的至少一个空腔 在支撑发光半导体器件的腔中。 空腔中的导电层与电介质层的第二主表面电隔离。
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公开(公告)号：US20130320390A1
公开(公告)日：2013-12-05
申请号：US13985096
申请日：2012-02-17
申请人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Agcaoili Narag, II , Siang Sin Foo , Fong Liang Tan , Wei Meng Pee , Andrew J. Ouderkirk , Justine A. Mooney
发明人： Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin Agcaoili Narag, II , Siang Sin Foo , Fong Liang Tan , Wei Meng Pee , Andrew J. Ouderkirk , Justine A. Mooney
CPC分类号： H01L23/4985 , H01L23/498 , H01L23/49838 , H01L23/49872 , H01L24/17 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2924/00 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/112 , H05K1/189 , H05K2201/10106
摘要： A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one via extending from the second major surface to the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semi-conductor device to the conductive layer.
摘要翻译： 柔性聚合物介电层具有第一和第二主表面。 第一主表面上具有导电层。 电介质层具有从第二主表面延伸到第一主表面的至少一个通孔。 导电层包括电分离的第一和第二部分，其被配置为将发光半导体器件支撑并电连接到导电层。
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