Flow-through pressure sensor apparatus
    1.
    发明授权
    Flow-through pressure sensor apparatus 有权
    流通式压力传感器装置

    公开(公告)号:US08312774B2

    公开(公告)日:2012-11-20

    申请号:US12389091

    申请日:2009-02-19

    IPC分类号: G01L7/00

    CPC分类号: G01L19/0023

    摘要: A flow-through pressure sensor apparatus that reduces the dead space of a flow tube utilized to provide fluid communication between a pressure sense die and a fluid and with an absolute minimum trapped volume. A cover (e.g., plastic) with two-molded ports can be added to one side of the pressure sense die utilizing molded-in solder pins to improve ruggedness and rigidity. A temperature and a humidity sensor can also be mounted to a substrate (e.g., ceramic) in the flow path and can be connected to a programmable compensation integrated circuit on the opposite side utilizing a clip end of mounting pins or by vias through the substrate outside a pressurized area.

    摘要翻译: 一种流通压力传感器装置,其减少用于在压力感测管芯和流体之间提供流体连通并具有绝对最小捕集体积的流动管的死空间。 具有两个模制端口的盖子(例如塑料)可以使用模制的焊接销添加到压力感测模具的一侧,以改善耐用性和刚度。 温度和湿度传感器也可以安装在流路中的基板(例如陶瓷)上,并且可以使用安装销的夹子端或穿过基板外部的通孔连接到相对侧的可编程补偿集成电路 一个加压区域。

    Temperature compensated force sensor
    2.
    发明授权
    Temperature compensated force sensor 有权
    温度补偿力传感器

    公开(公告)号:US09003897B2

    公开(公告)日:2015-04-14

    申请号:US13468899

    申请日:2012-05-10

    CPC分类号: G01L1/26 G01L1/18

    摘要: A force sensor may include a housing having a cavity enclosing a sense die, an actuating element and an elastomeric seal. The sense die may have a force sensing element for sensing a force applied to a surface of the sense die, and a temperature compensation circuit. The temperature compensation circuit may be located on the surface of the sense die and may be configured to at least partially compensate for the temperature sensitivity of the force sensing element. The actuating element may extend outside the housing and be used to transfer a force applied externally from the housing to the sense die. The elastomeric seal may include one or more conductive elements separated from the edge of the elastomeric seal by an insulating elastomeric material.

    摘要翻译: 力传感器可以包括壳体,该壳体具有封闭感应模具,致动元件和弹性体密封件的空腔。 感测芯片可以具有用于感测施加到感测管芯的表面的力的力感测元件和温度补偿电路。 温度补偿电路可以位于感测管芯的表面上,并且可以被配置为至少部分地补偿力感测元件的温度敏感性。 致动元件可以延伸到壳体外部,并用于将从壳体外部施加的力传递到感测管芯。 弹性体密封件可以包括通过绝缘弹性体材料与弹性体密封件的边缘分离的一个或多个导电元件。

    TEMPERATURE COMPENSATED FORCE SENSOR
    3.
    发明申请
    TEMPERATURE COMPENSATED FORCE SENSOR 有权
    温度补偿力传感器

    公开(公告)号:US20130298688A1

    公开(公告)日:2013-11-14

    申请号:US13468899

    申请日:2012-05-10

    IPC分类号: G01L1/18

    CPC分类号: G01L1/26 G01L1/18

    摘要: A force sensor may include a housing having a cavity enclosing a sense die, an actuating element and an elastomeric seal. The sense die may have a force sensing element for sensing a force applied to a surface of the sense die, and a temperature compensation circuit. The temperature compensation circuit may be located on the surface of the sense die and may be configured to at least partially compensate for the temperature sensitivity of the force sensing element. The actuating element may extend outside the housing and be used to transfer a force applied externally from the housing to the sense die. The elastomeric seal may include one or more conductive elements separated from the edge of the elastomeric seal by an insulating elastomeric material.

