公开(公告)号：US08387563B2

公开(公告)日：2013-03-05

申请号：US13372729

申请日：2012-02-14

申请人： Rick Endo ,  Jeremy Cheng ,  Indranil De ,  James Tsung ,  Kurt Weiner ,  Maosheng Zhao

发明人： Rick Endo ,  Jeremy Cheng ,  Indranil De ,  James Tsung ,  Kurt Weiner ,  Maosheng Zhao

IPC分类号： H01L21/31 ,  C23C16/458 ,  C23C16/50 ,  B65H1/00

CPC分类号： H01L21/32051 ,  B01J19/0046 ,  B01J2219/0043 ,  B01J2219/00536 ,  B01J2219/00596 ,  B01J2219/00659 ,  B01J2219/00745 ,  B01J2219/00756 ,  C23C14/042 ,  C23C14/50 ,  C23C14/548 ,  C23C16/45544 ,  H01L21/67005 ,  H01L21/6719

摘要： A combinatorial processing chamber is provided. The combinatorial processing chamber is configured to isolate a radial portion of a rotatable substrate support, which in turn is configured to support a substrate. The chamber includes a plurality of clusters process heads in one embodiment. An insert having a base plate disposed between the substrate support and the process heads defines a confinement region for a deposition process in one embodiment. The base plate has an opening to enable access of the deposition material to the substrate. Through rotation of the substrate and movement of the opening, multiple regions of the substrate are accessible for performing combinatorial processing on a single substrate.

公开(公告)号：US20090061087A1

公开(公告)日：2009-03-05

申请号：US12028643

申请日：2008-02-08

申请人： Rick Endo ,  Kurt Weiner ,  Indranil De ,  James Tsung ,  Maosheng Zhao ,  Jeremy Cheng

发明人： Rick Endo ,  Kurt Weiner ,  Indranil De ,  James Tsung ,  Maosheng Zhao ,  Jeremy Cheng

IPC分类号： C23C16/00

CPC分类号： H01L21/32051 ,  B01J19/0046 ,  B01J2219/0043 ,  B01J2219/00536 ,  B01J2219/00596 ,  B01J2219/00659 ,  B01J2219/00745 ,  B01J2219/00756 ,  C23C14/042 ,  C23C14/50 ,  C23C14/548 ,  C23C16/45544 ,  H01L21/67005 ,  H01L21/6719

摘要： A combinatorial processing chamber is provided. The combinatorial processing chamber is configured to isolate a radial portion of a rotatable substrate support, which in turn is configured to support a substrate. The chamber includes a plurality of clusters process heads in one embodiment. An insert having a base plate disposed between the substrate support and the process heads defines a confinement region for a deposition process in one embodiment. The base plate has an opening to enable access of the deposition material to the substrate. Through rotation of the substrate and movement of the opening, multiple regions of the substrate are accessible for performing combinatorial processing on a single substrate.

公开(公告)号：US08771483B2

公开(公告)日：2014-07-08

申请号：US12027980

申请日：2008-02-07

申请人： Rick Endo ,  Kurt Weiner ,  Indranil De ,  James Tsung ,  Maosheng Zhao ,  Jeremy Cheng

发明人： Rick Endo ,  Kurt Weiner ,  Indranil De ,  James Tsung ,  Maosheng Zhao ,  Jeremy Cheng

IPC分类号： C23C14/00 ,  C23C16/50 ,  C25B11/00 ,  H01L21/306

CPC分类号： H01L21/32051 ,  B01J19/0046 ,  B01J2219/0043 ,  B01J2219/00536 ,  B01J2219/00596 ,  B01J2219/00659 ,  B01J2219/00745 ,  B01J2219/00756 ,  C23C14/042 ,  C23C14/50 ,  C23C14/548 ,  C23C16/45544 ,  H01L21/67005 ,  H01L21/6719

摘要： A combinatorial processing chamber is provided. The combinatorial processing chamber is configured to isolate a radial portion of a rotatable substrate support, which in turn is configured to support a substrate. The chamber includes a plurality of clusters process heads in one embodiment. An insert having a base plate disposed between the substrate support and the process heads defines a confinement region for a deposition process in one embodiment. The base plate has an opening to enable access of the deposition material to the substrate. Through rotation of the substrate and movement of the opening, multiple regions of the substrate are accessible for performing combinatorial processing on a single substrate.

