公开(公告)号：US07023700B2

公开(公告)日：2006-04-04

申请号：US10707623

申请日：2003-12-24

申请人： Ren-Kang Chiou ,  Tzu-Yih Chu

发明人： Ren-Kang Chiou ,  Tzu-Yih Chu

IPC分类号： H05K7/20

CPC分类号： H01L23/3672 ,  H01L23/40 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module has a two-plate heat sink attached by rivets. A front plate contacts the flat surfaces of memory chips on a front surface of the module printed-circuit board (PCB) substrate, while another back plate contacts chips on the back surface of the substrate. The plates contact the substrate along the top edge opposite the connector edge, and along the upper half of the substrate's side edges. Holes in the substrate allow for rivets or other fasteners to pass through to firmly attach the plates to the substrate, prevent wobble. Four top-edge slots are cut in the plates near the top edge, between the rivets along the top edge. The top-edge slots allow air to flow underneath the plates, in small gaps between memory chips, and between the plate and the substrate. The added air flow underneath the plates helps cool the heat-sink plates, reduce hot spots and failures.

摘要翻译： 内存模块有一个由铆钉连接的双板散热片。 前板与模块印刷电路板（PCB）基板的前表面上的存储芯片的平坦表面接触，而另一个背板与基板的背面上的芯片接触。 板沿着与连接器边缘相对的顶部边缘并沿着基板侧边缘的上半部接触基板。 衬底中的孔允许铆钉或其它紧固件穿过以将板牢固地附接到衬底上，防止摆动。 在顶部边缘附近的板中沿着顶部边缘在铆钉之间切割四个顶部边缘槽。 顶边槽允许空气在板之下，存储芯片之间的小间隙以及板和衬底之间的小间隙中流动。 板下面添加的气流有助于冷却散热板，减少热点和故障。

公开(公告)号：US20050141199A1

公开(公告)日：2005-06-30

申请号：US10707623

申请日：2003-12-24

申请人： Ren-Kang Chiou ,  Tzu-Yih Chu

发明人： Ren-Kang Chiou ,  Tzu-Yih Chu

IPC分类号： H01L23/367 ,  H01L23/40 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/3672 ,  H01L23/40 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module has a two-plate heat sink attached by rivets. A front plate contacts the flat surfaces of memory chips on a front surface of the module printed-circuit board (PCB) substrate, while another back plate contacts chips on the back surface of the substrate. The plates contact the substrate along the top edge opposite the connector edge, and along the upper half of the substrate's side edges. Holes in the substrate allow for rivets or other fasteners to pass through to firmly attach the plates to the substrate, prevent wobble. Four top-edge slots are cut in the plates near the top edge, between the rivets along the top edge. The top-edge slots allow air to flow underneath the plates, in small gaps between memory chips, and between the plate and the substrate. The added air flow underneath the plates helps cool the heat-sink plates, reduce hot spots and failures.

摘要翻译： 内存模块有一个由铆钉连接的双板散热片。 前板与模块印刷电路板（PCB）基板的前表面上的存储芯片的平坦表面接触，而另一个背板与基板的背面上的芯片接触。 板沿着与连接器边缘相对的顶部边缘并沿着基板的侧边缘的上半部接触基板。 衬底中的孔允许铆钉或其它紧固件穿过以将板牢固地附接到衬底上，防止摆动。 在顶部边缘附近的板中沿着顶部边缘在铆钉之间切割四个顶部边缘槽。 顶边槽允许空气在板之下，存储芯片之间的小间隙以及板和衬底之间的小间隙中流动。 板下面添加的气流有助于冷却散热板，减少热点和故障。

公开(公告)号：US06542393B1

公开(公告)日：2003-04-01

申请号：US10063452

申请日：2002-04-24

申请人： Tzu-Yih Chu ,  Ren-Kang Chiou

发明人： Tzu-Yih Chu ,  Ren-Kang Chiou

IPC分类号： G11C502

CPC分类号： H05K1/141 ,  G11C5/04 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2225/1029 ,  H01L2225/107 ,  H05K1/182 ,  H05K2201/09036 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10689 ,  H01L2924/00014