    摘要翻译: 力传感器可以包括壳体,该壳体具有封闭感应模具,致动元件和弹性体密封件的空腔。 感测芯片可以具有用于感测施加到感测管芯的表面的力的力感测元件和温度补偿电路。 温度补偿电路可以位于感测管芯的表面上,并且可以被配置为至少部分地补偿力感测元件的温度敏感性。 致动元件可以延伸到壳体外部,并用于将从壳体外部施加的力传递到感测管芯。 弹性体密封件可以包括通过绝缘弹性体材料与弹性体密封件的边缘分离的一个或多个导电元件。

    FLOW-THROUGH PRESSURE SENSOR APPARATUS
    4.
    发明申请
    FLOW-THROUGH PRESSURE SENSOR APPARATUS 有权
    流量传感器设备

    公开(公告)号:US20100206046A1

    公开(公告)日:2010-08-19

    申请号:US12389091

    申请日:2009-02-19

    IPC分类号: G01N19/10 G01L7/00 G01F1/68

    CPC分类号: G01L19/0023

    摘要: A flow-through pressure sensor apparatus that reduces the dead space of a flow tube utilized to provide fluid communication between a pressure sense die and a fluid and with an absolute minimum trapped volume. A cover (e.g., plastic) with two-molded ports can be added to one side of the pressure sense die utilizing molded-in solder pins to improve ruggedness and rigidity. A temperature and a humidity sensor can also be mounted to a substrate (e.g., ceramic) in the flow path and can be connected to a programmable compensation integrated circuit on the opposite side utilizing a clip end of mounting pins or by vias through the substrate outside a pressurized area.

    摘要翻译: 一种流通压力传感器装置,其减少用于在压力感测管芯和流体之间提供流体连通并具有绝对最小捕集体积的流动管的死空间。 具有两个模制端口的盖子(例如塑料)可以使用模制的焊接销添加到压力感测模具的一侧,以改善耐用性和刚度。 温度和湿度传感器也可以安装在流路中的基板(例如陶瓷)上,并且可以使用安装销的夹子端或穿过基板外部的通孔连接到相对侧的可编程补偿集成电路 一个加压区域。

    MEMS airflow sensor die incorporating additional circuitry on the die
    5.
    发明授权
    MEMS airflow sensor die incorporating additional circuitry on the die 有权
    MEMS气流传感器芯片在芯片上结合有额外的电路

    公开(公告)号:US08640552B2

    公开(公告)日:2014-02-04

    申请号:US13226264

    申请日:2011-09-06

    IPC分类号: G01F1/86

    摘要: A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost.

    摘要翻译: 具有与MEMS管芯上的气流传感器集成的加热器控制电路,差分仪表放大器,温度补偿和/或偏移校正电路的MEMS气流传感器管芯。 添加的电路可以放置在具有MEMS制造技术的基本气流模具上可用的空间上,而不需要扩大传感器芯片。 具有附加电路的裸片可能导致具有减小的形状因数,改进的可靠性和更低成本的器件。

    Method and apparatus for increasing the effective resolution of a sensor
    6.
    发明授权
    Method and apparatus for increasing the effective resolution of a sensor 有权
    增加传感器有效分辨率的方法和装置

    公开(公告)号:US08446220B2

    公开(公告)日:2013-05-21

    申请号:US13103913

    申请日:2011-05-09

    IPC分类号: H03F1/00

    摘要: Methods and devices for increasing a sensor resolution are disclosed. In one example, a two measurement process is used. A first measurement is used to effectively measure across a full range (e.g. 0 to 5 VDC) of the sensor. This first measurement may identify the current operating point of the sensor (e.g. 3.5 VDC). A second measurement may then be made to effectively measure across a sub-range of the sensor that encompasses the current operating point of the sensor (e.g. across a sub-range of 3.0 to 4.0 VDC for a current operating point of 3.5 VDC). The gain of the amplifier may be raised during the second measurement to produce a higher resolution measurement. In some cases, the first measurement may be used to determine an appropriate offset that may be applied so as to scale the amplifier to the desired sub-range of sensor that includes the current operating point of the sensor. In some cases, the two measurements may be used together to compute an effectively higher resolution measurement signal. In some cases, this may allow for a smaller and/or cheaper sensor to be used, while still achieving good results.