摘要翻译： 提供组合处理室。 组合处理室被配置为隔离可旋转的衬底支撑件的径向部分，该可旋转衬底支撑件又被配置为支撑衬底。 在一个实施例中，腔室包括多个聚集过程头。 在一个实施例中，具有设置在基板支撑件和工艺头之间的基板的插入件限定了用于沉积工艺的约束区域。 基板具有能够将沉积材料接近基板的开口。 通过基板的旋转和开口的移动，基板的多个区域是可访问的，以在单个基板上执行组合处理。

公开(公告)号：US08770143B2

公开(公告)日：2014-07-08

申请号：US13106059

申请日：2011-05-12

申请人： Rick Endo ,  Kurt Weiner ,  Indranil De ,  James Tsung ,  Maosheng Zhao

发明人： Rick Endo ,  Kurt Weiner ,  Indranil De ,  James Tsung ,  Maosheng Zhao

IPC分类号： C23C16/00 ,  C23C16/50 ,  B05B1/28 ,  B05D1/10 ,  B05D1/00 ,  B05D3/00 ,  H05H1/24 ,  C23F1/00 ,  H01L21/306 ,  C25B11/00 ,  B05B15/04 ,  B05B15/12

CPC分类号： C23C16/45565 ,  B05B14/30 ,  B05B16/80 ,  B05D1/10 ,  B05D1/62 ,  C23C16/4412 ,  C23C16/45589 ,  C23C16/4584 ,  C23C16/4585 ,  C23C16/4587 ,  C23C16/50 ,  Y10S438/942

摘要： The various embodiments of the invention provide for relative movement of the substrate and a process head to access the entire wafer in a minimal space to conduct combinatorial processing on various regions of the substrate. The heads enable site isolated processing within the chamber described and method of using the same are described.

摘要翻译： 本发明的各种实施例提供了基板和工艺头在最小空间中访问整个晶片的相对运动，以对基板的各个区域进行组合处理。 这些头使得所描述的室内的现场隔离处理和使用其的方法被描述。

公开(公告)号：US08449678B2

公开(公告)日：2013-05-28

申请号：US12028643

申请日：2008-02-08

申请人： Rick Endo ,  Kurt Weiner ,  Indranil De ,  James Tsung ,  Maosheng Zhao ,  Jeremy Cheng

发明人： Rick Endo ,  Kurt Weiner ,  Indranil De ,  James Tsung ,  Maosheng Zhao ,  Jeremy Cheng

IPC分类号： H01L21/31 ,  C23C16/458 ,  C23C16/50 ,  B65H1/00

CPC分类号： H01L21/32051 ,  B01J19/0046 ,  B01J2219/0043 ,  B01J2219/00536 ,  B01J2219/00596 ,  B01J2219/00659 ,  B01J2219/00745 ,  B01J2219/00756 ,  C23C14/042 ,  C23C14/50 ,  C23C14/548 ,  C23C16/45544 ,  H01L21/67005 ,  H01L21/6719

摘要： A combinatorial processing chamber is provided. The combinatorial processing chamber is configured to isolate a radial portion of a rotatable substrate support, which in turn is configured to support a substrate. The chamber includes a plurality of clusters process heads in one embodiment. An insert having a base plate disposed between the substrate support and the process heads defines a confinement region for a deposition process in one embodiment. The base plate has an opening to enable access of the deposition material to the substrate. Through rotation of the substrate and movement of the opening, multiple regions of the substrate are accessible for performing combinatorial processing on a single substrate.

公开(公告)号：US20110262644A1

公开(公告)日：2011-10-27

申请号：US13169257

申请日：2011-06-27

申请人： Rick Endo ,  Kurt Weiner ,  James Tsung

发明人： Rick Endo ,  Kurt Weiner ,  James Tsung

IPC分类号： C23C16/458 ,  C23C16/00 ,  C23C16/50 ,  C23C16/46 ,  C23C16/44 ,  C23C16/04

CPC分类号： H01L21/67225 ,  C23C16/042 ,  H01L21/6719 ,  H01L21/68742 ,  Y10S206/832

摘要： A structure for independently supporting a wafer and a mask in a processing chamber is provided. The structure includes a set of extensions for supporting the wafer and a set of extensions supporting the mask. The set of extensions for the wafer and the set of extensions for the mask enable independent movement of the wafer and the mask. In one embodiment, the extensions are affixed to an annular ring which is capable of moving in a vertical direction within the processing chamber. A processing chamber, a mask, and a method for combinatorially processing a substrate are also provided.

摘要翻译： 提供了用于在处理室中独立地支撑晶片和掩模的结构。 该结构包括一组用于支撑晶片的延伸部和一组支撑该掩模的延伸部。 用于晶片的一组扩展和用于掩模的一组扩展使得能够独立地移动晶片和掩模。 在一个实施例中，延伸部固定到能够在处理室内沿垂直方向移动的环形环。 还提供了处理室，掩模和用于组合处理衬底的方法。

公开(公告)号：US20090068849A1

公开(公告)日：2009-03-12

申请号：US11965689

申请日：2007-12-27

申请人： Rick Endo ,  Kurt Weiner ,  Indranil De ,  James Tsung ,  Maosheng Zhao

发明人： Rick Endo ,  Kurt Weiner ,  Indranil De ,  James Tsung ,  Maosheng Zhao

IPC分类号： H01L21/31 ,  C23C16/00

CPC分类号： C23C16/45565 ,  B05B14/30 ,  B05B16/80 ,  B05D1/10 ,  B05D1/62 ,  C23C16/4412 ,  C23C16/45589 ,  C23C16/4584 ,  C23C16/4585 ,  C23C16/4587 ,  C23C16/50 ,  Y10S438/942

摘要： The various embodiments of the invention provide for relative movement of the substrate and a process head to access the entire wafer in a minimal space to conduct combinatorial processing on various regions of the substrate. The heads enable site isolated processing within the chamber described and method of using the same are described.