摘要： A memory module has memory chips in stacks. The lower memory chip in a stack has pins that are soldered to pads on the module substrate. A hollowed printed-circuit board (PCB) has a hollow opening on the bottom with about the same width, length, and depth as the top cap of the lower memory chip. The hollowed PCB fits over the top cap of the lower memory chip and has lower pads on its lower surface but outside of the hollow opening. The lower pads are soldered to the top shoulders of the pins of the lower memory chip. An upper memory chip has pins that are soldered to pads on the upper surface of the hollowed PCB. The hollowed PCB has a metal trace that re-routes a second bank-select signal from a no-connect pin of the lower memory chip to a bank-select pin of the upper memory chip.

摘要翻译： 存储器模块具有堆叠的存储器芯片。 堆叠中的下部存储器芯片具有焊接到模块基板上的焊盘的引脚。 中空的印刷电路板（PCB）在底部具有与下部存储芯片的顶盖大致相同的宽度，长度和深度的中空开口。 中空的PCB装配在下部存储器芯片的顶盖上，并且在其下表面上具有较低的焊盘，但在中空开口之外。 下焊盘焊接到下部存储器芯片的引脚的顶部肩部。 上部存储器芯片具有焊接到中空PCB的上表面上的焊盘的引脚。 中空PCB具有将第二组选择信号从下部存储器芯片的无连接引脚重新路由到上部存储器芯片的组选择引脚的金属迹线。

公开(公告)号：US07004794B2

公开(公告)日：2006-02-28

申请号：US10917672

申请日：2004-08-13

申请人： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  Edward W. Lee ,  Tzu-Yih Chu

发明人： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  Edward W. Lee ,  Tzu-Yih Chu

IPC分类号： H01R33/00

CPC分类号： G06K19/07732 ,  G06K19/07733 ,  H01R24/62

摘要： A low-profile Universal-Serial-Bus (USB) connector includes a substantially flat base structure that is received in the lower section of a conventional female USB connector, and includes metal contacts formed on an upper surface of the base structure. Wobble or vertical play is reduced by rails extending along side edges of the base structure that are partially inserted into gaps formed between the metal case and base structure of the female USB connector. Between metal contacts on the low-profile USB connector are raised ribs (dividers) that prevent undesirable damage or contamination to the metal contacts. The connector base structure of the low-profile USB connector can be separate or can be integrated with a circuit board that holds a flash memory chip and a USB controller chip.

摘要翻译： 一种低调的通用串行总线（USB）连接器包括基本上平坦的基座结构，其被接收在传统的母USB连接器的下部，并且包括形成在基座结构的上表面上的金属触点。 摇摆或垂直播放通过沿底座结构的侧边缘延伸的轨道减少，该轨道部分地插入形成在母壳式USB连接器的金属外壳和基座结构之间的间隙中。 在薄型USB连接器上的金属触点之间是凸肋（分隔线），可防止不必要的金属触点损坏或污染。 低调USB连接器的连接器基座结构可以是独立的，也可以与保存闪存芯片和USB控制器芯片的电路板集成。

公开(公告)号：US06933209B2

公开(公告)日：2005-08-23

申请号：US10707624

申请日：2003-12-24

申请人： Ren-Kang Chiou ,  Tzu-Yih Chu

发明人： Ren-Kang Chiou ,  Tzu-Yih Chu

IPC分类号： H01L21/30 ,  H01L21/301 ,  H01L21/44 ,  H01L21/46 ,  H01L21/48 ,  H01L21/50 ,  H01L21/76 ,  H01L21/78 ,  H01L25/10 ,  H05K1/18