    摘要翻译: 公开了用于增加传感器分辨率的方法和装置。 在一个示例中,使用两个测量过程。 第一测量用于有效地测量传感器的全范围(例如0至5VDC)。 该第一测量可以识别传感器的当前工作点(例如3.5VDC)。 然后可以进行第二测量以有效地测量包含传感器的当前工作点的传感器的子范围(例如,对于3.5VDC的当前操作点,在3.0至4.0VDC的子范围内)。 放大器的增益可能在第二次测量期间提高,以产生更高分辨率的测量。 在一些情况下,可以使用第一测量来确定可以应用的适当的偏移,以便将放大器缩放到包括传感器的当前工作点的传感器的期望子范围。 在一些情况下,可以一起使用两个测量来计算有效地更高分辨率的测量信号。 在某些情况下,这可能允许使用更小和/或更便宜的传感器,同时仍然获得良好的结果。

    PACKAGED SENSOR WITH MULTIPLE SENSORS ELEMENTS
    7.
    发明申请
    PACKAGED SENSOR WITH MULTIPLE SENSORS ELEMENTS 有权
    包装传感器与多个传感器元件

    公开(公告)号:US20130055821A1

    公开(公告)日:2013-03-07

    申请号:US13226370

    申请日:2011-09-06

    IPC分类号: G01L9/06

    摘要: The present disclose relates to sensor including multiple sensor elements. In some cases, the multiple sensor elements may be mounted on a single substrate and each may be configured to sense a single parameter with different resolutions, sensitivities, and/or ranges, and/or the multiple parameters. In one example, multiple pressure sensing die may be mounted in a single package, and each may be configured as a differential pressure sensor, an absolute pressure sensor, and/or a gauge pressure sensor, as desired.

    摘要翻译: 本公开涉及包括多个传感器元件的传感器。 在一些情况下,多个传感器元件可以安装在单个基板上,并且每个传感器元件可被配置为感测具有不同分辨率,灵敏度和/或范围和/或多个参数的单个参数。 在一个示例中,多个压力感测模具可以安装在单个封装中,并且每个可以根据需要被配置为差压传感器,绝对压力传感器和/或表压传感器。

    Flow sensor assembly with integral bypass channel

    公开(公告)号:US08418549B2

    公开(公告)日:2013-04-16

    申请号:US13018037

    申请日:2011-01-31

    IPC分类号: G01F1/68

    摘要: Flow sensor assemblies having increased flow range capabilities are disclosed. In one illustrative embodiment, a flow sensor assembly includes a housing with an inlet flow port, an outlet flow port, a fluid channel extending between the inlet flow port and the outlet flow port, and a bypass channel having a pair of taps fluidly connected to the fluid channel at separate locations. A flow sensor for sensing a measure related to a flow rate of a fluid flowing through the fluid channel can positioned in the bypass channel. A pressure differential between the two taps of the bypass channel can drive a fraction of a fluid flowing through the fluid channel through the bypass channel. The flow sensor assembly may be configured to achieve, control, and/or balance a desired fraction of fluid flow through the bypass channel and past the flow sensor.

    Increased sensor die adhesion
    10.
    发明授权
    Increased sensor die adhesion 失效
    增加传感器模具附着力

    公开(公告)号:US08375799B2

    公开(公告)日:2013-02-19

    申请号:US12965469

    申请日:2010-12-10

    IPC分类号: G01L9/06

    摘要: Methods and devices for adhesively bonding a sensor die to a substrate are described. In some cases, a sensor assembly may include a pressure sensor die mounted to a substrate with an adhesive. The pressure sensor die may be fabricated to include a back-side having one or more adhesion features (e.g. recesses or indentations), which increase the surface area of the pressure sensor die that is in contact with the adhesive, to thereby increase the adhesion force therebetween. In some cases, the one or more adhesion features may define a non-planar interface between the pressure sensor die and the adhesive which, in some instances, may reduce the formation and/or propagation of cracks in the adhesive, which also may help increase the adhesion force therebetween.

    摘要翻译: 描述了用于将传感器管芯粘合到基底上的方法和装置。 在一些情况下,传感器组件可以包括用粘合剂安装到基底的压力传感器模具。 压力传感器芯片可以被制造成包括具有一个或多个粘合特征(例如凹部或凹陷)的背面,其增加与粘合剂接触的压力传感器模具的表面积,从而增加粘合力 之间。 在一些情况下,一个或多个粘合特征可以限定压力传感器管芯和粘合剂之间的非平面界面,在一些情况下,这可以减少粘合剂中裂纹的形成和/或传播,这也可能有助于增加 其间的粘合力。