摘要翻译： 本发明的各种实施例提供了基板和工艺头在最小空间中访问整个晶片的相对运动，以在基板的各个区域上进行组合处理。 这些头使得所描述的室内的现场隔离处理和使用其的方法被描述。

公开(公告)号：US08317925B2

公开(公告)日：2012-11-27

申请号：US13169257

申请日：2011-06-27

申请人： Rick Endo ,  Kurt Weiner ,  James Tsung

发明人： Rick Endo ,  Kurt Weiner ,  James Tsung

IPC分类号： C23C16/458 ,  C23C16/00

CPC分类号： H01L21/67225 ,  C23C16/042 ,  H01L21/6719 ,  H01L21/68742 ,  Y10S206/832

摘要： A structure for independently supporting a wafer and a mask in a processing chamber is provided. The structure includes a set of extensions for supporting the wafer and a set of extensions supporting the mask. The set of extensions for the wafer and the set of extensions for the mask enable independent movement of the wafer and the mask. In one embodiment, the extensions are affixed to an annular ring which is capable of moving in a vertical direction within the processing chamber. A processing chamber, a mask, and a method for combinatorially processing a substrate are also provided.

摘要翻译： 提供了用于在处理室中独立地支撑晶片和掩模的结构。 该结构包括一组用于支撑晶片的延伸部和一组支撑该掩模的延伸部。 用于晶片的一组扩展和用于掩模的一组扩展使得能够独立地移动晶片和掩模。 在一个实施例中，延伸部固定到能够在处理室内沿垂直方向移动的环形环。 还提供了处理室，掩模和用于组合处理衬底的方法。

公开(公告)号：US20120142197A1

公开(公告)日：2012-06-07

申请号：US13372729

申请日：2012-02-14

申请人： Rick Endo ,  Kurt Weiner ,  Indranil De ,  James Tsung ,  Maosheng Zhao ,  Jeremy Cheng

发明人： Rick Endo ,  Kurt Weiner ,  Indranil De ,  James Tsung ,  Maosheng Zhao ,  Jeremy Cheng

IPC分类号： H01L21/31 ,  C23C16/458 ,  C23C16/50 ,  B65H1/00

CPC分类号： H01L21/32051 ,  B01J19/0046 ,  B01J2219/0043 ,  B01J2219/00536 ,  B01J2219/00596 ,  B01J2219/00659 ,  B01J2219/00745 ,  B01J2219/00756 ,  C23C14/042 ,  C23C14/50 ,  C23C14/548 ,  C23C16/45544 ,  H01L21/67005 ,  H01L21/6719

摘要： A combinatorial processing chamber is provided. The combinatorial processing chamber is configured to isolate a radial portion of a rotatable substrate support, which in turn is configured to support a substrate. The chamber includes a plurality of clusters process heads in one embodiment. An insert having a base plate disposed between the substrate support and the process heads defines a confinement region for a deposition process in one embodiment. The base plate has an opening to enable access of the deposition material to the substrate. Through rotation of the substrate and movement of the opening, multiple regions of the substrate are accessible for performing combinatorial processing on a single substrate.

公开(公告)号：US08039052B2

公开(公告)日：2011-10-18

申请号：US11965689

申请日：2007-12-27

申请人： Rick Endo ,  Kurt Weiner ,  Indranil De ,  James Tsung ,  Maosheng Zhao

发明人： Rick Endo ,  Kurt Weiner ,  Indranil De ,  James Tsung ,  Maosheng Zhao

IPC分类号： C23C16/00 ,  H05H1/24

CPC分类号： C23C16/45565 ,  B05B14/30 ,  B05B16/80 ,  B05D1/10 ,  B05D1/62 ,  C23C16/4412 ,  C23C16/45589 ,  C23C16/4584 ,  C23C16/4585 ,  C23C16/4587 ,  C23C16/50 ,  Y10S438/942

摘要： The various embodiments of the invention provide for relative movement of the substrate and a process head to access the entire wafer in a minimal space to conduct combinatorial processing on various regions of the substrate. The heads enable site isolated processing within the chamber described and method of using the same are described.

摘要翻译： 本发明的各种实施例提供了基板和工艺头在最小空间中访问整个晶片的相对运动，以在基板的各个区域上进行组合处理。 这些头使得所描述的室内的现场隔离处理和使用其的方法被描述。