CPC分类号： H01L25/105 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/181 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10689 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Memory chips are assembled into a stack with an insertion-pin frame between pins of two stacked memory chips. The insertion-pin frame is not bent or formed into 3-dimensional shapes but is flat, improving use in standard surface-mount processes such as solder printing onto the insertion-pin frame. Flat insertion pins held to the flat insertion-pin frame by necks are soldered to top shoulders of pins on a lower chip. Then bottom feet of pins of an upper chip are soldered to the insertion pins. The necks are punched away or broken to release the insertion-pin frame from the insertion pins that are soldered to the assembled stacked chips. An insulated wire jumper can be placed under the pins to jumper chip-select connections, or a bridge between insertion pins can be formed from the insertion-pin frame. Holding tabs to the bridge are removed with the insertion pins or by punching.

摘要翻译： 存储器芯片组装成具有在两个堆叠的存储器芯片的引脚之间的插入引脚框架的堆叠。 插入销框架不弯曲或形成三维形状，但是平坦，改善了在标准表面贴装工艺（例如焊接印刷到插针框架上）的使用。 通过颈部将扁平插入销固定到扁平插入架框架上焊接到下部芯片上的针脚顶部。 然后将上部芯片的引脚的底脚焊接到插入引脚。 颈部被冲掉或破裂，以将插入销框架从焊接到组装的堆叠芯片上的插入销释放。 绝缘跳线可以放置在引脚下方跳线芯片选择连接，也可以从插针框架形成插入插脚之间的桥。 通过插销或冲孔将保持接头连接到桥上。

公开(公告)号：US20050085133A1

公开(公告)日：2005-04-21

申请号：US10917672

申请日：2004-08-13

申请人： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  Edward Lee ,  Tzu-Yih Chu

发明人： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  Edward Lee ,  Tzu-Yih Chu

IPC分类号： H01R12/00 ,  H01R13/627 ,  H01R24/00 ,  H01R33/00

CPC分类号： G06K19/07732 ,  G06K19/07733 ,  H01R24/62

摘要： A low-profile Universal-Serial-Bus (USB) connector includes a substantially flat base structure that is received in the lower section of a conventional female USB connector, and includes metal contacts formed on an upper surface of the base structure. Wobble or vertical play is reduced by rails extending along side edges of the base structure that are partially inserted into gaps formed between the metal case and base structure of the female USB connector. Between metal contacts on the low-profile USB connector are raised ribs (dividers) that prevent undesirable damage or contamination to the metal contacts. The connector base structure of the low-profile USB connector can be separate or can be integrated with a circuit board that holds a flash memory chip and a USB controller chip.

摘要翻译： 一种低调的通用串行总线（USB）连接器包括基本上平坦的基座结构，其被接收在传统的母USB连接器的下部，并且包括形成在基座结构的上表面上的金属触点。 摇摆或垂直播放通过沿底座结构的侧边缘延伸的轨道减少，该轨道部分地插入形成在母壳式USB连接器的金属外壳和基座结构之间的间隙中。 在薄型USB连接器上的金属触点之间是凸肋（分隔线），可防止不必要的金属触点损坏或污染。 低调USB连接器的连接器基座结构可以是独立的，也可以与保存闪存芯片和USB控制器芯片的电路板集成。

公开(公告)号：USRE40115E1

公开(公告)日：2008-02-26

申请号：US11106735

申请日：2005-04-13

申请人： Edward W. Lee ,  Ren-Kang Chiou ,  Tzu-Yih Chu

发明人： Edward W. Lee ,  Ren-Kang Chiou ,  Tzu-Yih Chu

IPC分类号： H01R12/00

CPC分类号： G06K19/07732 ,  G06K19/07733 ,  H01R24/62 ,  H01R27/02

摘要： A slim male Universal-Serial-Bus (USB) connector fits on only one side of the connector substrate in a standard female USB connector. Wobble or vertical play is reduced by locking depressions in the slim male USB connector that engage metal springs on a metal case that surrounds the female USB connector, locking the two connectors together. Between metal contacts on the slim USM connector are dividers that help fill in gaps when the two connectors are connected together, further reducing play. End rails on the slim USB connector fill in gaps on the sides. The connector substrate of the slim male USB connector can be separate or can be integrated with a circuit board that holds a flash memory chip and a USB controller chip. The connector is wider than the standard width for a better fit. A slim female USB connector for assembly use with the slim male USB connector is also disclosed.

摘要翻译： 通用串行总线（USB）连接器适合于通用串行总线（USB）连接器，适用于<？insert-start id =“INS-S-00001”date =“20080226”？> male <？insert-end id =“INS-S-00001”？ 仅在标准母USB连接器中的连接器基板的一侧。 摆动或垂直播放通过在细长状态下锁定凹陷来减少<？insert-start id =“INS-S-00002”date =“20080226”？> male <？insert-end id =“INS-S-00002”？> USB连接器，将金属弹簧接合在围绕母USB连接器的金属外壳上，将两个连接器锁定在一起。 在超薄USM连接器上的金属触点之间的分隔线有助于在两个连接器连接在一起时填补间隙，进一步减少播放。 超薄USB连接器上的端部导轨填充两侧的间隙。 USB连接器的连接器基板可以是单独的或者是可以分开的，这个连接器基板的尺寸<？insert-start id =“INS-S-00003”date =“20080226”？> male <？insert-end id =“INS-S-00003” 可以与保存闪存芯片和USB控制器芯片的电路板集成。 连接器比标准宽度更宽，更好的适合。 一个细长的母USB连接器，用于组装<？insert-start id =“INS-S-00004”date =“20080226”？>使用细长的公头USB？<？insert-end id =“INS-S-00004”？ 连接器也被公开。

公开(公告)号：US20050142694A1

公开(公告)日：2005-06-30

申请号：US10707624

申请日：2003-12-24

申请人： Ren-Kang Chiou ,  Tzu-Yih Chu

发明人： Ren-Kang Chiou ,  Tzu-Yih Chu

IPC分类号： H01L21/30 ,  H01L21/301 ,  H01L21/44 ,  H01L21/46 ,  H01L21/48 ,  H01L21/50 ,  H01L21/76 ,  H01L21/78 ,  H01L25/10 ,  H05K1/18

CPC分类号： H01L25/105 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/181 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10689 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Memory chips are assembled into a stack with an insertion-pin frame between pins of two stacked memory chips. The insertion-pin frame is not bent or formed into 3-dimensional shapes but is flat, improving use in standard surface-mount processes such as solder printing onto the insertion-pin frame. Flat insertion pins held to the flat insertion-pin frame by necks are soldered to top shoulders of pins on a lower chip. Then bottom feet of pins of an upper chip are soldered to the insertion pins. The necks are punched away or broken to release the insertion-pin frame from the insertion pins that are soldered to the assembled stacked chips. An insulated wire jumper can be placed under the pins to jumper chip-select connections, or a bridge between insertion pins can be formed from the insertion-pin frame. Holding tabs to the bridge are removed with the insertion pins or by punching.

摘要翻译： 存储器芯片组装成具有在两个堆叠的存储器芯片的引脚之间的插入引脚框架的堆叠。 插入销框架不弯曲或形成三维形状，但是平坦，改善了在标准表面贴装工艺（例如焊接印刷到插针框架上）的使用。 通过颈部将扁平插入销固定到扁平插入架框架上焊接到下部芯片上的针脚顶部。 然后将上部芯片的引脚的底脚焊接到插入引脚。 颈部被冲掉或破裂，以将插入销框架从焊接到组装的堆叠芯片上的插入销释放。 绝缘跳线可以放置在引脚下方跳线芯片选择连接，也可以从插针框架形成插入插脚之间的桥。 通过插销或冲孔将保持接头连接到桥上。

公开(公告)号：US06854984B1

公开(公告)日：2005-02-15

申请号：US10605146

申请日：2003-09-11

申请人： Edward W. Lee ,  Ren-Kang Chiou ,  Tzu-Yih Chu

发明人： Edward W. Lee ,  Ren-Kang Chiou ,  Tzu-Yih Chu

IPC分类号： H01R12/00 ,  H01R13/627 ,  H01R24/00 ,  H01R33/00

CPC分类号： G06K19/07732 ,  G06K19/07733 ,  H01R24/62 ,  H01R27/02

摘要： A slim Universal-Serial-Bus (USB) connector fits on only one side of the connector substrate in a standard female USB connector. Wobble or vertical play is reduced by locking depressions in the slim USB connector that engage metal springs on a metal case that surrounds the female USB connector, locking the two connectors together. Between metal contacts on the slim USM connector are dividers that help fill in gaps when the two connectors are connected together, further reducing play. End rails on the slim USB connector fill in gaps on the sides. The connector substrate of the slim USB connector can be separate or can be integrated with a circuit board that holds a flash memory chip and a USB controller chip. The connector is wider than the standard width for a better fit. A slim female USB connector for use with the slim male USB connector is also disclosed.

摘要翻译： 一个超薄的通用串行总线（USB）连接器仅适用于标准母USB连接器中连接器基板的一侧。 通过在细长的USB连接器上锁定凹陷来减少摆动或垂直播放，该凹槽与围绕母USB连接器的金属外壳上的金属弹簧接合，将两个连接器锁定在一起。 在超薄USM连接器上的金属触点之间的分隔线有助于在两个连接器连接在一起时填补间隙，进一步减少播放。 超薄USB连接器上的端部导轨填充两侧的间隙。 细长USB连接器的连接器基板可以是分离的，或者可以与保存闪存芯片和USB控制器芯片的电路板集成。 连接器比标准宽度更宽，更好的适合。 还公开了一种用于与超薄公USB连接器一起使用的纤细的母USB连接器。

公开(公告)号：US07126559B2

公开(公告)日：2006-10-24

申请号：US10707622

申请日：2003-12-24

申请人： Ching-Jong Su ,  Sun-Teck See ,  Tzu-Yih Chu

发明人： Ching-Jong Su ,  Sun-Teck See ,  Tzu-Yih Chu

IPC分类号： G09G3/14

CPC分类号： G11C16/06 ,  Y10S345/905

摘要： A multi-light-emitting diode (LED) display for a USB flash drive produces a visually dazzling display. When accessed, a USB flash controller drives pulses onto an activity signal that increments a counter on a pattern-decoding generator. The pattern-decoding generator decodes the count and drives signals to data outputs. The data outputs connect to LED's, turning LED's on and off according to a display pattern. The pattern can be programmed by the USB flash controller into the pattern-decoding generator, or can be a hardwired pattern. Marquee patterns having a lit LED appearing to move down a line of LED's have more visual appeal than single LED indicators. Each data line can drive two LED's in different parts of a dual display, reducing costs. Multi-color LED's can be used to improve variety. The multiple LED's and the pattern-decoding generator can be mounted on a flexible PCB.

摘要翻译： 用于USB闪存驱动器的多发光二极管（LED）显示器产生视觉上令人眼花缭乱的显示。 当访问时，USB闪存控制器将脉冲驱动到增加模式解码发生器上的计数器的活动信号上。 模式解码产生器解码计数并将信号驱动到数据输出。 数据输出连接到LED，根据显示模式打开和关闭LED。 该模式可以由USB闪存控制器编程到模式解码生成器中，也可以是硬连线图案。 具有点亮LED的花纹图案看起来沿着LED线移动，具有比单个LED指示器更多的视觉吸引力。 每个数据线可以驱动双显示器的不同部分的两个LED，从而降低成本。 多色LED可用于提高品种。 多个LED和图案解码发生器可以安装在柔性PCB上。